CN101620039A - Sample positioning template of precision cutting machine table - Google Patents
Sample positioning template of precision cutting machine table Download PDFInfo
- Publication number
- CN101620039A CN101620039A CN200810039988A CN200810039988A CN101620039A CN 101620039 A CN101620039 A CN 101620039A CN 200810039988 A CN200810039988 A CN 200810039988A CN 200810039988 A CN200810039988 A CN 200810039988A CN 101620039 A CN101620039 A CN 101620039A
- Authority
- CN
- China
- Prior art keywords
- sample
- positioning template
- wafer
- sample positioning
- machine table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a sample positioning template of a precision cutting machine table. In the manufacturing process of a semiconductor, a specific zone needs to be cut out on a wafer base by a precision cutting machine table for detection. The cutting needs correctly positioning a cutting position. At present, the common method is to manually position a target zone by observation of a skillful engineer to cut. But the error rate is high by manually positioning to cut off a zone for a 45-degree crystal lattice product, because the cutting direction and a scribing slot of the wafer base form an inclined angle of 45 degrees. The sample positioning template can conveniently and correctly add a sampling auxiliary line on a sample, and an operator of the precision cutting machine table can correctly cut the sample according to the sampling auxiliary line.
Description
Technical field
The present invention relates to a kind of sample positioning template that is used for precision cutting machine table, be specifically related to a kind of spending on the lattice products and all can finish pinpoint sample positioning template at 0 degree and 45.
Background technology
The base material of semiconductor material is a silicon wafer, and its principal ingredient is by SiO
2(silicon dioxide) through purifying, the crystal silicon crystallization of melting, being refined after distillation and a series of decomposition, and then crystal silicon pulled into the different silicon crystal bar of diameter.Wafer factory through after grinding, polishing and cutting into slices, just becomes wafer with silicon crystal bar.In the process of making semiconductor devices, wafer is divided into many lattices by crisscross scribe line, all forms independently integrated circuit (IC) chip in each lattice.
In the semiconductor fabrication process product is carried out fault analysis test and need cut out a specific zone usually detect on wafer, described cutting is finished with precision cutting machine table, and this cutting at first needs to orient cutting position.Method commonly used at present is by observing manual telltale mark to be made in the target area by the slip-stick artist who is skilled in technique, because the device architecture of each unit all is the same on the wafer, therefore in whole wafer, orient relatively difficulty of target area rapidly and accurately.
Silicon crystal itself has specific atomic structure, promptly so-called diamond structures, and it is by two groups of centroid structures (FCC), and at a distance of (1/4,1/4,1/4) grating constant (lattice constant), promptly the cubic lattice length of side is formed by stacking.Go out such as { 100}, { 111}, { crystal face such as 110} according to Miller pointer method (Miller index) definable.So wafer also therefore has { 100}, { the 111}, { differentiation of 110} etc.Wafer commonly used generally is divided into 0 degree lattice product and 45 degree lattice products, for 0 degree lattice product, and the edge of cutting zone or quadrature parallel with the scribe line of wafer, cutting zone just can be than being easier to the location by manual type; But for 45 degree lattice products, because the scribe line of cut direction and wafer becomes miter angle, it is very high still the probability of error to occur by artificial location cutting zone in this case.
Usually operating personnel should just can carry out the cutting zone location through long training, and even be skilled in technique the personage, the error of the sum of errors of location also happens occasionally.If the location error causes the sampling failure, analysis cost will be increased greatly.
Summary of the invention
At the sample process complexity of producing precision cutting machine table at present, and the sum of errors fault rate is higher, and the problem that causes analysis cost to increase proposes the present invention.
The invention provides a kind of sample positioning template that is used for precision cutting machine table, can on sample, orient cutting zone rapidly and accurately with this template.Usually can be applied to the specimen preparation of integrated circuit device structure failure analysis, the non-productive operation personnel prepare the sample that scanning electron microscope (SEM) can observing cross sections with precision cutting machine table
The sample positioning template that is used for precision cutting machine table provided by the invention is made of transparent material usually, the sample positioning template that this transparent material constitutes includes the sample well of engraved structure, with a plurality of mark windows that are used for the engraved structure of a definite rectangle, the determined rectangle of described a plurality of mark windows is the center with described sample well, its both sides and horizontal direction parallel, both sides are vertical with horizontal direction; Described sample positioning template also comprises first Auxiliary Marking and second Auxiliary Marking, and this first Auxiliary Marking comprises the lines vertical with horizontal direction, and with the lines of horizontal direction parallel; This second Auxiliary Marking comprises the lines from the horizontal by 45.
In the said structure, sample well is used to aim at the specific markers of sample surfaces, thereby specific region on the sample is positioned.The mark window be used for specific region on the sample obtained the location after, by instruments such as for example marker pens in the enterprising row labels of sample.First Auxiliary Marking and second Auxiliary Marking are used for assisting location to specific region on the sample by aiming at scribe line on the semiconductor crystal wafer.
Different demands when making sample in order to adapt to precision cutting machine table processing wafer, for example thick cutter is cut, and outside above-mentioned sample well, can form the sample well that the thick cutter of adaptation is cut in the both sides of its horizontal direction or the both sides of vertical direction outside original sample well.
In addition, described sample positioning template can also have the 3rd Auxiliary Marking, and the 3rd Auxiliary Marking is the right-angled intersection pattern that is vertically intersected on described sample well place, is used for the non-productive operation personnel and locatees specific region on the sample better.
In order to reach location more quickly and accurately, on the described sample positioning template aid mark window can be set, described aid mark window is the engraved structure of vertical strip, is positioned at the both sides of the determined rectangle of former underlined window.
When utilizing sample locating module of the present invention that sample is positioned, operating personnel need find the target area of sample wafer sheet under optical microscope, for example, the chip unit with defective is made mark with for example instrument of marker pen thereon.Can mark the cutting zone of precision cutting machine table with sample locating module of the present invention on wafer according to described mark then, the operating personnel of auxiliary precision cutting machine table finish cutting sampling to described wafer with precision cutting machine table.
At first sample positioning template is placed on the sample wafer sheet, aim at above-mentioned at the mark of on the wafer target area, being done under the optical microscope with the sample well of sample locating module.
As previously mentioned, have first Auxiliary Marking and second Auxiliary Marking on the sample locating module, they constitute the Auxiliary Marking of horizontal direction and the Auxiliary Marking of 45 degree directions respectively.When the sample wafer sheet is 0 degree lattice product, first Auxiliary Marking of the gentle vertical direction of water is auxiliary adjusts the cutting zone position that sample positioning template is determined on the sample wafer sheet, method is that first Auxiliary Marking that makes this level and vertical direction parallels with scribe line on the wafer separately; When the sample wafer sheet is 45 degree lattice products, adjust the cutting zone position that sample positioning templates are determined with second Auxiliary Markings of 45 degree directions are auxiliary on the sample wafer sheet, method is second Auxiliary Marking of this 45 degree direction to be paralleled or vertical with scribe line on the wafer.Then, mark the sampling boost line with the mark window of marker pen by the hollow out on the sample positioning template at sample surfaces, and marking sampling boost line (if the situation of aid mark window is arranged) at sample surfaces with the aid mark window of marker pen by hollow out, the operating personnel of last precision cutting machine table can cut out the target area of sample easily under the help of this boost line of taking a sample.
The invention has the advantages that, have two groups of Auxiliary Markings on the described sample positioning template at least, i.e. first Auxiliary Marking and second Auxiliary Marking, it can distinguish the scribe line on the wafer of corresponding 0 degree lattice and 45 degree lattices, when operating personnel take a sample to wafer, no matter be the product of which kind of lattice types, can choose the scribe line alignment in above-mentioned two groups of square pattern a group and the wafer as required, define resample area by the mark window on the locating template with marker pen again, the whole operation process is simple and efficient, and the situation of slipping up of can avoiding taking a sample takes place.
For be more readily understood purpose of the present invention, feature with and advantage, below conjunction with figs. and embodiment are described in detail the present invention.
Description of drawings
The a plurality of accompanying drawings that comprise in the application's book demonstrate a plurality of embodiment of the present invention, the accompanying drawing that comprises among the application is a component part of instructions, accompanying drawing and instructions and claims one are used from explanation flesh and blood of the present invention, are used for understanding better the present invention.
Same or analogous component part is indicated with identical reference number in the accompanying drawing.
Fig. 1 is the sample positioning template synoptic diagram that is used for the auxiliary sampling of precision cutting machine table of an embodiment of the present invention;
Fig. 2 is the sample positioning template synoptic diagram that is used for the auxiliary sampling of precision cutting machine table of a preferred embodiment of the invention;
Fig. 3 is the sample positioning template synoptic diagram that is used for the auxiliary sampling of precision cutting machine table of another preferred implementation of the present invention;
Fig. 4 is the present invention's sample positioning template 1 shown in Figure 3 " under optical microscope, be used for the synoptic diagram of cutting zone of the wafer of auxiliary positioning 45 degree lattices; With
Fig. 5 a～5c spends in the sample wafer sheet sampling process of lattices the variation synoptic diagram of sample wafer sheet to 45 for using precision cutting machine table under sample locating module of the present invention is auxiliary.
Embodiment
In order to understand technical scheme provided by the present invention better, be described further below in conjunction with specific embodiments of the invention, but it does not limit the present invention.
Below introduce the basic design scheme of precision cutting machine table sample locating module of the present invention in detail:
Figure 1 shows that the sample positioning template synoptic diagram that is used for the auxiliary sampling of precision cutting machine table of an embodiment of the present invention, the sample positioning template that is used for precision cutting machine table of the present invention generally is made of transparent material, as shown in the figure, the sample positioning template 1 of this transparent material formation comprises
The sample well 101 of engraved structure, when sample positioning template 1 fitted in sample wafer sheet surface, this sample well 101 was used to aim at the specific markers on the sample wafer sheet.Though should be noted that the scheme that adopts the sample well of engraved structure at this, in the present invention, this sample well 101 can be the pattern form that is formed on the transparent material equally, can be used to aim at the specific markers on the sample wafer sheet equally.
A plurality of mark windows 102 that are used for the engraved structure of a definite rectangle, described a plurality of mark window 102 determined rectangles are the center with described sample well 101, its both sides and horizontal direction parallel, both sides are vertical with horizontal direction; In fact, the effect of these mark windows 102 is to determine a size and the consistent rectangle of the required sample size of producing of precision cutting machine table, for example, these mark windows can be four angles of illustrated formation rectangular patterns, fit in when sample positioning template 1 on the surface of sample wafer sheet, and when having aimed at specific markers on it by sample well 101, can on this wafer, mark four angles of rectangular patterns by the engraved structure of mark window 102 with marker pen, it is the center with above-mentioned specific markers, and the rectangle that these four angles are determined is the sample area that precision cutting machine table need cut.It should be noted that, in this signal only is a kind of preferred mark window form of expression, can determine under the prerequisite of the above-mentioned rectangular patterns that is used for determining cutting zone guaranteeing this mark window, various variations can also be arranged, for example, can on every limit of described rectangular patterns, be taken to few 2 windows that serve as a mark, the rectangular area that is identified for cutting.
On the basis of said structure, described sample positioning template 1 also comprises:
First Auxiliary Marking 103, this first Auxiliary Marking 103 is the rectangular patterns of horizontal direction, its both sides and horizontal direction parallel, both sides are vertical with horizontal direction; And second Auxiliary Marking 104, this second Auxiliary Marking 104 is the rectangular patterns from the horizontal by 45, the angle of its each limit and horizontal direction is 45.
As previously mentioned, wafer commonly used generally is divided into 0 degree lattice product and 45 degree lattice products, it will be understood by those skilled in the art that precision cutting machine table is decided by the lattice direction of the wafer that is cut for the cut direction of wafer.For 0 degree lattice product, the zone that on precision cutting machine table, need cut to wafer, the edge that is above-mentioned rectangle cutting zone is parallel or quadrature with the scribe line of wafer, but for 45 degree lattice products, the scribe line of cut direction and wafer becomes miter angle.
First Auxiliary Marking 103 on the sample positioning template 1 provided by the invention and second Auxiliary Marking 104 are just in order to be applied to the wafer of 0 degree lattice product and 45 degree lattice products respectively accordingly.Particularly, if the wafer to 0 degree lattice product is taken a sample, fit at sample positioning template 1 on the surface of sample wafer sheet, and when having aimed at specific markers on it by sample well 101, each limit that can make the rectangular patterns shown in first Auxiliary Marking 103 respectively with wafer on scribe line coincide or parallel, and guarantee that the cut direction of mark window 102 determined rectangle cutting zones and the wafer of 0 degree lattice product adapt.If the wafer to 45 degree lattice products is taken a sample, fit at sample positioning template 1 on the surface of sample wafer sheet, and when having aimed at specific markers on it by sample well 101, each limit that can make the rectangular patterns shown in second Auxiliary Marking 104 respectively with wafer on scribe line coincide or parallel, and guarantee that the cut direction of mark window 102 determined rectangle cutting zones and the wafers of 45 degree lattice products adapt.
First Auxiliary Marking 103 from the above description and the effect of second Auxiliary Marking 104 can be understood, the design main points of this first Auxiliary Marking 103 and second Auxiliary Marking 104 are, the former comprises the graticule of level and/or vertical direction, the latter comprises that the angle with horizontal direction is the graticule of 45, and second Auxiliary Marking can be understood as first Auxiliary Marking and rotates 45 and get on the plane of this sample positioning template 1 in fact.Therefore, first Auxiliary Marking 103 that adopts in the sample positioning template of the present invention and the not non-form that is confined to constitute rectangle of second Auxiliary Marking 104, this first Auxiliary Marking 103 comprises the lines vertical with horizontal direction in fact, and with the lines of horizontal direction parallel; This second Auxiliary Marking 104 comprises from the horizontal by the lines of 45 and getting final product.
Preferably, described first Auxiliary Marking 103 and second Auxiliary Marking 104 constitute a rectangular patterns separately; More preferably, described first Auxiliary Marking 103 and second Auxiliary Marking 104 constitute square pattern separately.
Owing to the cutting zones of being determined by mark window 102 on the sample positioning template 1 are that cut lengths according to predetermined precision cutting machine table design, for example, the common specification of being determined by mark window 102 on this sample positioning template of cutting zone is, long 20 ± 2mm, wide 10 ± 1mm, this size is precision cutting machine table size commonly used when producing the wafer sample.Therefore, in case on wafer, determine specific markers, promptly under optical microscope with marker pen drawn mark, just can need not to determine cutting zone by visual inspection again by on wafer, directly the draw cutting zone of precision cutting machine table of sample locating module 1.
More than described the basic scheme of sample positioning template provided by the invention, on this basis, based on preferred implementation of the present invention, described sample positioning template can also have further improvement.
Generally speaking, precision cutting machine table has two kinds of patterns of producing sample: comprise that thick cutter is cut and thin cutter is cut.Carrying out that thick cutter is cut and thin cutter when cutting, division for resample area on the sample wafer sheet is different, this just requires sample positioning template to cut to cut with thin cutter at described thick cutter and mark off different cutting zones on wafer, cuts with thick cutter respectively and cutting zone that thin cutter is cut adapts.1 of the sample positioning template of describing in the above-mentioned embodiment is applicable to that thin cutter cuts, and can be applicable to the precision gas cutting machine sample preparation pattern that thick cutter is cut and thin cutter is cut simultaneously in order to make sample positioning template provided by the invention.Can also be provided with on the sample locating module of the present invention and be adapted to the sample well that thick cutter is cut.
Figure 2 shows that the sample positioning template synoptic diagram that is used for the auxiliary sampling of precision cutting machine table of a preferred embodiment of the invention, as shown in Figure 2, sample positioning template 1 ' comprises,
Sample well 101, a plurality of mark window 102, the first Auxiliary Markings 103, the second Auxiliary Markings 104 that are used for the engraved structure of a definite rectangle, these structure Design are identical with sample positioning template 1 shown in Figure 1.
Institute's difference is that this sample positioning template 1 ' also comprises the sample well 101 ' of two engraved structures, and described sample well 101 ' is formed at the equidistant both sides of sample well 101 vertical directions.Use sample positioning template of the present invention to carry out the precision cutting machine table specimen preparation that thick cutter is cut if desired, sample positioning template shown in Figure 21 ' can be fitted on the surface of sample wafer sheet, and aimed at the specific markers of under optical microscope, making on it by sample well 101 ', be 0 degree lattice product or 45 degree lattice products according to this wafer then, each limit of adopting the rectangular patterns shown in first Auxiliary Marking 103 or second Auxiliary Marking 104 accordingly respectively with wafer on scribe line coincide or parallel, determine and mark the rectangle cutting zone that cut direction adapts.Promptly can on described sample wafer sheet, mark cutting zone according to the standard that thick cutter is cut.In this case, the sample well 101 at sample positioning template 1 ' center uses when thin cutter is cut, and use when thick cutter is cut in two holes 101 ' on both sides.
It will be appreciated by those skilled in the art that sample well shown in Figure 2 101 ' set-up mode can design according to actual needs, to satisfy the mark demand of precision cutting machine table to various cutting zones.Generally speaking, sample positioning template of the present invention can comprise one or appoint the sample well 101 ' of a plurality of engraved structures, and described sample well 101 ' is formed at the both sides of sample well 101 horizontal directions or the both sides of vertical direction.
Another is preferred embodiment according to the present invention, sample positioning template of the present invention can also comprise the 3rd Auxiliary Marking, the form of expression of described the 3rd Auxiliary Marking reality is the right-angled intersection pattern that is vertically intersected on sample well 101 places of described Fig. 1 or sample positioning template shown in Figure 2, is made up of the line segment of a horizontal direction and the line segment of a vertical direction.These two graticules can help to carry out more exactly the cutting zone location on the target wafer sheet when operating personnel use sample positioning template of the present invention to carry out precision cutting machine table cutting zone mark.Particularly, effect is the most obvious when the first above-mentioned Auxiliary Marking 103 and second Auxiliary Marking 104 are square, and the 3rd Auxiliary Marking is actually the diagonal line of second Auxiliary Marking in this case.Because the 3rd Auxiliary Marking also can be judged the direction of described sample positioning template as reference, it can make on the easier surface that has fitted in the sample wafer sheet at sample positioning template of operating personnel, and when having aimed at the specific markers of under optical microscope, making on it by sample well, sample positioning template is adjusted to correct direction by the reference of first, second and the 3rd Auxiliary Marking, thereby on the sample wafer sheet, mark correct cutting zone.
In addition, another is preferred embodiment according to the present invention, when using sample positioning template of the present invention that the sample wafer sheet is carried out mark, the mark of doing in order to make on the wafer is easy to confirm more, for example at the marked region of confirming on the precision cutting machine table on the target wafer sheet, sample positioning template of the present invention can comprise the aid mark window.Described aid mark window generally is positioned at the determined rectangle of the mark window both sides in the horizontal direction or the both sides of in the vertical direction on the sample positioning template, and it can be strip pattern or continuous dot pattern or the like.This aid mark window is engraved structure equally, when the mark window that uses sample positioning template marks cutting zone on the sample wafer sheet, can be in the same way, and carry out mark as the aid mark window of marking pen by this hollow out on the surface of sample wafer sheet.In fact, adopt this scheme to mark the target cutting zone except the surface at the sample wafer sheet utilizes the mark window, also use the aid mark window simultaneously near the target cutting zone, Dui Cheng both sides for example, mark specific pattern, it can be used as auxiliary positioning in sample intercepting process pierced pattern makes intercepting process more convenient and quicker.
Fig. 3 is the synoptic diagram according to the sample positioning template of the present invention of above-mentioned preferred implementation.As shown in Figure 3, sample positioning template 1 " comprise,
Sample well 101, a plurality of mark window 102, the first Auxiliary Markings 103, the second Auxiliary Markings 104 that are used for the engraved structure of a definite rectangle, these structure Design are identical with sample positioning template 1 shown in Figure 1.
This sample positioning template 1 " also comprise the sample well 101 ' of two engraved structures, described sample well 101 ' is formed at the equidistant both sides of sample well 101 vertical directions, and this structure Design is identical with template 1 ' shown in Figure 2.
Wherein,
It will be appreciated by those skilled in the art that preferred implementation, sample positioning template 1 shown in Figure 3 as technical solution of the present invention " can realize comparatively perfect functions, but this embodiment can not be used to limit the present invention.When practical application, those skilled in the art can carry out various combinations and improvement to it on the basis of above-mentioned various technical schemes.For example, the 3rd Auxiliary Marking 105 shown in Figure 3 is not necessary; And described aid mark window can adopt the pattern outside the strip pattern, as continuous dot pattern.These variations all should be considered as the specific embodiment of the present invention.
Below describe the sample positioning template 1 that the present invention is shown in Figure 3 in detail " be used for the cutting zone of auxiliary positioning 45 degree lattice wafers, and the cutting target area obtains being suitable for the process of the sample of scanning electron-microscopic observation in precision cutting machine table.
Figure 4 shows that the present invention's sample positioning template shown in Figure 31 " under optical microscope, be used for the synoptic diagram of the cutting zone of auxiliary positioning 45 degree lattice wafers; by transparent material manufactured samples locating template 1 " place on the sample wafer sheet 2 of 45 degree lattices, operating personnel can be by optical microscope 3 observation sample locating templates 1 " cover the situation on the sample wafer sheet 2, and corresponding adjustment position between the two.
Fig. 5 a～5c is depicted as described sample wafer sheet 2 and optical microscope 2 times mark is carried out in the specific region from it, up to sample positioning template of the present invention mark cutting zone thereon, and on precision cutting machine table, make the variation synoptic diagram of sample according to the cutting zone of this mark.
Shown in Fig. 5 a, at first on the wafer of this 45 degree lattice, find out wherein specific region 501 with optical microscope, for example need the defect area analyzed, be generally a chip unit with defective, use marker pen in these specific region 501 enterprising row labels then, make it be different from adjacent area on the wafer;
Shown in Fig. 5 b, sample locating module of the present invention is placed on the sample wafer sheet 2, and, the sample well of sample locating module is aimed at the some (not shown) of making mark in the specific region 501 according to the using method of aforesaid sample positioning template.
Because sample is 45 degree lattices, therefore carry out auxiliary positioning with second Auxiliary Marking on the sample positioning template of the present invention, with definite sample well is the center, rotate this sample positioning template and make its second Auxiliary Marking parallel or vertical with the scribe line 502 on the wafer respectively, pass through the mark window of hollow out on this sample positioning template in sample surfaces interpolation sampling boost line 503 with marker pen then.
At last, in precision cutting machine table, according to the indication of sampling boost line, the target area on the intercepting wafer obtains the wafer sample shown in Fig. 5 c.From Fig. 5 c, can see intuitively, when the wafer of 45 degree lattice products being taken a sample with precision cutting machine table, the direction of cutting, promptly the direction on the limit of this wafer sample and the scribe line on the wafer 502 are inconsistent, the general angle at 45 of described cut direction and scribe line.In practical operation, if do not use sample positioning template of the present invention, only sample is taken a sample, because visual inspection is difficult to down obtain reference from the scribe line of 45 degree directions by visual inspection, occur cutting error even error easily, analysis cost is increased.When utilizing sample positioning template of the present invention, do not need definite resample area that detects by an unaided eye, whole sampling process is convenient and swift, and the cutting zone location of target is not easy to occur error.
More than show and described ultimate principle of the present invention and principal character and advantage of the present invention.The technician of the industry should understand, though in the sample positioning template that the present invention proposes, uses that can combine of various concrete features or structure, these features or structure all can be wherein one or times multinomial and use.The present invention is not restricted to the described embodiments; that describes in the foregoing description and the instructions just illustrates principle of the present invention; the present invention also has various changes and modifications without departing from the spirit and scope of the present invention, and these changes and improvements all fall in the claimed scope of the present invention.The scope of protection of present invention is defined by appending claims and equivalent thereof.
Claims (5)
1, a kind of sample positioning template that is used for precision cutting machine table is characterized in that, described sample positioning template is made of transparent material, and the sample positioning template that this transparent material constitutes comprises,
Sample well (101),
A plurality of mark windows (102) that are used for the engraved structure of a definite rectangle, the determined rectangle of described a plurality of mark windows (102) is the center with described sample well (101), its both sides and horizontal direction parallel, both sides are vertical with horizontal direction;
Described sample positioning template also comprises,
First Auxiliary Marking (103), this first Auxiliary Marking (103) comprise the lines vertical with horizontal direction and/or with the lines of horizontal direction parallel;
Second Auxiliary Marking (104), this second Auxiliary Marking (104) comprises the lines from the horizontal by 45.
2, sample positioning template according to claim 1 is characterized in that, also comprises one or appoint the sample well (101 ') of a plurality of engraved structures, and described sample well (101 ') is formed at the both sides of sample well (101) horizontal direction or the both sides of vertical direction.
3, sample positioning template according to claim 1 and 2, it is characterized in that, also comprise the 3rd Auxiliary Marking (105), described the 3rd Auxiliary Marking (105) for to be vertically intersected on the right-angled intersection pattern that described sample well (101) is located, is made up of the line segment of a horizontal direction and the line segment of a vertical direction.
4, sample positioning template according to claim 1 and 2, it is characterized in that, also comprise, aid mark window (106), described aid mark window (106) is the engraved structure of vertical strip, is positioned at described by the determined rectangle of a plurality of mark windows (102) both sides in the horizontal direction.
5, sample positioning template according to claim 1 and 2 is characterized in that, described mark window (102) comprises four jiaos of its determined rectangular patterns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100399887A CN101620039B (en) | 2008-07-01 | 2008-07-01 | Sample positioning template of precision cutting machine table |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100399887A CN101620039B (en) | 2008-07-01 | 2008-07-01 | Sample positioning template of precision cutting machine table |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101620039A true CN101620039A (en) | 2010-01-06 |
| CN101620039B CN101620039B (en) | 2011-06-22 |
Family
ID=41513385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100399887A Expired - Fee Related CN101620039B (en) | 2008-07-01 | 2008-07-01 | Sample positioning template of precision cutting machine table |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101620039B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102426119A (en) * | 2011-08-25 | 2012-04-25 | 上海华碧检测技术有限公司 | Preparation method of structure section sample of small-sized wafer sample for observation |
| CN103962449A (en) * | 2013-02-04 | 2014-08-06 | 宝山钢铁股份有限公司 | Quick positioning method of sensors |
| CN105223131A (en) * | 2014-07-01 | 2016-01-06 | 中国石油化工股份有限公司 | For the method for the observation station in localizing sample under different observation platform |
| CN113267143A (en) * | 2021-06-30 | 2021-08-17 | 三一建筑机器人(西安)研究院有限公司 | Side die identification method |
| TWI747257B (en) * | 2019-04-29 | 2021-11-21 | 馬來西亞商正齊科技有限公司 | A method for inspecting a skeleton wafer |
| CN114474429A (en) * | 2022-02-17 | 2022-05-13 | 沈阳和研科技有限公司 | Image-based cutting compensation method of dicing saw |
| CN115931423A (en) * | 2023-03-14 | 2023-04-07 | 合肥晶合集成电路股份有限公司 | Slicing method and slicing device for failure point position of semiconductor chip |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101112776B (en) * | 2006-07-27 | 2010-12-15 | 中芯国际集成电路制造(上海)有限公司 | Instrument for accurate cutting of crystal round examples and method of use thereof |
| CN100541755C (en) * | 2006-12-20 | 2009-09-16 | 中芯国际集成电路制造(上海)有限公司 | A kind of wafer back part positioning device and using method thereof |
-
2008
- 2008-07-01 CN CN2008100399887A patent/CN101620039B/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102426119A (en) * | 2011-08-25 | 2012-04-25 | 上海华碧检测技术有限公司 | Preparation method of structure section sample of small-sized wafer sample for observation |
| CN103962449A (en) * | 2013-02-04 | 2014-08-06 | 宝山钢铁股份有限公司 | Quick positioning method of sensors |
| CN103962449B (en) * | 2013-02-04 | 2015-12-02 | 宝山钢铁股份有限公司 | Inductor method for rapidly positioning |
| CN105223131A (en) * | 2014-07-01 | 2016-01-06 | 中国石油化工股份有限公司 | For the method for the observation station in localizing sample under different observation platform |
| CN105223131B (en) * | 2014-07-01 | 2018-12-21 | 中国石油化工股份有限公司 | Method for the observation point under different observation platforms in localizing sample |
| TWI747257B (en) * | 2019-04-29 | 2021-11-21 | 馬來西亞商正齊科技有限公司 | A method for inspecting a skeleton wafer |
| CN113267143A (en) * | 2021-06-30 | 2021-08-17 | 三一建筑机器人(西安)研究院有限公司 | Side die identification method |
| CN113267143B (en) * | 2021-06-30 | 2023-08-29 | 三一建筑机器人(西安)研究院有限公司 | Side mold identification method |
| CN114474429A (en) * | 2022-02-17 | 2022-05-13 | 沈阳和研科技有限公司 | Image-based cutting compensation method of dicing saw |
| CN114474429B (en) * | 2022-02-17 | 2023-11-10 | 沈阳和研科技股份有限公司 | Image-based cutting compensation method of dicing saw |
| CN115931423A (en) * | 2023-03-14 | 2023-04-07 | 合肥晶合集成电路股份有限公司 | Slicing method and slicing device for failure point position of semiconductor chip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101620039B (en) | 2011-06-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101620039B (en) | Sample positioning template of precision cutting machine table | |
| US20060243711A1 (en) | System and method for aligning a wafer processing system in a laser marking system | |
| US10068782B2 (en) | Device and method for scribing a bottom-side of a substrate while viewing the top side | |
| CN102656668B (en) | Offset field grid for efficient wafer layout | |
| CN106773525A (en) | Mask plate, alignment method, display panel, display device and its to cassette method | |
| CN105865389B (en) | A kind of micro-and nanoscale standard and its tracking method | |
| DE102019203404A1 (en) | POSITIONING METHOD | |
| JP2009058950A (en) | Mask blank substrate manufacturing method, mask blank manufacturing method, mask manufacturing method, and mask blank substrate | |
| JP6153117B2 (en) | Process substrate with crystal orientation mark, crystal orientation detection method, and crystal orientation mark readout device | |
| DE19846938A1 (en) | Method for separating required chips from semiconductor wafer | |
| CN106483336A (en) | Sample holder and sample holder group | |
| JP6610026B2 (en) | Scribing equipment | |
| CN108538961A (en) | A method of being used for crystal silica-based solar cell wafer orientation and label | |
| CN112838072A (en) | Alignment method for back side photoetching process | |
| TWM639285U (en) | Substrate cutting device | |
| CN106145658B (en) | Glass cutting method | |
| CN108061736A (en) | The method analyzed using reflective electron probe glass defect | |
| CN110090956B (en) | Multi-laser rapid splicing method for SLM (Selective laser melting) equipment | |
| JPH10177245A (en) | Reticle, semiconductor substrate and semiconductor chip | |
| WO2019217873A1 (en) | Sample support with fiducial indicia | |
| CN105321864A (en) | Method and device for cutting substrate | |
| JP3104802B2 (en) | Reference wafer for inspection | |
| CN203965178U (en) | Wafer device for fixed point sampling | |
| JP2003251551A (en) | Working method for liquid crystal substrate, or the like and its device | |
| JP5621395B2 (en) | Manufacturing method of semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110622 Termination date: 20190701 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |