CN101585164A - 抛光设备 - Google Patents
抛光设备 Download PDFInfo
- Publication number
- CN101585164A CN101585164A CNA2008101657960A CN200810165796A CN101585164A CN 101585164 A CN101585164 A CN 101585164A CN A2008101657960 A CNA2008101657960 A CN A2008101657960A CN 200810165796 A CN200810165796 A CN 200810165796A CN 101585164 A CN101585164 A CN 101585164A
- Authority
- CN
- China
- Prior art keywords
- snap ring
- polished surface
- apical ring
- polissoir
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 292
- 230000007246 mechanism Effects 0.000 claims abstract description 33
- 238000010276 construction Methods 0.000 claims description 132
- 239000012530 fluid Substances 0.000 claims description 73
- 239000000758 substrate Substances 0.000 claims description 72
- 238000005096 rolling process Methods 0.000 claims description 33
- 230000002093 peripheral effect Effects 0.000 claims description 23
- 238000005259 measurement Methods 0.000 claims description 22
- 238000009826 distribution Methods 0.000 claims description 16
- 238000011144 upstream manufacturing Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 133
- 235000012431 wafers Nutrition 0.000 description 125
- 238000000034 method Methods 0.000 description 29
- 230000008859 change Effects 0.000 description 21
- 239000002245 particle Substances 0.000 description 17
- 238000006073 displacement reaction Methods 0.000 description 16
- 238000010586 diagram Methods 0.000 description 15
- 230000004888 barrier function Effects 0.000 description 13
- 238000007517 polishing process Methods 0.000 description 12
- 229910003460 diamond Inorganic materials 0.000 description 11
- 239000010432 diamond Substances 0.000 description 11
- 229920001971 elastomer Polymers 0.000 description 11
- 239000005060 rubber Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 9
- 210000001138 tear Anatomy 0.000 description 9
- 239000007788 liquid Substances 0.000 description 7
- 239000002002 slurry Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000001105 regulatory effect Effects 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229920002943 EPDM rubber Polymers 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 229920002635 polyurethane Polymers 0.000 description 4
- 239000004814 polyurethane Substances 0.000 description 4
- 229920003225 polyurethane elastomer Polymers 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 229920002379 silicone rubber Polymers 0.000 description 4
- 238000009966 trimming Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 230000001737 promoting effect Effects 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- 230000008719 thickening Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
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- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005389 semiconductor device fabrication Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Images
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004318581A JP4597634B2 (ja) | 2004-11-01 | 2004-11-01 | トップリング、基板の研磨装置及び研磨方法 |
| JP2004318581 | 2004-11-01 | ||
| JP2005079166 | 2005-03-18 | ||
| JP2005145566 | 2005-05-18 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005800375590A Division CN100466191C (zh) | 2004-11-01 | 2005-10-31 | 抛光设备 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101585164A true CN101585164A (zh) | 2009-11-25 |
Family
ID=36722909
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008101657960A Pending CN101585164A (zh) | 2004-11-01 | 2005-10-31 | 抛光设备 |
| CNB2005800375590A Expired - Lifetime CN100466191C (zh) | 2004-11-01 | 2005-10-31 | 抛光设备 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005800375590A Expired - Lifetime CN100466191C (zh) | 2004-11-01 | 2005-10-31 | 抛光设备 |
Country Status (2)
| Country | Link |
|---|---|
| JP (2) | JP4597634B2 (enExample) |
| CN (2) | CN101585164A (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102314082A (zh) * | 2010-06-28 | 2012-01-11 | 信越化学工业株式会社 | 用于制造电子级合成石英玻璃衬底的方法 |
| CN103894921A (zh) * | 2014-03-26 | 2014-07-02 | 广东工业大学 | 一种高精密单面研磨机的上盘结构 |
| CN108032211A (zh) * | 2017-12-11 | 2018-05-15 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 气压检测装置及抛光设备 |
| CN110352115A (zh) * | 2017-03-06 | 2019-10-18 | 应用材料公司 | 为cmp位置特定研磨(lsp)设计的螺旋及同心圆移动 |
| CN117161947A (zh) * | 2022-10-13 | 2023-12-05 | 北京特思迪半导体设备有限公司 | 用于晶圆批量抛光设备、下压力控制方法及设备 |
Families Citing this family (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7699688B2 (en) * | 2006-11-22 | 2010-04-20 | Applied Materials, Inc. | Carrier ring for carrier head |
| DE602008002445D1 (de) * | 2007-01-30 | 2010-10-28 | Ebara Corp | Poliervorrichtung |
| JP2009131920A (ja) | 2007-11-29 | 2009-06-18 | Ebara Corp | 研磨装置及び方法 |
| JP5199691B2 (ja) | 2008-02-13 | 2013-05-15 | 株式会社荏原製作所 | 研磨装置 |
| ES2338622B1 (es) * | 2008-07-23 | 2011-07-01 | Estudios De Ingenieria Adaptada, S.L. | Cabezal posicionador de herramienta sobre superficies irregulares. |
| JP5390807B2 (ja) | 2008-08-21 | 2014-01-15 | 株式会社荏原製作所 | 研磨方法および装置 |
| JP5236515B2 (ja) * | 2009-01-28 | 2013-07-17 | 株式会社荏原製作所 | ドレッシング装置、化学的機械的研磨装置及び方法 |
| KR101170760B1 (ko) * | 2009-07-24 | 2012-08-03 | 세메스 주식회사 | 기판 연마 장치 |
| JP5552401B2 (ja) | 2010-09-08 | 2014-07-16 | 株式会社荏原製作所 | 研磨装置および方法 |
| TWI520829B (zh) * | 2010-11-18 | 2016-02-11 | Sintokogio Ltd | A grinding member for a cylindrical member, a cylindrical member, and a cylindrical member |
| JP5454513B2 (ja) * | 2011-05-27 | 2014-03-26 | 信越半導体株式会社 | 研磨ヘッドの高さ方向の位置の調整方法及びワークの研磨方法 |
| CN102554760B (zh) * | 2012-01-19 | 2014-04-23 | 大连理工大学 | 一种多功能的基片磨抛装置及其磨抛方法 |
| CN102554764A (zh) * | 2012-02-15 | 2012-07-11 | 蔡桂芳 | 适用于超长超薄石英板的研磨抛光机及研磨抛光方法 |
| CN103358224A (zh) * | 2012-03-31 | 2013-10-23 | 哈尔滨电机厂有限责任公司 | 水轮发电机推力轴承镜板研磨机 |
| JP5976522B2 (ja) | 2012-05-31 | 2016-08-23 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
| JP5973883B2 (ja) * | 2012-11-15 | 2016-08-23 | 株式会社荏原製作所 | 基板保持装置および研磨装置 |
| KR101397937B1 (ko) | 2012-12-07 | 2014-05-27 | 캐터필라정밀씰 주식회사 | 덴트 사상 및 폴리싱 작업을 동시에 수행하는 덴트 사상 장치 |
| JP5967044B2 (ja) * | 2013-09-19 | 2016-08-10 | 信越半導体株式会社 | 研磨パッドの評価方法及びウェーハの研磨方法 |
| JP6266493B2 (ja) | 2014-03-20 | 2018-01-24 | 株式会社荏原製作所 | 研磨装置及び研磨方法 |
| JP6344950B2 (ja) | 2014-03-31 | 2018-06-20 | 株式会社荏原製作所 | 研磨装置及び研磨方法 |
| CN104308739B (zh) * | 2014-10-11 | 2017-02-01 | 中国科学院宁波材料技术与工程研究所 | 精密加工装置及其控制方法 |
| JP6093741B2 (ja) * | 2014-10-21 | 2017-03-08 | 信越半導体株式会社 | 研磨装置及びウェーハの研磨方法 |
| GB2534130B (en) * | 2015-01-06 | 2018-12-19 | Smart Separations Ltd | Apparatus and methods |
| JP6789982B2 (ja) * | 2015-05-13 | 2020-11-25 | スリーエム イノベイティブ プロパティズ カンパニー | 研磨パッド、並びに当該研磨パッドを使用するためのシステム及び方法 |
| CN105290918B (zh) * | 2015-09-16 | 2017-10-20 | 西安交通大学 | 手持式带水平校准及压力测量的多功能磨抛装置及使用方法 |
| JP6406238B2 (ja) * | 2015-12-18 | 2018-10-17 | 株式会社Sumco | ウェーハ研磨方法および研磨装置 |
| JP6588854B2 (ja) * | 2016-03-30 | 2019-10-09 | 株式会社荏原製作所 | 基板処理装置 |
| CN105945729B (zh) * | 2016-04-27 | 2018-01-23 | 广东工业大学 | 一种金属回转件恒压力打磨控制装置及控制方法 |
| JP2018001325A (ja) * | 2016-06-30 | 2018-01-11 | 株式会社荏原製作所 | ヘッド高さ調整装置およびヘッド高さ調整装置を備える基板処理装置 |
| CN106404230A (zh) * | 2016-10-12 | 2017-02-15 | 江苏汉生成科技有限公司 | 一种压力感测补偿系统 |
| JP6898079B2 (ja) * | 2016-11-16 | 2021-07-07 | 芝浦機械株式会社 | 工作機械およびその制御方法 |
| JP6749569B2 (ja) * | 2017-02-17 | 2020-09-02 | 東邦エンジニアリング株式会社 | 研磨装置のヘッド進退装置 |
| CN107263317B (zh) * | 2017-07-13 | 2019-04-09 | 东方电气(广州)重型机器有限公司 | 一种可调节预制磨削深度的限位装置 |
| JP6948878B2 (ja) * | 2017-08-22 | 2021-10-13 | ラピスセミコンダクタ株式会社 | 半導体製造装置及び半導体基板の研磨方法 |
| JP6986930B2 (ja) * | 2017-11-07 | 2021-12-22 | 株式会社荏原製作所 | 基板研磨装置および研磨方法 |
| JP6938346B2 (ja) * | 2017-11-21 | 2021-09-22 | 株式会社荏原製作所 | 弾性膜のヘッド本体への組み付け方法、組み付け治具、および組み付けシステム |
| JP2019198938A (ja) * | 2018-05-18 | 2019-11-21 | 株式会社荏原製作所 | 研磨ヘッドを用いて研磨パッドの研磨面を検出する方法、および研磨装置 |
| US12020946B2 (en) * | 2018-07-31 | 2024-06-25 | Taiwan Semiconductor Manufacturing Co., Ld. | Chemical mechanical polishing apparatus |
| CN110587456B (zh) * | 2019-09-27 | 2025-01-10 | 东莞市尚弘博实业有限公司 | 一种抛光设备 |
| CN112975749A (zh) * | 2019-12-17 | 2021-06-18 | 大量科技股份有限公司 | 抛光垫即时整修方法 |
| JP7406980B2 (ja) * | 2019-12-24 | 2023-12-28 | 株式会社荏原製作所 | 研磨ユニット、基板処理装置、および研磨方法 |
| CN111085931A (zh) * | 2019-12-31 | 2020-05-01 | 浙江芯晖装备技术有限公司 | 一种抛光头驱动装置及抛光设备 |
| JP7536601B2 (ja) | 2020-11-04 | 2024-08-20 | 株式会社荏原製作所 | 研磨ヘッドおよび研磨装置 |
| JP2022146880A (ja) * | 2021-03-22 | 2022-10-05 | 不二越機械工業株式会社 | ワーク研磨装置およびワーク研磨方法 |
| US20220388116A1 (en) * | 2021-06-04 | 2022-12-08 | Applied Materials, Inc. | Method of detecting chemical mechanical polishing conditioning disk orientation |
| CN113458972A (zh) * | 2021-07-28 | 2021-10-01 | 北京烁科精微电子装备有限公司 | 一种抛光垫修整装置及抛光设备 |
| CN114633206A (zh) * | 2022-04-25 | 2022-06-17 | 北京烁科精微电子装备有限公司 | 一种修整装置及晶圆抛光系统 |
| US20230356355A1 (en) * | 2022-05-03 | 2023-11-09 | Applied Materials, Inc. | Polishing head with local inner ring downforce control |
| CN117381659B (zh) * | 2023-10-13 | 2025-05-06 | 苏州铼铂机电科技有限公司 | 压力可测量可控制调节的半导体材料研磨加工夹具及加工方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6248462A (ja) * | 1985-08-27 | 1987-03-03 | Citizen Watch Co Ltd | 自動バフ機のドレスシステム |
| JPH05309559A (ja) * | 1992-05-12 | 1993-11-22 | Speedfam Co Ltd | 平面研磨方法及び装置 |
| JP3158934B2 (ja) * | 1995-02-28 | 2001-04-23 | 三菱マテリアル株式会社 | ウェーハ研磨装置 |
| US6024630A (en) * | 1995-06-09 | 2000-02-15 | Applied Materials, Inc. | Fluid-pressure regulated wafer polishing head |
| US5681215A (en) * | 1995-10-27 | 1997-10-28 | Applied Materials, Inc. | Carrier head design for a chemical mechanical polishing apparatus |
| JPH09168968A (ja) * | 1995-10-27 | 1997-06-30 | Applied Materials Inc | ケミカルメカニカルポリシング装置のキャリアヘッドのデザイン |
| JP2917992B1 (ja) * | 1998-04-10 | 1999-07-12 | 日本電気株式会社 | 研磨装置 |
| JP2000288928A (ja) * | 1999-03-31 | 2000-10-17 | Hitachi Seiki Co Ltd | 研磨盤の制御方法および研磨盤 |
| US6241593B1 (en) * | 1999-07-09 | 2001-06-05 | Applied Materials, Inc. | Carrier head with pressurizable bladder |
| JP2001096456A (ja) * | 1999-09-28 | 2001-04-10 | Toshiba Mach Co Ltd | ポリッシングヘッド |
| JP4056205B2 (ja) * | 1999-10-15 | 2008-03-05 | 株式会社荏原製作所 | ポリッシング装置および方法 |
| JP2001319903A (ja) * | 2000-05-11 | 2001-11-16 | Lapmaster Sft Corp | 研磨装置用チャック |
| JP2001334461A (ja) * | 2000-05-26 | 2001-12-04 | Ebara Corp | 研磨装置 |
| KR100939096B1 (ko) * | 2001-05-29 | 2010-01-28 | 가부시키가이샤 에바라 세이사꾸쇼 | 폴리싱장치, 폴리싱방법 및 기판캐리어 시스템 |
| JP4721574B2 (ja) * | 2001-08-29 | 2011-07-13 | 株式会社ディスコ | 研削装置の原点位置設定機構 |
| JP2004042174A (ja) * | 2002-07-10 | 2004-02-12 | Daisho Seiki Kk | 平面研削方法 |
| JP2004154874A (ja) * | 2002-11-05 | 2004-06-03 | Ebara Corp | ポリッシング装置及びポリッシング方法 |
-
2004
- 2004-11-01 JP JP2004318581A patent/JP4597634B2/ja not_active Expired - Lifetime
-
2005
- 2005-10-31 CN CNA2008101657960A patent/CN101585164A/zh active Pending
- 2005-10-31 CN CNB2005800375590A patent/CN100466191C/zh not_active Expired - Lifetime
-
2009
- 2009-02-02 JP JP2009021264A patent/JP5113777B2/ja not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102314082A (zh) * | 2010-06-28 | 2012-01-11 | 信越化学工业株式会社 | 用于制造电子级合成石英玻璃衬底的方法 |
| CN102314082B (zh) * | 2010-06-28 | 2016-01-20 | 信越化学工业株式会社 | 用于制造电子级合成石英玻璃衬底的方法 |
| CN103894921A (zh) * | 2014-03-26 | 2014-07-02 | 广东工业大学 | 一种高精密单面研磨机的上盘结构 |
| CN110352115A (zh) * | 2017-03-06 | 2019-10-18 | 应用材料公司 | 为cmp位置特定研磨(lsp)设计的螺旋及同心圆移动 |
| CN108032211A (zh) * | 2017-12-11 | 2018-05-15 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 气压检测装置及抛光设备 |
| CN108032211B (zh) * | 2017-12-11 | 2020-04-28 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 气压检测装置及抛光设备 |
| CN117161947A (zh) * | 2022-10-13 | 2023-12-05 | 北京特思迪半导体设备有限公司 | 用于晶圆批量抛光设备、下压力控制方法及设备 |
| CN117161947B (zh) * | 2022-10-13 | 2024-02-06 | 北京特思迪半导体设备有限公司 | 用于晶圆批量抛光设备、下压力控制方法及设备 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100466191C (zh) | 2009-03-04 |
| JP5113777B2 (ja) | 2013-01-09 |
| CN101053069A (zh) | 2007-10-10 |
| JP4597634B2 (ja) | 2010-12-15 |
| JP2009131955A (ja) | 2009-06-18 |
| JP2006128582A (ja) | 2006-05-18 |
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