CN101593714B - 针迹检查装置、探测装置、和针迹检查方法 - Google Patents

针迹检查装置、探测装置、和针迹检查方法 Download PDF

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CN101593714B
CN101593714B CN2009101452289A CN200910145228A CN101593714B CN 101593714 B CN101593714 B CN 101593714B CN 2009101452289 A CN2009101452289 A CN 2009101452289A CN 200910145228 A CN200910145228 A CN 200910145228A CN 101593714 B CN101593714 B CN 101593714B
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CN101593714A (zh
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梅原康敏
月嶋慎
河野功
佐野聪
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Tokyo Electron Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques

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  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
CN2009101452289A 2008-05-27 2009-05-27 针迹检查装置、探测装置、和针迹检查方法 Active CN101593714B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008138353 2008-05-27
JP2008138353A JP5286938B2 (ja) 2008-05-27 2008-05-27 針跡検査装置、プローブ装置、及び針跡検査方法、並びに記憶媒体
JP2008-138353 2008-05-27

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CN101593714A CN101593714A (zh) 2009-12-02
CN101593714B true CN101593714B (zh) 2011-07-06

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JP (1) JP5286938B2 (https=)
KR (1) KR101230673B1 (https=)
CN (1) CN101593714B (https=)
TW (1) TWI505384B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102844473B (zh) * 2010-03-25 2014-04-16 三菱丽阳株式会社 阳极氧化铝的制造方法、检查装置以及检查方法
KR102317023B1 (ko) * 2014-08-14 2021-10-26 삼성전자주식회사 반도체 장치, 그의 제조 방법, 및 그의 제조 설비
US9747520B2 (en) * 2015-03-16 2017-08-29 Kla-Tencor Corporation Systems and methods for enhancing inspection sensitivity of an inspection tool
JP6406221B2 (ja) 2015-11-17 2018-10-17 三菱電機株式会社 半導体装置の評価装置及び評価方法
JP7108527B2 (ja) * 2018-12-10 2022-07-28 東京エレクトロン株式会社 解析装置及び画像生成方法
JP7602713B2 (ja) 2021-03-02 2024-12-19 株式会社東京精密 パーティクル計測装置、三次元形状測定装置、プローバ装置、パーティクル計測システム及びパーティクル計測方法
TWI809928B (zh) * 2022-04-19 2023-07-21 南亞科技股份有限公司 晶圓檢測系統
CN120283294A (zh) 2022-12-13 2025-07-08 株式会社东京精密 检查装置及检查方法
CN116883310A (zh) * 2023-05-04 2023-10-13 杭州长川科技股份有限公司 基于图像处理的针痕检测方法、装置、设备及介质

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252262A (ja) * 2001-02-23 2002-09-06 Dainippon Screen Mfg Co Ltd 銅被着基板検出方法及びこれを用いた基板処理装置
JP4828741B2 (ja) * 2001-08-23 2011-11-30 大日本スクリーン製造株式会社 プローブ痕測定方法およびプローブ痕測定装置
JP4357813B2 (ja) * 2002-08-23 2009-11-04 東京エレクトロン株式会社 プローブ装置及びプローブ方法
US7308157B2 (en) * 2003-02-03 2007-12-11 Photon Dynamics, Inc. Method and apparatus for optical inspection of a display
JP4730895B2 (ja) * 2004-12-10 2011-07-20 大日本スクリーン製造株式会社 針痕検出装置および針痕検出方法
KR101047795B1 (ko) * 2005-01-05 2011-07-07 엘지이노텍 주식회사 반도체 발광소자
KR101170587B1 (ko) * 2005-01-05 2012-08-01 티에이치케이 인텍스 가부시키가이샤 워크의 브레이크 방법 및 장치, 스크라이브 및 브레이크방법, 및 브레이크 기능을 갖는 스크라이브 장치
CN100541879C (zh) * 2005-05-17 2009-09-16 Agc清美化学股份有限公司 锂二次电池正极用的含锂复合氧化物的制造方法
JP4334527B2 (ja) * 2005-10-21 2009-09-30 大日本スクリーン製造株式会社 針痕検出装置および針痕検出方法

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Publication number Publication date
KR20090123785A (ko) 2009-12-02
KR101230673B1 (ko) 2013-02-07
JP5286938B2 (ja) 2013-09-11
TWI505384B (zh) 2015-10-21
JP2009289818A (ja) 2009-12-10
TW201009973A (en) 2010-03-01
CN101593714A (zh) 2009-12-02

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