CN1275307A - 在用于对结构元件和/或基片进行位置识别和/或质量控制的装置中进行照明调节的方法 - Google Patents
在用于对结构元件和/或基片进行位置识别和/或质量控制的装置中进行照明调节的方法 Download PDFInfo
- Publication number
- CN1275307A CN1275307A CN98810054A CN98810054A CN1275307A CN 1275307 A CN1275307 A CN 1275307A CN 98810054 A CN98810054 A CN 98810054A CN 98810054 A CN98810054 A CN 98810054A CN 1275307 A CN1275307 A CN 1275307A
- Authority
- CN
- China
- Prior art keywords
- illumination
- mark
- structural detail
- lighting unit
- lighting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 29
- 230000001105 regulatory effect Effects 0.000 title claims abstract description 12
- 230000001276 controlling effect Effects 0.000 title abstract description 4
- 230000003595 spectral effect Effects 0.000 claims abstract description 15
- 230000003287 optical effect Effects 0.000 claims abstract description 6
- 238000005286 illumination Methods 0.000 claims description 37
- 238000003384 imaging method Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 11
- 230000002950 deficient Effects 0.000 abstract description 3
- 238000007796 conventional method Methods 0.000 abstract 1
- 238000003908 quality control method Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 238000012549 training Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000002372 labelling Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
Landscapes
- Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Image Input (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19744454.7 | 1997-10-08 | ||
DE19744454 | 1997-10-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1275307A true CN1275307A (zh) | 2000-11-29 |
CN1183819C CN1183819C (zh) | 2005-01-05 |
Family
ID=7844945
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB988100541A Expired - Lifetime CN1183819C (zh) | 1997-10-08 | 1998-09-21 | 在用于对结构元件和/或基片进行位置识别和/或质量控制的装置中进行照明调节的方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6040895A (zh) |
EP (1) | EP1020105B1 (zh) |
JP (1) | JP2001520392A (zh) |
KR (1) | KR100356957B1 (zh) |
CN (1) | CN1183819C (zh) |
DE (1) | DE59803363D1 (zh) |
WO (1) | WO1999020093A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101606448B (zh) * | 2007-02-16 | 2011-12-28 | 伊利诺斯工具制品有限公司 | 单一和多光谱照明系统和方法 |
CN101771824B (zh) * | 2008-12-30 | 2012-01-04 | 财团法人金属工业研究发展中心 | 自动调节所需照明亮度的影像撷取方法 |
CN104488366A (zh) * | 2013-02-28 | 2015-04-01 | Ab微电子有限公司 | 用于电路载体的装备方法和电路载体 |
CN108802046A (zh) * | 2018-06-01 | 2018-11-13 | 中国电子科技集团公司第三十八研究所 | 一种混合集成电路组件缺陷光学检测装置及其检测方法 |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3745564B2 (ja) * | 1999-07-08 | 2006-02-15 | 三菱電機株式会社 | 欠陥検査方法および欠陥検査装置 |
WO2001035049A1 (fr) * | 1999-11-08 | 2001-05-17 | Matsushita Electric Industrial Co., Ltd. | Procede et appareil de reconnaissance de composants |
DE10066519B3 (de) | 1999-11-30 | 2019-08-14 | Mitutoyo Corporation | Bilderzeugungssonde |
DE10128476C2 (de) * | 2001-06-12 | 2003-06-12 | Siemens Dematic Ag | Optische Sensorvorrichtung zur visuellen Erfassung von Substraten |
US20070133001A1 (en) * | 2001-09-12 | 2007-06-14 | Honeywell International Inc. | Laser sensor having a block ring activity |
US7145165B2 (en) * | 2001-09-12 | 2006-12-05 | Honeywell International Inc. | Tunable laser fluid sensor |
DE10162270B4 (de) * | 2001-12-18 | 2004-05-13 | Siemens Ag | Optische Sensorvorrichtung |
JP3551188B2 (ja) * | 2002-01-10 | 2004-08-04 | オムロン株式会社 | 表面状態検査方法および基板検査装置 |
US7470894B2 (en) * | 2002-03-18 | 2008-12-30 | Honeywell International Inc. | Multi-substrate package assembly |
JP3593119B2 (ja) * | 2002-08-01 | 2004-11-24 | 株式会社東芝 | 照明装置 |
KR101079686B1 (ko) * | 2003-01-09 | 2011-11-04 | 파나소닉 주식회사 | 영상인식장치 및 영상인식방법 |
EP1610265B1 (en) * | 2003-03-28 | 2013-08-21 | Fujitsu Limited | Camera, light source control method, and computer program |
JP4746841B2 (ja) * | 2004-01-23 | 2011-08-10 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置の製造方法 |
JP3867724B2 (ja) * | 2004-02-27 | 2007-01-10 | オムロン株式会社 | 表面状態検査方法およびその方法を用いた表面状態検査装置ならびに基板検査装置 |
US7586114B2 (en) * | 2004-09-28 | 2009-09-08 | Honeywell International Inc. | Optical cavity system having an orthogonal input |
US7902534B2 (en) * | 2004-09-28 | 2011-03-08 | Honeywell International Inc. | Cavity ring down system having a common input/output port |
JP4629590B2 (ja) * | 2006-02-03 | 2011-02-09 | 三菱電機株式会社 | 個人識別装置 |
US7656532B2 (en) * | 2006-04-18 | 2010-02-02 | Honeywell International Inc. | Cavity ring-down spectrometer having mirror isolation |
CN101150732B (zh) * | 2006-09-20 | 2010-08-11 | 王锦峰 | 用黑白相机拍摄彩色图像的成像方法和装置 |
US7649189B2 (en) * | 2006-12-04 | 2010-01-19 | Honeywell International Inc. | CRDS mirror for normal incidence fiber optic coupling |
DE102008016766B4 (de) * | 2008-04-02 | 2016-07-21 | Sick Ag | Sicherheitskamera und Verfahren zur Detektion von Objekten |
US7663756B2 (en) * | 2008-07-21 | 2010-02-16 | Honeywell International Inc | Cavity enhanced photo acoustic gas sensor |
US7864326B2 (en) | 2008-10-30 | 2011-01-04 | Honeywell International Inc. | Compact gas sensor using high reflectance terahertz mirror and related system and method |
US8198590B2 (en) * | 2008-10-30 | 2012-06-12 | Honeywell International Inc. | High reflectance terahertz mirror and related method |
US8437000B2 (en) | 2010-06-29 | 2013-05-07 | Honeywell International Inc. | Multiple wavelength cavity ring down gas sensor |
US8269972B2 (en) | 2010-06-29 | 2012-09-18 | Honeywell International Inc. | Beam intensity detection in a cavity ring down sensor |
US8322191B2 (en) | 2010-06-30 | 2012-12-04 | Honeywell International Inc. | Enhanced cavity for a photoacoustic gas sensor |
AT516638A1 (de) * | 2014-12-17 | 2016-07-15 | A B Mikroelektronik Ges Mit Beschränkter Haftung | Verfahren zur Herstellung eines Schaltungsträgers und Schaltungsträger |
AT517259B1 (de) | 2015-06-09 | 2020-01-15 | Zkw Group Gmbh | Verfahren zur positionsgenauen Bestückung eines Schaltungsträgers |
JP6954925B2 (ja) * | 2017-01-06 | 2021-10-27 | 株式会社Fuji | 部品実装機の撮像用照明装置 |
US11178801B2 (en) * | 2017-07-12 | 2021-11-16 | Mycronic AB | Method and system for determining component illumination settings |
KR102597603B1 (ko) | 2018-12-10 | 2023-11-02 | 삼성전자주식회사 | 검사 장치 및 이를 포함하는 반도체 구조 제조 장치 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5010412A (en) * | 1988-12-27 | 1991-04-23 | The Boeing Company | High frequency, low power light source for video camera |
DE4222804A1 (de) * | 1991-07-10 | 1993-04-01 | Raytheon Co | Einrichtung und verfahren zur automatischen visuellen pruefung elektrischer und elektronischer baueinheiten |
JP2969401B2 (ja) * | 1991-10-29 | 1999-11-02 | 株式会社新川 | ボンデイングワイヤ検査装置 |
JP2981941B2 (ja) * | 1991-12-02 | 1999-11-22 | 株式会社新川 | ボンデイングワイヤ検査装置 |
JP2969402B2 (ja) * | 1991-12-02 | 1999-11-02 | 株式会社新川 | ボンデイングワイヤ検査装置 |
JP2969403B2 (ja) * | 1991-12-02 | 1999-11-02 | 株式会社新川 | ボンデイングワイヤ検査装置 |
US5469294A (en) * | 1992-05-01 | 1995-11-21 | Xrl, Inc. | Illumination system for OCR of indicia on a substrate |
JPH05332939A (ja) * | 1992-06-01 | 1993-12-17 | Matsushita Electric Ind Co Ltd | 視覚認識装置 |
JPH07335706A (ja) * | 1994-06-03 | 1995-12-22 | Nec Corp | ワイヤの高さ測定装置 |
JPH08219716A (ja) * | 1994-12-13 | 1996-08-30 | Toshiba Corp | 入力画像コントラスト処理装置およびこれを用いた装置 |
DE59503466D1 (de) * | 1994-12-30 | 1998-10-08 | Siemens Ag | Vorrichtung zur lageerkennung der anschlüsse von bauelementen |
US5943125A (en) * | 1997-02-26 | 1999-08-24 | Acuity Imaging, Llc | Ring illumination apparatus for illuminating reflective elements on a generally planar surface |
-
1998
- 1998-04-29 US US09/069,283 patent/US6040895A/en not_active Expired - Fee Related
- 1998-09-21 EP EP98954206A patent/EP1020105B1/de not_active Expired - Lifetime
- 1998-09-21 CN CNB988100541A patent/CN1183819C/zh not_active Expired - Lifetime
- 1998-09-21 JP JP2000516517A patent/JP2001520392A/ja active Pending
- 1998-09-21 KR KR1020007003844A patent/KR100356957B1/ko not_active IP Right Cessation
- 1998-09-21 WO PCT/DE1998/002795 patent/WO1999020093A1/de active IP Right Grant
- 1998-09-21 DE DE59803363T patent/DE59803363D1/de not_active Expired - Lifetime
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101606448B (zh) * | 2007-02-16 | 2011-12-28 | 伊利诺斯工具制品有限公司 | 单一和多光谱照明系统和方法 |
CN101771824B (zh) * | 2008-12-30 | 2012-01-04 | 财团法人金属工业研究发展中心 | 自动调节所需照明亮度的影像撷取方法 |
CN104488366A (zh) * | 2013-02-28 | 2015-04-01 | Ab微电子有限公司 | 用于电路载体的装备方法和电路载体 |
CN108882514A (zh) * | 2013-02-28 | 2018-11-23 | Ab微电子有限公司 | 用于电路载体的装备方法和电路载体 |
US10217675B2 (en) | 2013-02-28 | 2019-02-26 | A.B. Mikroelektronik Gesellschaft Mit Beschraenkter Haftung | Placement method for circuit carrier and circuit carrier |
US10672672B2 (en) | 2013-02-28 | 2020-06-02 | Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung | Placement method for circuit carrier and circuit carrier |
US10991632B2 (en) | 2013-02-28 | 2021-04-27 | Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung | Assembly process for circuit carrier and circuit carrier |
CN108802046A (zh) * | 2018-06-01 | 2018-11-13 | 中国电子科技集团公司第三十八研究所 | 一种混合集成电路组件缺陷光学检测装置及其检测方法 |
CN108802046B (zh) * | 2018-06-01 | 2021-01-29 | 中国电子科技集团公司第三十八研究所 | 一种混合集成电路组件缺陷光学检测装置及其检测方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1020105A1 (de) | 2000-07-19 |
WO1999020093A1 (de) | 1999-04-22 |
KR100356957B1 (ko) | 2002-10-18 |
DE59803363D1 (de) | 2002-04-18 |
KR20010031029A (ko) | 2001-04-16 |
US6040895A (en) | 2000-03-21 |
JP2001520392A (ja) | 2001-10-30 |
EP1020105B1 (de) | 2002-03-13 |
CN1183819C (zh) | 2005-01-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1183819C (zh) | 在用于对结构元件和/或基片进行位置识别和/或质量控制的装置中进行照明调节的方法 | |
US7508504B2 (en) | Automatic wafer edge inspection and review system | |
EP1363153B1 (en) | Ring illuminator | |
EP1396182B1 (de) | Optische sensorvorrichtung | |
US20090122304A1 (en) | Apparatus and Method for Wafer Edge Exclusion Measurement | |
WO2007133330A2 (en) | Substrate illumination and inspection system | |
EP1121559A1 (en) | Light array system and method for illumination of objects imaged by imaging systems | |
US8087799B2 (en) | Illumination means and inspection means having an illumination means | |
EP1116019A1 (en) | Illuminating and optical apparatus for inspecting soldering of printed circuit board | |
KR20090028505A (ko) | 단부 검사 장치 | |
CN103874406A (zh) | 部件安装装置 | |
CN1576777A (zh) | 检查装置和检查方法 | |
DE102008055949B4 (de) | Optische Erfassungseinheit für Objekte | |
CN110648942A (zh) | 芯片贴装机及半导体器件的制造方法 | |
JP3632449B2 (ja) | クリーム半田の塗布状態検査装置および塗布状態検査方法 | |
EP1595138B1 (en) | Image recognition apparatus and image recognition method | |
US7284870B2 (en) | Lighting apparatus and image pick-up apparatus with lighting | |
CN1314997A (zh) | 检查基本平坦平面的发光器 | |
JP3597611B2 (ja) | 実装機におけるマーク認識用照明装置 | |
WO2009021207A2 (en) | Apparatus and method for wafer edge exclusion measurement | |
US6649926B2 (en) | Suction nozzle, and electric-component-position detecting apparatus | |
JPH10185832A (ja) | 外観検査方法及び外観検査装置 | |
US6507395B1 (en) | Illumination head | |
KR0130866B1 (ko) | 인쇄 회로 기판 검사용 시각 인식장치 | |
CN213840623U (zh) | 一种可改变出光方向的平行光源装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SIEMENS ELECTRONICS ASSEMBLY SYSTEMS LIMITED PARTN Free format text: FORMER OWNER: SIEMENS AG Effective date: 20090925 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20090925 Address after: Munich, Germany Patentee after: SIEMENS ELECTRONICS ASSEMBLY SYSTEMS GmbH & Co.KG Address before: Munich, Germany Patentee before: Siemens AG |
|
C56 | Change in the name or address of the patentee |
Owner name: ADVANCED ASSEMBLY SYSTEMS GMBH + CO. KG Free format text: FORMER NAME: SIEMENS AG (DE) |
|
CP01 | Change in the name or title of a patent holder |
Address after: Munich, Germany Patentee after: ASM Assembly Systems GmbH & Co. KG Address before: Munich, Germany Patentee before: SIEMENS ELECTRONICS ASSEMBLY SYSTEMS GmbH & Co.KG |
|
CX01 | Expiry of patent term |
Granted publication date: 20050105 |
|
CX01 | Expiry of patent term |