CN101540341B - 薄膜晶体管 - Google Patents
薄膜晶体管 Download PDFInfo
- Publication number
- CN101540341B CN101540341B CN2009100079737A CN200910007973A CN101540341B CN 101540341 B CN101540341 B CN 101540341B CN 2009100079737 A CN2009100079737 A CN 2009100079737A CN 200910007973 A CN200910007973 A CN 200910007973A CN 101540341 B CN101540341 B CN 101540341B
- Authority
- CN
- China
- Prior art keywords
- semiconductor layer
- layer
- pair
- microcrystalline semiconductor
- film transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 120
- 239000004065 semiconductor Substances 0.000 claims abstract description 359
- 239000012535 impurity Substances 0.000 claims abstract description 115
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 47
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 47
- 239000010703 silicon Substances 0.000 claims abstract description 47
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 25
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 24
- 230000004888 barrier function Effects 0.000 claims description 33
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 10
- 229910052698 phosphorus Inorganic materials 0.000 claims description 10
- 239000011574 phosphorus Substances 0.000 claims description 10
- 239000010410 layer Substances 0.000 description 649
- 239000000758 substrate Substances 0.000 description 30
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 28
- 239000007789 gas Substances 0.000 description 26
- 238000004519 manufacturing process Methods 0.000 description 26
- 238000000034 method Methods 0.000 description 24
- 239000001257 hydrogen Substances 0.000 description 23
- 229910052739 hydrogen Inorganic materials 0.000 description 23
- 230000015572 biosynthetic process Effects 0.000 description 21
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 20
- 239000013078 crystal Substances 0.000 description 17
- 239000010408 film Substances 0.000 description 17
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 14
- 229910052757 nitrogen Inorganic materials 0.000 description 14
- 229910052760 oxygen Inorganic materials 0.000 description 14
- 239000001301 oxygen Substances 0.000 description 14
- 230000008569 process Effects 0.000 description 13
- 229910052782 aluminium Inorganic materials 0.000 description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 12
- 239000000969 carrier Substances 0.000 description 11
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 10
- 238000005229 chemical vapour deposition Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 238000000151 deposition Methods 0.000 description 9
- 230000008021 deposition Effects 0.000 description 9
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 9
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 8
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 8
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 8
- 238000004544 sputter deposition Methods 0.000 description 8
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 7
- 238000001678 elastic recoil detection analysis Methods 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 229910052750 molybdenum Inorganic materials 0.000 description 7
- 239000011733 molybdenum Substances 0.000 description 7
- 238000009832 plasma treatment Methods 0.000 description 7
- 229910000077 silane Inorganic materials 0.000 description 7
- 229910052719 titanium Inorganic materials 0.000 description 7
- 239000010936 titanium Substances 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 238000001069 Raman spectroscopy Methods 0.000 description 6
- 238000003917 TEM image Methods 0.000 description 6
- 230000005669 field effect Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 238000002425 crystallisation Methods 0.000 description 5
- 230000008025 crystallization Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229910052736 halogen Inorganic materials 0.000 description 5
- 150000002367 halogens Chemical class 0.000 description 5
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000370 acceptor Substances 0.000 description 4
- 229910021529 ammonia Inorganic materials 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000000737 periodic effect Effects 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 238000005001 rutherford backscattering spectroscopy Methods 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 3
- 238000001237 Raman spectrum Methods 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 125000004429 atom Chemical group 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000007865 diluting Methods 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 239000001307 helium Substances 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 3
- 150000002431 hydrogen Chemical class 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052754 neon Inorganic materials 0.000 description 3
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- 238000004380 ashing Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910000423 chromium oxide Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000005685 electric field effect Effects 0.000 description 2
- 229910052743 krypton Inorganic materials 0.000 description 2
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 230000010363 phase shift Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 150000003376 silicon Chemical class 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910019974 CrSi Inorganic materials 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910016006 MoSi Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 238000006124 Pilkington process Methods 0.000 description 1
- YZCKVEUIGOORGS-IGMARMGPSA-N Protium Chemical compound [1H] YZCKVEUIGOORGS-IGMARMGPSA-N 0.000 description 1
- OBNDGIHQAIXEAO-UHFFFAOYSA-N [O].[Si] Chemical compound [O].[Si] OBNDGIHQAIXEAO-UHFFFAOYSA-N 0.000 description 1
- 239000005407 aluminoborosilicate glass Substances 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052795 boron group element Inorganic materials 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005224 laser annealing Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 229960001730 nitrous oxide Drugs 0.000 description 1
- 235000013842 nitrous oxide Nutrition 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- 229910052990 silicon hydride Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0312—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
- H10D30/0316—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral bottom-gate TFTs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0321—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6732—Bottom-gate only TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
- H10D30/6739—Conductor-insulator-semiconductor electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
- H10D30/6743—Silicon
- H10D30/6746—Amorphous silicon
Landscapes
- Thin Film Transistor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008070451 | 2008-03-18 | ||
| JP2008070451 | 2008-03-18 | ||
| JP2008-070451 | 2008-03-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101540341A CN101540341A (zh) | 2009-09-23 |
| CN101540341B true CN101540341B (zh) | 2013-03-13 |
Family
ID=41087977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100079737A Expired - Fee Related CN101540341B (zh) | 2008-03-18 | 2009-03-06 | 薄膜晶体管 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US7821012B2 (https=) |
| JP (1) | JP5395471B2 (https=) |
| CN (1) | CN101540341B (https=) |
| TW (1) | TWI474486B (https=) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7812348B2 (en) * | 2008-02-29 | 2010-10-12 | Semiconductor Energy Laboratory Co., Ltd. | Thin-film transistor and display device |
| US7968880B2 (en) | 2008-03-01 | 2011-06-28 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor and display device |
| US7821012B2 (en) * | 2008-03-18 | 2010-10-26 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor |
| JP5411528B2 (ja) * | 2008-03-18 | 2014-02-12 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタ及び表示装置 |
| US8049215B2 (en) * | 2008-04-25 | 2011-11-01 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor |
| JP5436017B2 (ja) * | 2008-04-25 | 2014-03-05 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US8039842B2 (en) * | 2008-05-22 | 2011-10-18 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor and display device including thin film transistor |
| WO2009157573A1 (en) * | 2008-06-27 | 2009-12-30 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor, semiconductor device and electronic device |
| JP5509802B2 (ja) | 2009-11-13 | 2014-06-04 | ソニー株式会社 | 無線通信システム、無線通信装置、無線通信方法、およびプログラム |
| TWI535028B (zh) * | 2009-12-21 | 2016-05-21 | 半導體能源研究所股份有限公司 | 薄膜電晶體 |
| JP5445207B2 (ja) * | 2010-02-17 | 2014-03-19 | 三菱電機株式会社 | 薄膜トランジスタ及びその製造方法 |
| JP2011216864A (ja) * | 2010-03-15 | 2011-10-27 | Canon Inc | 半導体装置とその製造方法 |
| US20120282742A1 (en) * | 2010-03-15 | 2012-11-08 | Canon Kabushiki Kaisha | Semiconductor device and method for manufacturing the same |
| TWI545652B (zh) | 2011-03-25 | 2016-08-11 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| US8716708B2 (en) * | 2011-09-29 | 2014-05-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| TWI627483B (zh) | 2012-11-28 | 2018-06-21 | 半導體能源研究所股份有限公司 | 顯示裝置及電視接收機 |
| CN103107202B (zh) * | 2013-01-23 | 2016-04-27 | 深圳市华星光电技术有限公司 | 一种薄膜晶体管结构、液晶显示装置和一种制造方法 |
| US8912542B2 (en) | 2013-01-23 | 2014-12-16 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | TFT structure and LCD device |
| CN103199112B (zh) * | 2013-03-20 | 2017-02-15 | 北京京东方光电科技有限公司 | 一种阵列基板及其制备方法和显示面板 |
| US10328507B2 (en) * | 2013-12-30 | 2019-06-25 | Robert Bosch Tool Corporation | Airflow and illumination system for a table saw |
| JP7786373B2 (ja) * | 2020-07-07 | 2025-12-16 | Ｔｏｐｐａｎホールディングス株式会社 | 薄膜トランジスタ、薄膜トランジスタアレイおよび薄膜トランジスタの製造方法 |
| KR102885323B1 (ko) * | 2022-11-14 | 2025-11-11 | 엘지디스플레이 주식회사 | 표시 패널 및 표시장치 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1275813A (zh) * | 1993-03-12 | 2000-12-06 | 株式会社半导体能源研究所 | 晶体管及其制造方法 |
| US6515336B1 (en) * | 1999-09-17 | 2003-02-04 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistors having tapered gate electrode and taped insulating film |
| CN1532947A (zh) * | 1996-02-23 | 2004-09-29 | ��ʽ����뵼����Դ�о��� | 薄膜半导体、半导体器件以及薄膜晶体管的制造方法 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56122123A (en) | 1980-03-03 | 1981-09-25 | Shunpei Yamazaki | Semiamorphous semiconductor |
| JP2839529B2 (ja) | 1989-02-17 | 1998-12-16 | 株式会社東芝 | 薄膜トランジスタ |
| US5221631A (en) | 1989-02-17 | 1993-06-22 | International Business Machines Corporation | Method of fabricating a thin film transistor having a silicon carbide buffer layer |
| EP0535979A3 (en) | 1991-10-02 | 1993-07-21 | Sharp Kabushiki Kaisha | A thin film transistor and a method for producing the same |
| JPH05129608A (ja) | 1991-10-31 | 1993-05-25 | Sharp Corp | 半導体装置 |
| JPH05107560A (ja) * | 1991-10-21 | 1993-04-30 | Hitachi Ltd | 液晶表示装置とその製造方法 |
| JPH05190857A (ja) * | 1992-01-10 | 1993-07-30 | Toshiba Corp | 薄膜トランジスタ |
| US5473168A (en) | 1993-04-30 | 1995-12-05 | Sharp Kabushiki Kaisha | Thin film transistor |
| KR950000937U (ko) | 1993-06-30 | 1995-01-03 | 운전식 균형장치 | |
| JPH07131030A (ja) | 1993-11-05 | 1995-05-19 | Sony Corp | 表示用薄膜半導体装置及びその製造方法 |
| JPH08201851A (ja) | 1995-01-31 | 1996-08-09 | Sharp Corp | アクティブマトリクス基板 |
| US5920772A (en) | 1997-06-27 | 1999-07-06 | Industrial Technology Research Institute | Method of fabricating a hybrid polysilicon/amorphous silicon TFT |
| KR100257158B1 (ko) * | 1997-06-30 | 2000-05-15 | 김영환 | 박막 트랜지스터 및 그의 제조 방법 |
| JP2001053283A (ja) | 1999-08-12 | 2001-02-23 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
| TW577176B (en) | 2003-03-31 | 2004-02-21 | Ind Tech Res Inst | Structure of thin-film transistor, and the manufacturing method thereof |
| JP4748954B2 (ja) | 2003-07-14 | 2011-08-17 | 株式会社半導体エネルギー研究所 | 液晶表示装置 |
| JP5159021B2 (ja) | 2003-12-02 | 2013-03-06 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| TWI372463B (en) | 2003-12-02 | 2012-09-11 | Semiconductor Energy Lab | Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device |
| KR101050351B1 (ko) | 2004-09-24 | 2011-07-19 | 엘지디스플레이 주식회사 | 박막트랜지스터 및 그 제조방법 |
| WO2007080575A1 (en) * | 2006-01-09 | 2007-07-19 | Technion Research And Development Foundation Ltd. | Transistor structures and methods of fabrication thereof |
| JP2008091599A (ja) | 2006-10-02 | 2008-04-17 | Sony Corp | 薄膜トランジスタおよびその製造方法ならびに表示装置 |
| JP2008140984A (ja) * | 2006-12-01 | 2008-06-19 | Sharp Corp | 半導体素子、半導体素子の製造方法、及び表示装置 |
| US7812348B2 (en) | 2008-02-29 | 2010-10-12 | Semiconductor Energy Laboratory Co., Ltd. | Thin-film transistor and display device |
| US7786485B2 (en) | 2008-02-29 | 2010-08-31 | Semicondutor Energy Laboratory Co., Ltd. | Thin-film transistor and display device |
| US7821012B2 (en) | 2008-03-18 | 2010-10-26 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor |
| US8049215B2 (en) | 2008-04-25 | 2011-11-01 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor |
| US8039842B2 (en) | 2008-05-22 | 2011-10-18 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor and display device including thin film transistor |
-
2009
- 2009-03-04 US US12/397,460 patent/US7821012B2/en not_active Expired - Fee Related
- 2009-03-06 TW TW98107350A patent/TWI474486B/zh not_active IP Right Cessation
- 2009-03-06 CN CN2009100079737A patent/CN101540341B/zh not_active Expired - Fee Related
- 2009-03-13 JP JP2009060636A patent/JP5395471B2/ja not_active Expired - Fee Related
-
2010
- 2010-10-06 US US12/899,089 patent/US8207538B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1275813A (zh) * | 1993-03-12 | 2000-12-06 | 株式会社半导体能源研究所 | 晶体管及其制造方法 |
| CN1532947A (zh) * | 1996-02-23 | 2004-09-29 | ��ʽ����뵼����Դ�о��� | 薄膜半导体、半导体器件以及薄膜晶体管的制造方法 |
| US6515336B1 (en) * | 1999-09-17 | 2003-02-04 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistors having tapered gate electrode and taped insulating film |
Also Published As
| Publication number | Publication date |
|---|---|
| US8207538B2 (en) | 2012-06-26 |
| US7821012B2 (en) | 2010-10-26 |
| JP5395471B2 (ja) | 2014-01-22 |
| TWI474486B (zh) | 2015-02-21 |
| TW201001713A (en) | 2010-01-01 |
| CN101540341A (zh) | 2009-09-23 |
| US20090236601A1 (en) | 2009-09-24 |
| JP2009260294A (ja) | 2009-11-05 |
| US20110017992A1 (en) | 2011-01-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101540341B (zh) | 薄膜晶体管 | |
| JP5595003B2 (ja) | 表示装置 | |
| US8049215B2 (en) | Thin film transistor | |
| KR102095938B1 (ko) | 표시 장치 | |
| US7842586B2 (en) | Plasma CVD apparatus, method for manufacturing microcrystalline semiconductor layer, and method for manufacturing thin film transistor | |
| US5834071A (en) | Method for forming a thin film transistor | |
| JP5542364B2 (ja) | 薄膜トランジスタの作製方法 | |
| CN103026492B (zh) | 薄膜晶体管器件以及薄膜晶体管器件的制造方法 | |
| KR101991834B1 (ko) | 박막 트랜지스터, 디스플레이 기판 및 이를 가지는 디스플레이 패널, 및 그 제조 방법 | |
| JP5595004B2 (ja) | 表示装置 | |
| WO2010001998A1 (ja) | 配線構造、薄膜トランジスタ基板およびその製造方法、並びに表示装置 | |
| US20100237355A1 (en) | Thin film transistor, method for manufacturing thin film transistor, and display device | |
| US7871872B2 (en) | Method of manufacturing thin film transistor having lightly doped drain regions | |
| US8598584B2 (en) | Thin-film transistor device and method of manufacturing the same | |
| CN101478004B (zh) | 薄膜晶体管、半导体装置及电子设备 | |
| KR20040039730A (ko) | 다결정 실리콘막 형성방법과 이를 포함한박막트랜지스터의 제조방법 | |
| JP2013105873A (ja) | 薄膜トランジスタ | |
| JP5066361B2 (ja) | 薄膜トランジスタ及びその製造方法 | |
| JP2010177325A (ja) | 薄膜トランジスターの製造方法 | |
| JP5543116B2 (ja) | 半導体装置 | |
| JP5307992B2 (ja) | 表示装置の生産方法 | |
| KR20060041020A (ko) | 박막 트랜지스터 및 박막 트랜지스터 표시판의 제조방법과 이를 통하여 제조한 박막 트랜지스터 표시판 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130313 Termination date: 20190306 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |