TWI505384B - A stitch check device, a probe device and a stitch check method, and a memory medium - Google Patents

A stitch check device, a probe device and a stitch check method, and a memory medium Download PDF

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Publication number
TWI505384B
TWI505384B TW098117478A TW98117478A TWI505384B TW I505384 B TWI505384 B TW I505384B TW 098117478 A TW098117478 A TW 098117478A TW 98117478 A TW98117478 A TW 98117478A TW I505384 B TWI505384 B TW I505384B
Authority
TW
Taiwan
Prior art keywords
component
stitch
electrode pad
image data
data
Prior art date
Application number
TW098117478A
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English (en)
Chinese (zh)
Other versions
TW201009973A (en
Inventor
梅原康敏
月嶋慎
河野功
佐野聰
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TW201009973A publication Critical patent/TW201009973A/zh
Application granted granted Critical
Publication of TWI505384B publication Critical patent/TWI505384B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques

Landscapes

  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
TW098117478A 2008-05-27 2009-05-26 A stitch check device, a probe device and a stitch check method, and a memory medium TWI505384B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008138353A JP5286938B2 (ja) 2008-05-27 2008-05-27 針跡検査装置、プローブ装置、及び針跡検査方法、並びに記憶媒体

Publications (2)

Publication Number Publication Date
TW201009973A TW201009973A (en) 2010-03-01
TWI505384B true TWI505384B (zh) 2015-10-21

Family

ID=41408296

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098117478A TWI505384B (zh) 2008-05-27 2009-05-26 A stitch check device, a probe device and a stitch check method, and a memory medium

Country Status (4)

Country Link
JP (1) JP5286938B2 (https=)
KR (1) KR101230673B1 (https=)
CN (1) CN101593714B (https=)
TW (1) TWI505384B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102844473B (zh) * 2010-03-25 2014-04-16 三菱丽阳株式会社 阳极氧化铝的制造方法、检查装置以及检查方法
KR102317023B1 (ko) * 2014-08-14 2021-10-26 삼성전자주식회사 반도체 장치, 그의 제조 방법, 및 그의 제조 설비
US9747520B2 (en) * 2015-03-16 2017-08-29 Kla-Tencor Corporation Systems and methods for enhancing inspection sensitivity of an inspection tool
JP6406221B2 (ja) 2015-11-17 2018-10-17 三菱電機株式会社 半導体装置の評価装置及び評価方法
JP7108527B2 (ja) * 2018-12-10 2022-07-28 東京エレクトロン株式会社 解析装置及び画像生成方法
JP7602713B2 (ja) 2021-03-02 2024-12-19 株式会社東京精密 パーティクル計測装置、三次元形状測定装置、プローバ装置、パーティクル計測システム及びパーティクル計測方法
TWI809928B (zh) * 2022-04-19 2023-07-21 南亞科技股份有限公司 晶圓檢測系統
CN120283294A (zh) 2022-12-13 2025-07-08 株式会社东京精密 检查装置及检查方法
CN116883310A (zh) * 2023-05-04 2023-10-13 杭州长川科技股份有限公司 基于图像处理的针痕检测方法、装置、设备及介质

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003068813A (ja) * 2001-08-23 2003-03-07 Dainippon Screen Mfg Co Ltd プローブ痕測定方法およびプローブ痕測定装置
TW200403440A (en) * 2002-08-23 2004-03-01 Tokyo Electron Ltd Probe apparatus
TW200421857A (en) * 2003-02-03 2004-10-16 Photon Dynamics Inc Method and apparatus for optical inspecting of a display

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252262A (ja) * 2001-02-23 2002-09-06 Dainippon Screen Mfg Co Ltd 銅被着基板検出方法及びこれを用いた基板処理装置
JP4730895B2 (ja) * 2004-12-10 2011-07-20 大日本スクリーン製造株式会社 針痕検出装置および針痕検出方法
KR101047795B1 (ko) * 2005-01-05 2011-07-07 엘지이노텍 주식회사 반도체 발광소자
KR101170587B1 (ko) * 2005-01-05 2012-08-01 티에이치케이 인텍스 가부시키가이샤 워크의 브레이크 방법 및 장치, 스크라이브 및 브레이크방법, 및 브레이크 기능을 갖는 스크라이브 장치
CN100541879C (zh) * 2005-05-17 2009-09-16 Agc清美化学股份有限公司 锂二次电池正极用的含锂复合氧化物的制造方法
JP4334527B2 (ja) * 2005-10-21 2009-09-30 大日本スクリーン製造株式会社 針痕検出装置および針痕検出方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003068813A (ja) * 2001-08-23 2003-03-07 Dainippon Screen Mfg Co Ltd プローブ痕測定方法およびプローブ痕測定装置
TW200403440A (en) * 2002-08-23 2004-03-01 Tokyo Electron Ltd Probe apparatus
TW200421857A (en) * 2003-02-03 2004-10-16 Photon Dynamics Inc Method and apparatus for optical inspecting of a display

Also Published As

Publication number Publication date
KR20090123785A (ko) 2009-12-02
KR101230673B1 (ko) 2013-02-07
JP5286938B2 (ja) 2013-09-11
CN101593714B (zh) 2011-07-06
JP2009289818A (ja) 2009-12-10
TW201009973A (en) 2010-03-01
CN101593714A (zh) 2009-12-02

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