CN101606448B - 单一和多光谱照明系统和方法 - Google Patents

单一和多光谱照明系统和方法 Download PDF

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Publication number
CN101606448B
CN101606448B CN2008800042613A CN200880004261A CN101606448B CN 101606448 B CN101606448 B CN 101606448B CN 2008800042613 A CN2008800042613 A CN 2008800042613A CN 200880004261 A CN200880004261 A CN 200880004261A CN 101606448 B CN101606448 B CN 101606448B
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CN
China
Prior art keywords
light
long wavelength
electronic substrate
axis
imaging system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008800042613A
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English (en)
Chinese (zh)
Other versions
CN101606448A (zh
Inventor
大卫·P.·普林斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Illinois Tool Works Inc
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Illinois Tool Works Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illinois Tool Works Inc filed Critical Illinois Tool Works Inc
Publication of CN101606448A publication Critical patent/CN101606448A/zh
Application granted granted Critical
Publication of CN101606448B publication Critical patent/CN101606448B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/02—Manually-operable devices
    • B41F15/06—Manually-operable devices with auxiliary equipment, e.g. for drying printed articles
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G01N2021/95646—Soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5193—Electrical connector or terminal

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Inking, Control Or Cleaning Of Printing Machines (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
CN2008800042613A 2007-02-16 2008-01-03 单一和多光谱照明系统和方法 Expired - Fee Related CN101606448B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/707,757 US7710611B2 (en) 2007-02-16 2007-02-16 Single and multi-spectral illumination system and method
US11/707,757 2007-02-16
PCT/US2008/050068 WO2008100646A2 (en) 2007-02-16 2008-01-03 Single and multi-spectral illumination system and method

Publications (2)

Publication Number Publication Date
CN101606448A CN101606448A (zh) 2009-12-16
CN101606448B true CN101606448B (zh) 2011-12-28

Family

ID=39671890

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008800042613A Expired - Fee Related CN101606448B (zh) 2007-02-16 2008-01-03 单一和多光谱照明系统和方法

Country Status (8)

Country Link
US (1) US7710611B2 (OSRAM)
JP (1) JP2010519733A (OSRAM)
KR (1) KR20090125057A (OSRAM)
CN (1) CN101606448B (OSRAM)
DE (1) DE112008000339B4 (OSRAM)
GB (1) GB2458428B (OSRAM)
IL (1) IL199930A (OSRAM)
WO (1) WO2008100646A2 (OSRAM)

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US8474377B2 (en) * 2010-12-08 2013-07-02 Illinois Tool Works Inc. Combination stencil printer and dispenser and related methods
US9243726B2 (en) 2012-10-03 2016-01-26 Aarne H. Reid Vacuum insulated structure with end fitting and method of making same
US20140098216A1 (en) * 2012-10-08 2014-04-10 Dwfritz Automation Inc. Simultaneous-view object insertion systems, apparatuses and methods
JP2014091247A (ja) * 2012-11-02 2014-05-19 Panasonic Corp 半田印刷機及び半田印刷機の半田にじみ検査方法
US11176635B2 (en) * 2013-01-25 2021-11-16 Cyberoptics Corporation Automatic programming of solder paste inspection system
US8939074B2 (en) 2013-03-12 2015-01-27 Illinois Tool Works Inc. Color-based linear three dimensional acquisition system and method
CN105209891B (zh) * 2013-05-13 2018-04-27 富士机械制造株式会社 元件安装机
US9743527B2 (en) * 2013-08-09 2017-08-22 CyberOptics Corporaiton Stencil programming and inspection using solder paste inspection system
US9463918B2 (en) 2014-02-20 2016-10-11 Aarne H. Reid Vacuum insulated articles and methods of making same
JP6654805B2 (ja) * 2015-03-12 2020-02-26 日東電工株式会社 配線回路基板の製造方法および検査方法
US9370925B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Stencil printer having stencil shuttle assembly
US9370924B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Dual action stencil wiper assembly for stencil printer
US10723117B2 (en) 2015-04-07 2020-07-28 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US10703089B2 (en) 2015-04-07 2020-07-07 Illinois Tool Works Inc. Edge lock assembly for a stencil printer
US9370923B1 (en) 2015-04-07 2016-06-21 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US10497908B2 (en) 2015-08-24 2019-12-03 Concept Group, Llc Sealed packages for electronic and energy storage devices
US10065256B2 (en) * 2015-10-30 2018-09-04 Concept Group Llc Brazing systems and methods
US11702271B2 (en) 2016-03-04 2023-07-18 Concept Group Llc Vacuum insulated articles with reflective material enhancement
EP3541722A4 (en) 2016-11-15 2020-07-08 Concept Group LLC MULTIPLE INSULATION ASSEMBLIES
CA3043915A1 (en) 2016-11-15 2018-05-24 Concept Group Llc Enhanced vacuum-insulated articles with microporous insulation
WO2019040885A1 (en) 2017-08-25 2019-02-28 Reid Aarne H INSULATED COMPONENTS WITH MULTIPLE GEOMETRY AND MULTIPLE MATERIALS
JP6783739B2 (ja) 2017-10-31 2020-11-11 株式会社東芝 検査システムおよび検査方法
CN110132960B (zh) * 2018-02-09 2021-12-14 飞旭电子(苏州)有限公司 电路板组件的检测方法
US10780515B2 (en) 2018-04-26 2020-09-22 Raytheon Technologies Corporation Auto-adaptive braze dispensing systems and methods
KR102528016B1 (ko) * 2018-10-05 2023-05-02 삼성전자주식회사 솔더 부재 실장 방법 및 시스템
JP7402634B2 (ja) * 2019-08-01 2023-12-21 株式会社Fuji マスク印刷機、供給位置案内装置
IT202100031832A1 (it) * 2021-12-20 2023-06-20 Scuola Univ Professionale Della Svizzera Italiana Supsi Apparato di acquisizione di informazioni tridimensionali di oggetti e superfici per un sistema di visione artificiale per l'ispezione ottica automatica della qualità visiva di un oggetto sottostante, in particolare assemblaggi elettronici, schede elettroniche e simili
WO2023118059A1 (en) * 2021-12-20 2023-06-29 Scuola universitaria professionale della Svizzera italiana (SUPSI) Apparatus for acquiring three-dimensional information of objects and surfaces for an artificial vision system for automatic optical inspection of the visual quality of an underlying object, in particular electronic assemblies, circuit boards and the like
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Also Published As

Publication number Publication date
DE112008000339T5 (de) 2009-11-19
US7710611B2 (en) 2010-05-04
US20080197170A1 (en) 2008-08-21
CN101606448A (zh) 2009-12-16
GB0913116D0 (en) 2009-09-02
GB2458428B (en) 2012-01-18
IL199930A0 (en) 2010-04-15
GB2458428A (en) 2009-09-23
KR20090125057A (ko) 2009-12-03
WO2008100646A3 (en) 2009-01-08
IL199930A (en) 2016-06-30
WO2008100646A2 (en) 2008-08-21
JP2010519733A (ja) 2010-06-03
DE112008000339B4 (de) 2021-08-26

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Granted publication date: 20111228