CN101112776B - Instrument for accurate cutting of crystal round examples and method of use thereof - Google Patents
Instrument for accurate cutting of crystal round examples and method of use thereof Download PDFInfo
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- CN101112776B CN101112776B CN2006100294284A CN200610029428A CN101112776B CN 101112776 B CN101112776 B CN 101112776B CN 2006100294284 A CN2006100294284 A CN 2006100294284A CN 200610029428 A CN200610029428 A CN 200610029428A CN 101112776 B CN101112776 B CN 101112776B
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- toolframe
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- cutting
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Abstract
Aiming at simply and reliably implementing the precise cutting to the wafer sample testing belt, the invention relates to a cutting tool cutting the wafer sample testing belt and the application method. The cutting tool includes a device frame, a magnifier, a sample table, a cutter rest and a cutter; wherein, the cutter is arranged in the cutter rest, the magnifier and the frame of the magnifier are arranged on the cutter rest, and the sample table is also arranged on the cutter rest.
Description
Technical field
The present invention relates to the cutting tool and the using method thereof of wafer sample used in the semiconductor production, particularly relate to the cutting tool and the using method thereof of wafer sample calibration tape.
Background technology
Often have test micro-structural image at present in the semiconductor production on the wafer Cutting Road, form calibration tape.When doing the inefficacy analysis, often need to observe the micrographics structure that is positioned at below the calibration tape these about 40～60 microns wide calibration tape structures so wafer sample need hit when cutting.
But present cutting method two kinds of cutting methods commonly used all have problems.
A kind of cutting mode is to use visualization location, uses the cutting pen of diamond head to carry out hand cut then calibration tape is cut in half.In this mode, operating personnel can not get hold of size firmly, the degree of depth of incision well, and the perusal location also often causes error, thereby the position is cut partially.
The second way is to use for example SELA MC-600 board of professional cutting machine.This class board costs an arm and a leg, and the operation sequence complexity, uses the cutting of these boards that sample is also had strict requirement in addition, not only complicated operation, cutting cost is high but also expend time in.
Summary of the invention
At the problem that existing cutting mode exists, the present invention proposes a kind of simple and reliable cutting tool and the next cutting more accurately that realizes the calibration tape of wafer sample of using method thereof simple and reliablely.
The cutting tool of the present invention's design comprises device frame, magnifying glass and support thereof, sample platform, toolframe, cutter.
The device frame is divided into two-layerly, and the upper strata is a square frame, and a pair of opposite side in the square frame is for being carved with scale, and when the horizontal component of toolframe was enclosed within device frame upper strata, toolframe can be along this opposite side slip.
There is a fixed range on the upper strata of the following leafing device frame of device frame.This fixed range should guarantee that magnifying glass can be observed the figure of wafer sample when wafer sample is placed on the sample platform that is fixed in the device frame lower floor.
The sample platform is fixed on the lower floor of device frame.
Toolframe divides horizontal component and vertical part.The toolframe horizontal component hangs over the while on the device frame, and horizontal component is connected with magnifying glass and support thereof.This magnifying glass bracket can move along the toolframe horizontal component.
The lower vertical of toolframe partly has a cutter groove in order to settle cutter, and cutter is placed in below the cutter by a bolt.
During use, the wafer sample that will cut is placed on the sample platform.
Because magnifying glass can slide along the guide rail on toolframe top, and toolframe can move along the device frame, so magnifying glass can be moved on the plane parallel with wafer sample above wafer sample, again because magnifying glass can clearly be observed the pattern on the wafer sample, so can find targeted graphical by moving magnifier.
Mobile toolframe and magnifying glass bracket to magnifying glass can be observed the figure place of the calibration tape that will cut.
Cutter on the toolframe is also along with toolframe has aimed at the calibration tape that will cut at this moment.
Press bottom tool, and since the barrier effect of bolt head, the degree of depth that the control bolt is pressed into, thus the degree of depth that cutter can be cut is limited, has controlled the cutter degree of depth.
Like this, wafer will split along calibration tape under the cutting of cutter.Finish cutting process.
So, using the present invention, can realize locating comparatively accurately and convenient cutting accurately, reduced the risk of miscut, reduced clipping time, reached goal of the invention.
Description of drawings
Fig. 1 is the overall structure figure of cutter sweep;
Fig. 2 be toolframe structure chart and with the relative position of sample platform;
Fig. 3 a is the right view of toolframe bottom, and Fig. 3 b is the cutaway view of toolframe bottom;
Fig. 4 a is the vertical view of sample platform;
Fig. 4 b is the side view of sample platform;
Fig. 5 a is the vertical view of magnifying glass and support thereof
Fig. 5 b is the side view of magnifying glass and support thereof
Wherein, the 1st, device frame, the 2nd, sample platform, the 3rd, sample to be cut, the 4th, toolframe, 5 are mounted in the cutter in the toolframe, the 6th, magnifying glass and support thereof, the 21st, toolframe, the 22nd, sample platform, the 31st, cutter, among Fig. 4 a and Fig. 4 b 2 is the sample platform, 51 is 20 times of magnifying glasses, the 52nd, and the slide rail that the toolframe horizontal component forms, the 53rd, cutting ferrule.
The specific embodiment
Describe the present invention in detail below in conjunction with accompanying drawing.
[embodiment 1]
Present embodiment comprises device frame, magnifying glass and support thereof, sample platform, toolframe, cutter, sees Fig. 1.
The device frame is divided into two-layerly, and the upper strata is a square frame, and a pair of opposite side in the square frame is for being carved with scale, can be inserted in recess in the top of toolframe, the guide rail when moving as toolframe.
The place, four angles of square frame is connected with four legs of shelf respectively.On the leg from above magnifying glass one fixed range place be connected with the sample platform.This distance should guarantee that sample platform upper surface adds the thickness of wafer for focal length to the distance of the magnifying glass of top.
The vertical view of sample platform is shown in Fig. 4 a.Upwards turn up on one side, the another side middle part inwardly cuts out a rectangle in order to avoid fashionable cutter switches to the sample platform.
The sample platform is fixedly mounted on the lower floor of device frame.
Toolframe is seen Fig. 2, and upper horizontal part interlude has dead slot, and the both sides remainder forms two slide bars, and whole toolframe horizontal component hangs on the device frame, and the cutting ferrule that its guide rail can put magnifying glass bracket moves usefulness for magnifying glass bracket.One end of guide rail is curved down to block one side of device frame, and also recessed one at the equal height place, inside of the other end is to block a guide rail of device frame.The place has a screw in the middle of depression, so that at DRIVE SCREWS behind the location toolframe is stuck on the device frame, toolframe can be moved.
The lower vertical of toolframe partly has a cutter groove in order to settle cutter, and its structure is shown in Fig. 3 a, and its profile is shown in Fig. 3 b.Cutter is placed in below the cutter by a bolt.Shown in Fig. 3 a and Fig. 3 b.
Cutter adopts diamond, or the thick jet blade material changed of SELA board.
Magnifying glass and supporting structure thereof, its support bottom is four cutting ferrules, divides two groups, every group of 2 cutting ferrules are enclosed within respectively on two slide bars of toolframe horizontal component interlude, so that the support of magnifying glass can slide along this slide bar, see Fig. 5 a, Fig. 5 b.
During use, the wafer sample that will cut is placed on the sample platform, and makes sample not need the one side of the cutting baffle plate bar near sample platform back side protrusions.
Because magnifying glass can slide along the slide bar on toolframe top, and toolframe can move along the device frame, so magnifying glass can be moved on the plane parallel with wafer sample, above wafer sample again because sample platform upper surface adds wafer thickness to the distance to magnifying glass for focal length.So the wafer sample upper surface just in time equals the focal length of magnifying glass to the distance of magnifying glass, thereby make magnifying glass can clearly observe pattern on the wafer sample.
Mobile toolframe and magnifying glass bracket to magnifying glass can be observed the figure place of the calibration tape that will cut.
Cutter on the toolframe is also along with toolframe has aimed at the calibration tape that will cut at this moment.
Press bottom tool, and since the barrier effect of bolt head, the degree of depth that the control bolt is pressed into, thus the degree of depth that cutter can be cut is limited, has controlled the cutter degree of depth.
Like this, wafer will split along calibration tape under the cutting of cutter.Finish cutting process.
So, using present embodiment, can realize locating comparatively accurately and convenient cutting accurately, reduced the risk of miscut, reduced clipping time, reached goal of the invention.
Claims (10)
1. the instrument of a cutting crystal wafer sample test band comprises device frame, magnifying glass and support thereof, sample platform, toolframe, cutter; Wherein installing frame has two-layer, the upper strata hangs with toolframe, lower floor is placed with the sample platform, on a pair of opposite side of device frame upper layer bracket scale is arranged, this is to the double guide rail of doing the toolframe slip of opposite side, toolframe has vertical part and horizontal two parts to constitute, and an end points connection, horizontal component wherein can be enclosed within device frame upper edge device frame and slide, the horizontal component interlude of toolframe has dead slot, form the slide bar that an end can supply magnifying glass bracket to move, cutter is placed in the toolframe, and magnifying glass and support thereof are placed on the toolframe.
2. an instrument as claimed in claim 1 is upwards turned up on one side it is characterized in that the sample platform, and the another side middle part cuts a rectangle.
3. an instrument as claimed in claim 2 is characterized in that sample platform fixed in position is on the device frame.
4. an instrument as claimed in claim 1 is characterized in that set screw is arranged on the toolframe, after toolframe moves to ad-hoc location, screws in this set screw, can be with toolholder holds at above-mentioned ad-hoc location.
5. an instrument as claimed in claim 4 is characterized in that there are four cutting ferrules the magnifying glass bracket lower end, divides two groups each two to be enclosed within on the toolframe horizontal component interlude, and can slide along the slide bar of toolframe horizontal component.
6. an instrument as claimed in claim 1 is characterized in that cutter is placed in by bolt in the cutter groove of the vertical part of toolframe, and the degree of depth that can press by the control bolt limits the degree of depth that cutter can be cut.
7. instrument as claimed in claim 1, the material that it is characterized in that employed cutter is a diamond.
8. an instrument as claimed in claim 1 is characterized in that employed cutter is the thick jet blade material that existing cutting machine uses.
9. method of using any described cutting tool in the claim 1～8, it is characterized in that using magnifying glass to search out the fc-specific test FC band, drive cutter and move to this fc-specific test FC band next door, press bottom tool, the stress that produces on wafer sample and then calibration tape is split is finished the cutting of wafer sample.
10. method as claimed in claim 9 is characterized in that using magnifying glass to search out calibration tape on the wafer and drives the location that method that cutter moves to ad-hoc location is finished cutter simultaneously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006100294284A CN101112776B (en) | 2006-07-27 | 2006-07-27 | Instrument for accurate cutting of crystal round examples and method of use thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006100294284A CN101112776B (en) | 2006-07-27 | 2006-07-27 | Instrument for accurate cutting of crystal round examples and method of use thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101112776A CN101112776A (en) | 2008-01-30 |
| CN101112776B true CN101112776B (en) | 2010-12-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006100294284A Expired - Fee Related CN101112776B (en) | 2006-07-27 | 2006-07-27 | Instrument for accurate cutting of crystal round examples and method of use thereof |
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| Country | Link |
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| CN (1) | CN101112776B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101620039B (en) * | 2008-07-01 | 2011-06-22 | 中芯国际集成电路制造(上海)有限公司 | Sample positioning template of precision cutting machine table |
| CN102621355B (en) * | 2012-04-13 | 2014-08-13 | 上海华力微电子有限公司 | Probe tip protective device and probe card with probe tip protective device |
| CN104156325B (en) * | 2014-08-26 | 2017-12-08 | 上海华虹宏力半导体制造有限公司 | Conversion method and device of the chip logic address to physical address |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85201254U (en) * | 1985-04-01 | 1986-06-25 | 复旦大学 | Mechanical measuring device for bending intensity of single crystal material |
| US6042736A (en) * | 1997-11-17 | 2000-03-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for preparing samples for microscopic examination |
| CN1521824A (en) * | 2003-01-28 | 2004-08-18 | 力晶半导体股份有限公司 | Online quality detecting parametric analysis method |
| CN1705075A (en) * | 2004-05-31 | 2005-12-07 | 台湾类比科技股份有限公司 | Semiconductor wafer with a test circuit and making method thereof |
| CN1707764A (en) * | 2004-10-11 | 2005-12-14 | 资重兴 | Method for testing wafer packaging |
-
2006
- 2006-07-27 CN CN2006100294284A patent/CN101112776B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85201254U (en) * | 1985-04-01 | 1986-06-25 | 复旦大学 | Mechanical measuring device for bending intensity of single crystal material |
| US6042736A (en) * | 1997-11-17 | 2000-03-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for preparing samples for microscopic examination |
| CN1521824A (en) * | 2003-01-28 | 2004-08-18 | 力晶半导体股份有限公司 | Online quality detecting parametric analysis method |
| CN1705075A (en) * | 2004-05-31 | 2005-12-07 | 台湾类比科技股份有限公司 | Semiconductor wafer with a test circuit and making method thereof |
| CN1707764A (en) * | 2004-10-11 | 2005-12-14 | 资重兴 | Method for testing wafer packaging |
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| Publication number | Publication date |
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| CN101112776A (en) | 2008-01-30 |
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