CN100541755C - A kind of wafer back part positioning device and using method thereof - Google Patents
A kind of wafer back part positioning device and using method thereof Download PDFInfo
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- CN100541755C CN100541755C CNB2006101475728A CN200610147572A CN100541755C CN 100541755 C CN100541755 C CN 100541755C CN B2006101475728 A CNB2006101475728 A CN B2006101475728A CN 200610147572 A CN200610147572 A CN 200610147572A CN 100541755 C CN100541755 C CN 100541755C
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- probe
- sucker
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Abstract
The invention provides the cutting problem that a kind of apparatus and method solve rough wafer, this device comprises sucker and four parts of operating platform of probe, following probe, arrangement wafer, wafer is placed on the sucker, find cut point by last probe, probe marks for the cut point at the back side of wafer under using.With wafer upset, utilize existing board, be that new cut point cuts wafer with the cut point of institute's mark, thereby solve the cutting problem of the rough wafer of producing as Bumping Technology.
Description
Technical field
The present invention relates to wafer positioner and using method thereof in the semiconductor fabrication, particularly the positioner of the wafer back part in the semiconductor fabrication and using method thereof
Background technology
The cutting of wafer need be done the location to the point on the wafer, for example SELA MC-600 is as a kind of high-precision cutting tool, need a smooth sampling surface, so that vacuum suction system (vaccumpick-up system) can closely pick up a sample, and from sucker (tray), being delivered on the cutting operation platform, thereby accurate placement positioning.But, use vacuum suction system that wafer is drawn closely, located with regard to being difficult to, and then cut for the similar rough wafer that has used spherical welding technology.
But in the actual production, have a large amount of surfaces that protruding wafer is arranged, and as mentioned above, existing board is but placed this wafer because of using vacuum suction system to transmit, and can't cut as forming with the so technology of spherical solder joint.
Summary of the invention
The problem that runs into when the cutting of the rough disk of treatment surface at above-mentioned prior art, the inventor recognizes that the back of wafer is smooth, if can be on the mark of the back of wafer cut point, transmit cutting with wafer back part, just can cut the rough wafer in surface with existing board.
The cutting problem that the present invention proposes the simple device of a cover thus and solve above-mentioned rough wafer based on the methodology of this device.
This device comprises sucker and four parts of operating platform of probe, following probe, arrangement wafer.
Wherein, sucker is placed on the operating platform and can moves at platform surface, moves thereby drive wafer, and following probe is positioned on the operating platform and stretches into sucker, and last probe is positioned at the sucker top.
Its concrete structure is as follows:
One rectangular guideway is arranged on the operating platform, can slide along this guide rail for sucker.
The sucker of settling wafer is made of two suckers up and down, and last sucker is be the rectangle frame of hollow, the downward extension in the centre position of a horizontal opposite side one rectangular shaped slider in the middle of one.Be distributed with vacuum on the last sucker and inhale the hole in order to hold wafer.Following sucker also is the rectangle frame of a middle hollow, and the size of this frame is identical with last sucker, and the correspondence position of the rectangular shaped slider of following sucker on last sucker is a rectangle chute that cooperates with this slide block.Like this, sucker can laterally be slided along the rectangle chute of following sucker.The middle position of vertical opposite side of following sucker also extends the slide block of a rectangular preiection downwards.Make that sucker can slide along the guide rail on this operating platform down.
Last probe is placed in the top of sucker, is the row of falling U, sees Fig. 6.The bottom that should go up probe is the pin of a stainless steel material, because stainless pin can arbitrarily change shape, finger applies the profile that external force can change stainless pin, by adjusting the probe profile, can finely tune the horizontal level of its needle point, thereby the needle point of the probe following probe tip can be with lifting the time is overlapped.
Following probe passes operating platform and stretches in the sucker, can pass through adjusting knob, make down the vertical rise and fall of probe, and its needle point can overlap with the needle point of last probe.
Use this device as follows to the method that the rough wafer in surface cuts.
Earlier according to following steps to cut point on the rear indicia of wafer:
1, whole device is positioned on the objective table of light microscope (OM) of long reach;
2, regulate the following probe adjusting knob be positioned at below the operating platform, probe is risen,, make down the needle point coincidence of probe and last probe by probe in the OM adjusting;
3, regulate probe adjusting knob down, make down the about 2mm of probe decline;
4, dipping in black ink is coated with down on the probe tip;
5, by means of light microscope (OM), regulate sucker, drive wafer and move, make probe and following probe with respect to wafer motion in the x and y direction, the cut point on the wafer is moved under the needle point of probe;
6, regulate the adjusting knob of probe down, probe is risen, until the back side of touching sample;
7, reduce probe down, take out sample.
Like this, sample wafer has just had a cut mark at the back side of cut point.
With the wafer upset, be the cut point of reality with above-mentioned cut point at wafer back part institute mark, put into cutting machine by existing mode.
Because the back side of wafer is smooth, so can be transmitted by vacuum suction system, and cut by existing mode, of the cutting of existing board utilized thereby reach to the rough wafer in surface.
Description of drawings
The present invention is further detailed explanation below in conjunction with description of drawings and embodiment.
Fig. 1 is the stereogram of the device among the present invention;
Fig. 2 is a stereogram of going up sucker;
Fig. 3 is a vertical view of going up sucker;
Fig. 4 is the stereogram of following sucker;
Fig. 5 is the vertical view of following sucker;
Fig. 6 is a structure chart of going up probe;
Fig. 7 is the structure chart of following probe;
Fig. 8 is an error information table in the mark test of 7um, 2um and three kinds of needle point sizes of 1um.
Wherein, the 11st, last probe, the 12nd, following probe, the 13rd, last sucker, the 14th, following sucker, the 15th, operating platform, the 21st, the slide block of last sucker, the 22nd, the suction hole on the last sucker, the 31st, the suction hole on the last sucker, the 41st, the slide block of following sucker, the 42nd, the rectangle chute on the following sucker, the 61st, stainless pin
The 71st, the knob of following probe,
The 72nd, the shank of following probe.
Embodiment
The cutting problem that present embodiment has comprised a covering device and solved above-mentioned rough wafer based on the methodology of this device.
This device comprises sucker and 15 4 parts of operating platform of probe 11, following probe 12, arrangement wafer, sees Fig. 1.
One rectangular guideway is arranged on the operating platform, and can supplying down, sucker slides along this guide rail.
Settle the sucker of wafer to be made of last sucker 13 and 14, two suckers of following sucker, last sucker 13 is to be the rectangle frame of hollow, the downward extension in the centre position of a horizontal opposite side one rectangular shaped slider 21 in the middle of one.Be distributed with vacuum on the last sucker and inhale hole 22 in order to hold the wafer that is placed on it.Following sucker 14 also is the rectangle frame of a middle hollow, and the size of this frame is identical with last sucker, and the correspondence position of the rectangular shaped slider of following sucker on last sucker is a rectangle chute 42 that cooperates with this slide block.Like this, sucker can laterally be slided along the rectangle chute of following sucker.The middle position of vertical opposite side of following sucker also extends the slide block 41 of a rectangular preiection downwards.Make that sucker can slide along the guide rail on this operating platform down.
Last probe is placed in the top of sucker, is the row of falling U, sees Fig. 6.The bottom that should go up probe is the pin of a stainless steel material, because stainless pin can arbitrarily change shape, finger applies the profile that external force can change stainless pin, by finely tuning the horizontal level of probe tip, the needle point of the probe following probe tip can be with lifting the time is overlapped.
Because the pin material of last probe adopts stainless steel material, its quality is softer, can avoid scratching the figure of crystal column surface.Its needle point size can be selected suitable dimensions according to requirement of client.
Following probe is formed by fixedly connecting by knob and shank two parts.And down the shank of probe passes operating platform and stretches in the sucker, is with screw thread outside the bottom of following probe shank, and the inwall of the through hole on the operating platform that this shank passed has the screw thread that cooperates with it.Can pass through adjusting knob 71 like this, the shank 72 that just can drive down probe vertically rises or descends, and the needle point of probe can be overlapped with the needle point of last probe.The needle point size of following probe can be selected suitable dimensions according to requirement of client equally.
Use this device as follows to the method that the rough wafer in surface cuts.
Earlier according to following steps to cut point on the rear indicia of wafer:
1, whole device is positioned on the objective table of light microscope (OM) of long reach;
2, regulate the following probe adjusting knob be positioned at below the operating platform, probe is risen,, make down the needle point coincidence of probe and last probe by probe in the OM adjusting;
3, regulate probe adjusting knob down, make down the about 2mm of probe decline;
4, dipping in black ink is coated on the probe tip;
5, put into wafer, and regulate sucker, drive wafer and move,, make probe and following probe, the cut point on the wafer is moved under the needle point of probe with respect to the motion of wafer on x (laterally) and y (vertically) direction by means of the observation of OM;
6, regulate the adjusting knob of probe down, probe is risen, until the back side of touching sample;
7, reduce probe down, take out sample.
Like this, sample wafer has just had a cut mark at the back side of cut point.
Wherein, the size of the precision of back side cut point mark and needle point has substantial connection.
By selecting different needle point sizes, can control suitable precision.
For example, the error information tabular has gone out the error amount of each mark position of probe of the needle point size of above-mentioned 3 sizes that measure in the mark test of the 7um among Fig. 8,2um and three kinds of needle point sizes of 1um.Wherein, mean value is reference data, is apart from the distance of impact point in the experimentation.Deviation is the deviate of each time acupuncture treatment position.
Shown in data in Fig. 8 form, select the pin of 7um for use, precision is low relatively, and pricking inclined to one side error can be big relatively, and the impact point area of fixed point is bigger, selects the pin of 1um for use, and because needle point is thin more, the precision of target is high more in the bundle.
Like this,, determine needed precision, and then determine suitable pin type, come wafer is positioned mark according to the kind of the needs and the product of front and back technology.
After wafer carried out mark,, be the cut point of reality, put into cutting machine cutting by existing mode with above-mentioned cut point at wafer back part institute mark with the wafer upset.
Because the back side of wafer is smooth, thus can be transmitted by vacuum suction system, and cut by existing mode, and do not need cutting machine is done any improvement.
Utilize the purpose of existing board thereby finish to the cutting of the rough wafer in surface.
Claims (4)
1. the cut point to wafer back part positions the device of mark, contain probe, following probe, settle sucker and four parts of operating platform of wafer, wherein, described sucker is that a centre is the rectangle frame of hollow, sucker is placed on the operating platform and can moves at platform surface, thereby driving wafer moves, following probe passes operating platform and stretches into sucker from the operating platform below, last probe is positioned at the sucker top, its characteristics are down that probe has the lifting knob, can move up and down, last probe can be finely tuned its horizontal adjusting position, thereby the needle point of the probe following probe tip can be with lifting the time is overlapped.
2. device as claimed in claim 1, its characteristics are, by correcting the probe profile, can realize the adjusting to last probe horizontal level.
3. one kind as claim 1 or 2 devices, and its characteristics are that a rectangular guideway is arranged on the operating platform, can slide along this guide rail for sucker;
The sucker of settling wafer is made of two suckers up and down, and last sucker is be the rectangle frame of hollow, the downward extension in the centre position of a horizontal opposite side one rectangular shaped slider in the middle of one; Be distributed with vacuum on the last sucker and inhale the hole in order to hold wafer; Following sucker also is the rectangle frame of a middle hollow, and the size of this frame is identical with last sucker, and the correspondence position of the rectangular shaped slider of following sucker on last sucker is a rectangle chute that cooperates with this slide block, and last sucker can laterally slide along this rectangle chute; The middle position of vertical opposite side of following sucker also extends the slide block of a rectangular preiection downwards, and following sucker can slide along the above-mentioned guide rail on the operating platform.
4. method of using device as claimed in claim 1 that the rough wafer in surface is cut, its step is as follows:
A, utilize device as claimed in claim 1 cut point on the rear indicia of wafer, comprising:
(1). whole device is positioned on the objective table of light microscope of long reach;
(2). adjusting is positioned at the following probe adjusting knob below the operating platform, and probe is risen, and regulates by light microscope and goes up probe, and the needle point of probe and last probe is overlapped;
(3). regulate probe adjusting knob down, make down probe decline 2mm;
(4). dip in black ink and be applied to down on the probe tip;
(5). regulate sucker, drive wafer and move, make probe and following probe, the cut point on the wafer is moved under the needle point of probe with respect to wafer motion in the x and y direction;
(6). regulate the adjusting knob of probe down, probe is risen, until the back side of touching sample;
(7). reduce probe down, take out sample;
B, with wafer upset, put into existing cutting machine, cut according to existing mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101475728A CN100541755C (en) | 2006-12-20 | 2006-12-20 | A kind of wafer back part positioning device and using method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101475728A CN100541755C (en) | 2006-12-20 | 2006-12-20 | A kind of wafer back part positioning device and using method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101207060A CN101207060A (en) | 2008-06-25 |
| CN100541755C true CN100541755C (en) | 2009-09-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101475728A Expired - Fee Related CN100541755C (en) | 2006-12-20 | 2006-12-20 | A kind of wafer back part positioning device and using method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN100541755C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101620039B (en) * | 2008-07-01 | 2011-06-22 | 中芯国际集成电路制造(上海)有限公司 | Sample positioning template of precision cutting machine table |
| CN106526825A (en) * | 2015-10-22 | 2017-03-22 | 安徽超元半导体有限公司 | Microscope for wafer visual inspection |
| CN109530345A (en) * | 2018-10-18 | 2019-03-29 | 武汉华星光电半导体显示技术有限公司 | Probe cleaning device and probe clean method |
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2006
- 2006-12-20 CN CNB2006101475728A patent/CN100541755C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101207060A (en) | 2008-06-25 |
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| C14 | Grant of patent or utility model | ||
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| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20111201 |
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| C41 | Transfer of patent application or patent right or utility model | ||
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Effective date of registration: 20111201 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Co-patentee after: Semiconductor Manufacturing International (Beijing) Corporation Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090916 Termination date: 20181220 |
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| CF01 | Termination of patent right due to non-payment of annual fee |