CN101746515A

CN101746515A - Winding band device

Info

Publication number: CN101746515A
Application number: CN200910246349A
Authority: CN
Inventors: 南浦清隆; 富泽喜男
Original assignee: Hitachi High Tech Instruments Co Ltd
Current assignee: Hitachi High Tech Instruments Co Ltd
Priority date: 2008-11-28
Filing date: 2009-11-27
Publication date: 2010-06-23
Also published as: JP2010126242A

Abstract

A winding band device. Before the chip parts are filled to each containing groove of a bearing band, adsorbed nozzles are adsorbed and the side surface state of the chip parts with the nozzles in the adsorption maintaining state is checked, the unqualified chip parts are not filled. The solution method includes that a lighting light from coaxial illuminating lamps (61), having half of light amount being reflected by a beam separator (52) and moving upward, irradiates the AA bottom of the adsorbed and filled chip parts in the nozzle adsorption maintaining state, so that the reflection image from the bottom of the chip parts is reflected by the beam separator, and is shot by a zoom lens (68), and a lighting light from a dome illuminating lamp, having a half of light amount transmitted by each inclined surface (66A), uniformly irradiates to the side surface of the chip parts in the same way, so that the reflection image from the side of the chip parts is reflected from the inclined surface downward, and reflected by the beam separator and shot by a lens, the identification processing is performed by an identification processing apparatus according to the image, and the state of each side surface of the chip parts is checked.

Description

Winding band device

Technical field

The present invention relates to utilize pick-up nozzle that chip element is loaded in each accepting groove of carrying band in turn, and with cover tape the peristome osed top winding band device of this accepting groove.

Background technology

This winding band device is for example disclosed by patent documentation 1 etc.And described chip element in each accepting groove of carrying band before the filling, be the state of bottom surface that ozzle adsorbs the chip element of hold mode being adsorbed and check by testing fixture by described pick-up nozzle.

Patent documentation 1: the spy opens the 2003-8287 communique

But the state of chip element side, for example crackle of chip element side (slight crack) etc. is not examined.

Summary of the invention

The objective of the invention is to before chip element is loaded in each accepting groove of carrying band, the side status that is the chip element of ozzle absorption hold mode to being adsorbed ozzle absorption is checked, not load the nonconformity chip element.

For this reason, first invention is to utilize pick-up nozzle chip element to be loaded in turn in each accepting groove of carrying band, and with cover tape in the peristome osed top winding band device of this accepting groove, wherein,

This winding band device is provided with testing fixture, and this testing fixture is before loading described chip element in each accepting groove, and the state of side that is the chip element of ozzle absorption hold mode to being adsorbed by described pick-up nozzle is checked.

Second invention is to utilize pick-up nozzle chip element to be loaded in turn in each accepting groove of carrying band, and with cover tape in the peristome osed top winding band device of this accepting groove, wherein, this winding band device is provided with fixing optical element and Parts Recognition photographic camera, and described fixing optical element is positioned at the position that the side of the chip element that can be ozzle absorption hold mode to being adsorbed by described pick-up nozzle is reflected; Described Parts Recognition photographic camera was photographed to the reflection image from described fixing optical element before described chip element is loaded in each accepting groove.

The 3rd invention is in second invention, and wherein, described Parts Recognition photographic camera is to photographing simultaneously from four offside reflection pictures adjacent with the right angle of the described chip element of described fixing optical element.

The present invention is before loading chip element in each accepting groove of carrying band, the side status that is the chip element of ozzle absorption hold mode to being adsorbed ozzle absorption is checked, can not load the nonconformity chip element.

Description of drawings

Fig. 1 is the birds-eye view of winding band device;

Fig. 2 is the front view of winding band device;

Fig. 3 is the right side view of winding band device;

Fig. 4 is the longitudinal section that transports guide rail;

Fig. 5 is the front view of the side testing fixture of local vertical profile;

Fig. 6 is to be ancient Lobito lens the center A-A cutaway view of having represented all around four lateral plans, birds-eye view with the birds-eye view and the figure of identical B-B cutaway view;

Fig. 7 is that explanation inspection is adsorbed the figure that moves when filling nozzle adsorbs the chip element side that keeps;

Fig. 8 is that the figure with the image of photographic camera is checked in the expression side;

Fig. 9 is the figure that is checked the image of using camera shooting by the side of the big detection of defects example of expression;

Figure 10 is that routine histogrammic figure is checked in expression;

Figure 11 is being checked with the image of camera shooting and the figure of expansion plans picture by the side of the little detection of defects example of expression.

Nomenclature

1 winding band device body 3 is accommodated band 3A carrying band 3B accepting groove

9 reel accommodates spool 38 absorption filling nozzles 60 in-line illumination device

62 beam splitters, 63 dome illumination equipments, 66 ancient Lobito lens

66B hollow bulb 69 sides, 66A dip plane are checked and are used photographic camera

The specific embodiment

Below, on one side illustrate on one side with reference to accompanying drawing and to utilize pick-up nozzle that chip element is loaded in each accepting groove of carrying band in turn, and with cover tape the embodiment of the peristome osed top winding band device of this accepting groove.At first, the right side view according to the identical front view of birds-eye view, Fig. 2 of Fig. 1 winding band device, Fig. 3 illustrates winding band device.

Carrying band supply spool 2 only can block the side wall portion at winding band device body 1 rotatably, carrying band 3A is given the tension force of appropriateness, by this carrying band (band body) 3A front end of these supply spool 2 packages, via be used for belt wheel 4A to 4D, send sprocket wheel 5,5 to and have the guide rail 7 that transports that carrying band 3A etc. transports the road and be fixed on coiling and accommodate spool 9.

Consistent with the rotation of sending sprocket wheel 5,5 to and carrying band 3A during specified amount transports in turn, in the accepting groove 3B of carrying band 3A, insert chip element AA, and before being transported to assigned position, the peristome above the accepting groove 3B is covered by the cover tape 3C that supplies with from cover tape supply spool 20, accommodate spool 9 to coiling and reel.

As mentioned above, be provided with the carrying band 3A of accepting groove 3B by having predetermined distance and hot melt applies above it cover tape 3C and form to accommodate and be with 3, and send the tooth of sprocket wheel 5,5 and as prescribed to and offer at interval that to transport the hole chimeric and can transport.

The adapter plate 21 that is fixed in winding band device body 1 is provided with and utilizes y-axis motor 22 and be directed to device 23 guiding and the Y bench board 24 that moves to the Y direction, this Y bench board 24 is provided with and utilizes X-axis motor 25 and be directed to device 26 guiding and to the X bench board 27 that directions X moves, and is fixing to be provided with the adapter plate 19 of sending sprocket wheel 5,5 to and transporting guide rail 7 etc. on this X bench board 27.Therefore, X bench board 27 and Y bench board 24 move by the driving of X-axis motor 25 and y-axis motor 22, thus, transport guide rail 7 via adapter plate 19 and transport carrying band 3A that guide rail 7 moves etc. along this and just can move to the XY direction.

And winding band device body 1 is provided with: utilize y-axis motor 30 and the Y bench board 31 that can move to the Y direction, and the X moving body 33 that on this Y bench board 31, can move to directions X via utilizing X-axis motor 32 and component delivery bench board 34 is set.Be fixed with one by one small pieces (below be called " chip element AA ") on this supply bench board 34, it is with pasting wafer cutting in blocks and divided state and be that the face with ball electrode A B is fixed as top state, ejects from the negative to be adsorbed and takes out ozzle 36 and adsorb and be removed while this chip element AA is ejected pin.

Be provided with at the upper mounting plate 35 that is fixed in described winding band device body 1: first rotating disc 37, it utilizes index cam unit 40 and intermittently rotation, and peripheral edge portion have predetermined distance ground for example dispose eight from component delivery bench board 34 the absorption taking-up ozzles 36 of chip element AA taking-up; Second rotating disc 39, it utilizes index unit 41 and intermittently rotation, and has predetermined distance ground at peripheral edge portion and for example dispose eight absorption filling nozzles 38 that as shown in Figure 4 chip element AA loaded to the accepting groove 3B that is arranged at carrying band 3A.

And the radius of rotation of first and second rotating

discs

37,39 is identical, the rotation indexing accuracy is identical, though be each spinning via

index unit

40,41, each

ozzle

36,38 that can make two

rotating discs

37,39 is corresponding and join chip element AA reliably.

Peripheral edge portion at first rotating disc 37 has a plurality of absorption taking-up of predetermined distance ground configuration ozzle 36, and each absorption is taken out ozzle 36 and is configured to utilize each turning device (not shown) to spin upside down, and can be driven and lifting by the Z spindle motor.

Peripheral edge portion at second rotating disc 39 has a plurality of absorption filling nozzles 38 of predetermined distance ground configuration, absorption filling nozzle 38 is configured to utilize each slewing arrangement (comprising the θ axis drive motor) and is the center rotation with the shaft core direction, and can be driven and lifting by the Z spindle motor.

Among Fig. 1, the station that first rotating disc 37 is positioned at 12 positions is that absorption taking-up ozzle 36 takes out station from the absorption of component delivery bench board 34 absorption chip element AA and taking-up, in the rotation of first rotating disc 37 is moved, the chip element AA that should be taken out by the next one on 73 pairs of component delivery bench board 34 of Parts Recognition photographic camera photographs and processing is discerned by recognition process unit in the position of this chip element AA, control setup drives y-axis motor 30 and X-axis motor 32 and component delivery bench board 34 is moved, so that this chip element AA that should be removed be positioned at the absorption that moves past take out ozzle 36 under the position, take out station in this absorption, absorption filling nozzle 38 descends and the absorption of the chip element AA on the component delivery bench board 34 is taken out.

Then, intermittently to rotate the station that once stops to anticlockwise direction be to utilize turning device to take out the upset station that chip element AA that ozzle 36 keeping spins upside down being adsorbed, and the station of following is to be photographed by the Parts Recognition photographic camera in this chip element AA position of having overturn and discerned the identification station of processing by recognition process unit.

Station then be being reversed the device upset the lettering face as top, the face with ball electrode A B as following chip element AA on the utilization printing device that can on XY direction and Z direction, move come the lettering station of lettering, according at the recognition result of described identification station to chip element AA position, under the state that from first rotating disc 37 rotation of described identification station is moved, the XY direction has been carried out proofreading and correct, the printing device that the control setup utilization descends at the lettering station of following serial number etc. to chip element AA lettering.Curing station then is that the ink by the printing device lettering is utilized the station of hot air apparatus by heated-air drying.

Absorption is taken out station as number one, then first rotating disc 37 is exactly to join station to No. six of anticlockwise direction rotation, and absorption filling nozzle 38 handing-over of the chip element AA of ozzle 36 to second rotating disc 39 are taken out in the absorption that has been spun upside down.In other words be exactly two rotating

discs

37,39 are configured in following mode, promptly, accept at the station of accepting to right handed second rotating disc 39, to the rotation of clockwise direction second rotating disc 39 accept station as number one, then at the filling station of No. six and No. seven and recover to make in the filling station adsorb filling nozzle 38 be positioned at accommodate with 3 carrying band 3A above.

Promptly, dispose second rotating disc 39, so that two absorption filling nozzles 38 are positioned at the carrying band 3A top of accommodating with 3, because two rotating discs the 37, the 39th divide eight intermittently rotations, so linking second rotating disc, 39 centers and the line of absorption filling nozzle 38 in the described filling station is 67.5 degree with walking line angulation with 3, the handing-over station of first rotating disc 37 and second rotating disc 39 take over station stagger 22.5 the degree, make take over the configuration two rotating

discs

37,39.

The Next next station that this second rotating disc 39 is taken over station is to carry out first of chip element characteristic check by the characteristic check device to check station, for example check the chip element value of current flowing, whether within the limits prescribed check its current value, if not in specialized range then control setup control to the 3A filling of carrying band and do not accommodate in the pallet of special use.

The next station of this first inspection station is to carry out the second inspection station that chip element AA side status is checked (side exterior check) by the side testing fixture, for example when crackle (slight crack) waited, then control setup control was not loaded and is not accommodated in the pallet of special use to carrying band 3A in arbitrary side of checking chip element AA by this side described later testing fixture.

At the identification station of following filling fittings identification photographic camera is set, by this filling fittings identification photographic camera the chip element AA that is adsorbed filling nozzle 38 absorption and is keeping is photographed, and discern the position of the relative ozzle of this chip element AA, and carry out exterior check (whether ball electrode A B is specified quantity etc.) by recognition process unit.When being thought the nonconformity chip element by this exterior check, then control setup control is not accommodated in the pallet of special use to the 3A filling of carrying band.

Be provided for discerning the loading position identification photographic camera 94 of the accepting groove 3B position of the carrying band 3A that transports on the guide rail 7 at the filling station of following, in the rotation of second rotating disc 39 is moved, the accepting groove 3B that should be loaded is photographed, carry out location recognition by recognition process unit.

Therefore, after photographing to chip element AA, by loading position 94 couples of accepting groove 3B of identification photographic camera by described filling fittings identification photographic camera, the identification that is adsorbed the chip element AA position of filling nozzle 38 adsorbed maintenances by recognition process unit handles and the identification of this accepting groove 3B position is handled, and then carries out following control according to its result: for the correction control of the y-axis motor 22 of XY direction and X-axis motor 25, for the θ direction is the correction control of the θ spindle motor of angle in the in-plane.Therefore, the absorption filling nozzle 38 that suitable position descends in accepting groove 3B by the driving that utilizes the Z spindle motor can load chip element AA.

And at the recovery filling station of following lettering is set and checks photographic camera 95, chip element AA to the accepting groove 3B that is positioned at this station in the rotation of second rotating disc 39 is moved photographs, discern processing by recognition process unit, check the direction that has or not lettering and lettering with the chip element AA of 3 fillings to accommodating.

When the recognition result that is identified processing equipment is judged as control when bad, then be controlled to: the absorption filling nozzle 38 of finishing filling at the filling station takes out chip element AA from the accepting groove 3B that is positioned at this recovery filling station, and the absorption filling nozzle of at this moment wanting to load at the filling station 38 is not loaded and standby.Under this state, control setup carries out following control: carrying band 3A is not moved, make the second intermittently rotation of rotating disc 39, the chip element AA that empty accepting groove 3B filling is kept by next one absorption filling nozzle 38 to being removed as previously mentioned accommodates the nonconformity chip element at its next station in the not shown purpose-made pallet that can XY moves.

After utilizing the part filling mechanism that chip element AA is inserted in the accepting groove 3B of carrying band 3A, utilize compression joint mechanism 96 that carrying band 3A and cover tape 3C are carried out crimping and carry out hot melt and apply, accommodate spool 9 to coiling then and reel.

From left sprocket wheel 5 towards make between the belt wheel 4B accommodate be positioned at 3 carrying band 3A above, and make cover tape 3C be positioned at the below.Therefore, be with 3 to accommodate before spool 9 reels chip element AA being loaded in this accepting groove 3B and the peristome osed top of described accepting groove 3B is accommodated to coiling with cover tape 3C, accommodate and be with 3 roughly to be horizontality, cross and make the chip element AA state that is loaded be positioned at the cover tape 3C of downside and testing fixture 59 is checked from the below, in filling in accepting groove 3B but be in the state of the chip element AA on the cover tape 3C, when for example not having chip element or chip element AA that damaged and scar etc. is arranged in the accepting groove 3B, winding band device is shut down.

At this, for checking that second the side testing fixture of station configuration is at following detailed description.Shown in Figure 5 60 is in-line illumination device, comprising: be configured in the coaxial-illuminating lamp 61 of bottom in the casing and be configured in the beam splitter 62 of these coaxial-illuminating lamp 61 tops.The 63rd, the dome illumination equipment, profile presents bowl-shape, is formed with opening 64 in bottom central part, except this opening 64 and in inner face integral body a plurality of dome illuminating lamps 65 are set.

The 66th, ancient Lobito lens (ancient Lobito (ケロ PVC Star ケ) is a trade mark) are that four sides that are in the chip element AA (overlook and see the sheet body that presents square shape) that is adsorbed filling nozzle 38 absorption hold modes are positioned at the fixing optical element of the position of reflection downwards.Shown in Figure 6 as what be the center A-A cutaway view of having represented all around four lateral plans, birds-eye view with the birds-eye view with identical B-B cutaway view, ancient Lobito lens 66 are that four lamellar lens that are formed with the dip plane 66A that reduces (45 degree) are laterally at an upper portion thereof fitted and formed to same direction in turn, and form hollow bulb 66B at central portion.These Gu Lobito lens 66 equate the optics optical path length of each side, are the lens of focusing simultaneously.

The 69th, the side is checked and is used photographic camera, by half light quantity of beam splitter 62 transmissions, the illumination light from coaxial-illuminating lamp 61 that reflects half light quantity and upwards advance is shone to the chip element AA bottom surface that is adsorbed filling nozzle 38 absorption hold modes, reflection image from chip element AA bottom surface is reflected by beam splitter 62, and check with photographic camera 69 photographies by the side via zoom lens 68, and from the illumination light of dome illuminating lamp 65 similarly to the side of chip element AA uniform irradiation, reflection image from each side of chip element AA is reflected downwards by dip plane 66A, and reflected by beam splitter 62 and check with photographic camera 69 by the side via lens 68 and to photograph simultaneously.

Left part as Fig. 7 is represented, the chip element AA that is begun the absorption filling nozzle 38 adsorbed hold modes that descend is by the opening of pressing plate 70 before entering in the hollow bulb 66B of ancient Lobito lens 66, make coaxial-illuminating lamp 61 bright lamps, transmission the illumination light of half amount of beam splitter 62 to the chip element AA bottom surface irradiation that is adsorbed filling nozzle 38 adsorbed hold modes, photograph checking with photographic camera 69 by the side by beam splitter 62 reflections and via lens 68 from the reflection image of chip element AA bottom surface.

This image is discerned processing by recognition process unit, not parallel and under the bevelled situation at each side of chip element AA and cooresponding ancient Lobito lens 66 medial surfaces, between absorption filling nozzle 38 decrement phases, parallel with cooresponding ancient Lobito lens 66 medial surfaces for each side that makes chip element AA, and the θ axis drive motor of control setup control slewing arrangement is proofreaied and correct its angle to the position shown in the left and right sides pars intermedia of Fig. 7.Afterwards, the position is checked in the side that makes absorption filling nozzle 38 drop to chip element AA, at this moment, and formed abutting part 38A and touching above the pressing plate 70 on absorption filling nozzle 38.

At this moment, after touching at abutting part 38A and above the pressing plate 70, even will descending, absorption filling nozzle 38 also absorbed by spring 38B, therefore, descending, it is motionless to be limited, the position that the abutting part 38A of this Fig. 7 right part and pressing plate 70 touch is above checked the position exactly, is the interior position of hollow bulb 66B that chip element AA enters into ancient Lobito lens 66 fully.As mentioned above, because the slippage of absorption filling nozzle 38 does not also need strict control,, not the yet passable of high price so the Z spindle motor that is used for this decline just needn't high like that precision.Do not have residual vibration, after chip element AA decline stops, not needing to obtain by the time the wait time of image.

And check in the position at this, by half light quantity of beam splitter 62 transmissions, the illumination light from coaxial-illuminating lamp 61 that reflects half light quantity and upwards advance is shone to the chip element AA bottom surface that is adsorbed filling nozzle 38 absorption hold modes, reflection image from chip element AA bottom surface is reflected by beam splitter 62, and check with photographic camera 69 photographies by the side via zoom lens 68, simultaneously from the illumination light of dome illuminating lamp 65 similarly to the side of chip element AA uniform irradiation, reflection image from each side of chip element AA is reflected downwards by dip plane 66A, and reflected by beam splitter 62 and check with photographic camera 69 by the side via lens 68 and to photograph simultaneously.

As shown in Figure 8, to be represented as in each zone of being divided by ancient Lobito lens 66 knit lines that ground plan with chip element AA looks like be four sides at center to this image.At this, the establishing method of scope of examination below is described, the above-below direction of at first described absorption filling nozzle 38 is positioned, and the bottom surface of chip element AA is to the position that the direction of arrow shown in Fig. 8 dotted line moves according to the absorption position deviation.Chip element AA is to utilize the ground plan of Fig. 8 central portion chip element AA to look like to carry out in the position deviation measurement of XY direction, and the left and right side is to be the setting of carrying out scope of examination according to the position deviation data of directions X according to the position deviation data of Y direction, front and back sides.

The inspection of ball electrode A B is described, in the image of four sides, because ball electrode A B in the bottom surface is four, so for example in the right hand view picture or left surface image of chip element AA, two ball electrode A B in right side or left side and two ball electrode A B on left side or right side are overlapping, and in the leading flank image or trailing flank image of chip element AA, two ball electrode A B of front side or rear side and two ball electrode A B of rear side or front side are overlapping.Therefore, when described side being checked the image of being photographed with photographic camera 69 is discerned processing by recognition process unit, the height of the highest ball electrode A B can detect by enough ball electrodes neighboring method of inspection.

At this, the inspection of four sides of chip element AA is described, it is in the square inspection area scope except ball electrode A B that this side is checked, has checked N/D, scar, crackle, defective part such as dirty by big detection of defects and little detection of defects.Big detection of defects at first is described, in above-mentioned square inspection area if prescribed concentration scope (concentration ranges during certified products) concentration in addition is that given size is when above, for example the area of white defective part is regulation when above as shown in Figure 9, then according to the identification result of recognition process unit and control setup judges it is off gauge (with reference to the concentration of expression from 0 to 255 gray level and Figure 10 of pixel count relation).

Little detection of defects then is described, the horizontal line that is produced during owing to cut crystal enters chip element AA, so need difference defective part and horizontal line (ignoring horizontal line).The horizontal line that is produced when (scar, crackle, dirty etc.) is with cutting because the defective part that chip element AA extends to horizontal direction is difficult to difference, so be the marginal check of carrying out the defective part that the defective of extending to vertical direction promptly intersects with described horizontal line substantially.When carrying out this marginal check, according to making the expansion plans picture (figure on Figure 11 right side) that white composition expands carry out little detection of defects in photographs (figure in Figure 11 left side) the black and white composition.

As mentioned above, check the state of checking the chip element side in the station by the side testing fixture second, when above-mentioned defective part was checked out in arbitrary side of chip element AA, then control setup control was not accommodated in the pallet of special use to the 3A filling of carrying band.

Therefore, the side of the chip element AA that do not carry out of institute is checked before can carrying out, and can prevent that the off gauge that the side is possessed defective part from loading to carrying band 3A.

Embodiments of the invention have been described more than, but according to above-mentioned explanation various replacements examples can have been arranged for occurrences in human life in the industry, revise or distortion that the present invention comprises above-mentioned various replacement examples, revises or is out of shape in the scope that does not break away from its purport.

Claims

1. a winding band device utilizes pick-up nozzle that chip element is loaded in each accepting groove of carrying band in turn, and with cover tape the peristome of this accepting groove is sealed, it is characterized in that,

2. a winding band device utilizes pick-up nozzle that chip element is loaded in each accepting groove of carrying band in turn, and with cover tape the peristome of this accepting groove is sealed, it is characterized in that,

This winding band device is provided with fixing optical element and Parts Recognition photographic camera, and described fixing optical element is positioned at the position that the side of the chip element that can be ozzle absorption hold mode to being adsorbed by described pick-up nozzle is reflected; Described Parts Recognition photographic camera was photographed to the reflection image from described fixing optical element before described chip element is loaded in each accepting groove.

3. winding band device as claimed in claim 2 is characterized in that, described Parts Recognition photographic camera is to photographing simultaneously from four offside reflection pictures adjacent with the right angle of the described chip element of described fixing optical element.