KR101230673B1 - 프로브 마크 검사 장치, 프로브 장치, 및 프로브 마크 검사 방법, 및 기억 매체 - Google Patents

프로브 마크 검사 장치, 프로브 장치, 및 프로브 마크 검사 방법, 및 기억 매체 Download PDF

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KR101230673B1
KR101230673B1 KR1020090041424A KR20090041424A KR101230673B1 KR 101230673 B1 KR101230673 B1 KR 101230673B1 KR 1020090041424 A KR1020090041424 A KR 1020090041424A KR 20090041424 A KR20090041424 A KR 20090041424A KR 101230673 B1 KR101230673 B1 KR 101230673B1
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KR20090123785A (ko
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야스토시 우메하라
마코토 츠키시마
이사오 고우노
사토시 사노
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도쿄엘렉트론가부시키가이샤
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95684Patterns showing highly reflecting parts, e.g. metallic elements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques

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  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
KR1020090041424A 2008-05-27 2009-05-12 프로브 마크 검사 장치, 프로브 장치, 및 프로브 마크 검사 방법, 및 기억 매체 Active KR101230673B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008138353A JP5286938B2 (ja) 2008-05-27 2008-05-27 針跡検査装置、プローブ装置、及び針跡検査方法、並びに記憶媒体
JPJP-P-2008-138353 2008-05-27

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KR20090123785A KR20090123785A (ko) 2009-12-02
KR101230673B1 true KR101230673B1 (ko) 2013-02-07

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JP (1) JP5286938B2 (https=)
KR (1) KR101230673B1 (https=)
CN (1) CN101593714B (https=)
TW (1) TWI505384B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102844473B (zh) * 2010-03-25 2014-04-16 三菱丽阳株式会社 阳极氧化铝的制造方法、检查装置以及检查方法
KR102317023B1 (ko) * 2014-08-14 2021-10-26 삼성전자주식회사 반도체 장치, 그의 제조 방법, 및 그의 제조 설비
US9747520B2 (en) * 2015-03-16 2017-08-29 Kla-Tencor Corporation Systems and methods for enhancing inspection sensitivity of an inspection tool
JP6406221B2 (ja) 2015-11-17 2018-10-17 三菱電機株式会社 半導体装置の評価装置及び評価方法
JP7108527B2 (ja) * 2018-12-10 2022-07-28 東京エレクトロン株式会社 解析装置及び画像生成方法
JP7602713B2 (ja) 2021-03-02 2024-12-19 株式会社東京精密 パーティクル計測装置、三次元形状測定装置、プローバ装置、パーティクル計測システム及びパーティクル計測方法
TWI809928B (zh) * 2022-04-19 2023-07-21 南亞科技股份有限公司 晶圓檢測系統
CN120283294A (zh) 2022-12-13 2025-07-08 株式会社东京精密 检查装置及检查方法
CN116883310A (zh) * 2023-05-04 2023-10-13 杭州长川科技股份有限公司 基于图像处理的针痕检测方法、装置、设备及介质

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060080339A (ko) * 2005-01-05 2006-07-10 엘지이노텍 주식회사 반도체 발광소자
KR20070121640A (ko) * 2005-01-05 2007-12-27 티에치케이 가부시끼가이샤 워크의 브레이크 방법 및 장치, 스크라이브 및 브레이크방법, 및 브레이크 기능을 갖는 스크라이브 장치
KR20080009058A (ko) * 2005-05-17 2008-01-24 에이지씨 세이미 케미칼 가부시키가이샤 리튬 2 차 전지 정극용 리튬 함유 복합 산화물의 제조 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252262A (ja) * 2001-02-23 2002-09-06 Dainippon Screen Mfg Co Ltd 銅被着基板検出方法及びこれを用いた基板処理装置
JP4828741B2 (ja) * 2001-08-23 2011-11-30 大日本スクリーン製造株式会社 プローブ痕測定方法およびプローブ痕測定装置
JP4357813B2 (ja) * 2002-08-23 2009-11-04 東京エレクトロン株式会社 プローブ装置及びプローブ方法
US7308157B2 (en) * 2003-02-03 2007-12-11 Photon Dynamics, Inc. Method and apparatus for optical inspection of a display
JP4730895B2 (ja) * 2004-12-10 2011-07-20 大日本スクリーン製造株式会社 針痕検出装置および針痕検出方法
JP4334527B2 (ja) * 2005-10-21 2009-09-30 大日本スクリーン製造株式会社 針痕検出装置および針痕検出方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060080339A (ko) * 2005-01-05 2006-07-10 엘지이노텍 주식회사 반도체 발광소자
KR20070121640A (ko) * 2005-01-05 2007-12-27 티에치케이 가부시끼가이샤 워크의 브레이크 방법 및 장치, 스크라이브 및 브레이크방법, 및 브레이크 기능을 갖는 스크라이브 장치
KR20080009058A (ko) * 2005-05-17 2008-01-24 에이지씨 세이미 케미칼 가부시키가이샤 리튬 2 차 전지 정극용 리튬 함유 복합 산화물의 제조 방법

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Publication number Publication date
KR20090123785A (ko) 2009-12-02
JP5286938B2 (ja) 2013-09-11
TWI505384B (zh) 2015-10-21
CN101593714B (zh) 2011-07-06
JP2009289818A (ja) 2009-12-10
TW201009973A (en) 2010-03-01
CN101593714A (zh) 2009-12-02

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