CN101482252B - 一种对流散热式led照明灯 - Google Patents

一种对流散热式led照明灯 Download PDF

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CN101482252B
CN101482252B CN2008102041725A CN200810204172A CN101482252B CN 101482252 B CN101482252 B CN 101482252B CN 2008102041725 A CN2008102041725 A CN 2008102041725A CN 200810204172 A CN200810204172 A CN 200810204172A CN 101482252 B CN101482252 B CN 101482252B
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led
sink unit
pedestal
head lamp
heat
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CN101482252A (zh
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陈必寿
王鹰华
邱永红
李晟
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Shanghai Sansi Technology Co Ltd
Pujiang Sansi Optoelectronics Technology Co Ltd
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Priority to ES09831394.3T priority patent/ES2583640T3/es
Priority to PCT/CN2009/070109 priority patent/WO2010066117A1/zh
Priority to EP09831394.3A priority patent/EP2365246B1/en
Priority to US12/934,995 priority patent/US20110051415A1/en
Priority to JP2011523291A priority patent/JP5628805B2/ja
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

一种对流散热式LED照明灯，包括若干LED发光散热单元、安装发光散热单元的基座以及框架；基座与框架固定连接，其中：所述的基座为若干条状体，彼此按一定间距排列，或呈一网格状体，形成镂空结构，以此该基座上形成若干可以和外界空气直接对流的通道，所述的条状体或网格状结构上间隔设置LED发光散热单元；所述的LED发光散热单元包括LED芯片、线路板、电路接驳件及相应的散热器，并构成独立的防水密封体。本发明具有良好的防潮、防水性能；散热性能优异，模块化结构，便于组装、生产和现场维护。

Description

一种对流散热式LED照明灯
技术领域
本发明涉及一种LED照明灯，特别涉及一种通过对流方式散热的LED照明灯。
背景技术
目前的LED照明灯，通常采用整体密封、整体散热的技术，即多颗小功率LED按一定间隔直接焊接固定在一块线路板上，然后固定在一块散热板或者灯具整体的散热外壳上，从而实现LED的散热；为了防潮防水，灯具正面再加一个玻璃(或其它透明材料)面罩。如中国发明专利号200720050776.X公开的“一种LED照明灯”，其包括有防护外罩和一块铝基板，铝基板上预置有LED芯片。
上述结构的LED照明灯存在如下缺陷：
多个小功率LED共用一个散热器使得热量过于集中、大量热量被密封在玻璃(或其它透明材料)面罩内，从而使得散热效果差，势必会影响LED的发光效率和使用寿命。或者通过进一步加大散热器来改善散热效果，从而使得灯具重量过大、成本上升。同时这种整体结构也不便于更换LED器件或部件，增加了灯具光源部分生产和维修的复杂程度，造成低效率高成本。
发明内容
本发明的目的在于提供一种对流散热式LED照明灯，具有良好的防潮、防水性能；散热性能优异，模块化结构，便于组装、生产和现场维护。
为达到上述目的，本发明的技术方案是，
一种对流散热式LED照明灯，包括若干LED发光散热单元、安装发光散热单元的基座以及框架；基座与框架固定连接，其中：所述的基座为若干条状体，彼此按一定间距排列，或呈一网格状体，形成镂空结构，以此该基座上形成若干可以和外界空气直接对流的通道，所述的条状体或网格状结构上间隔设置LED发光散热单元；所述的LED发光散热单元包括LED芯片、线路板、电路接驳件及相应的散热器，并构成独立的防水密封体。
另外，所述的LED发光散热单元的电路接驳件为从其底部引出的电极引线，该电极引线经基座上安装发光散热单元的另一端面开设的凹槽引至电源接插件。
所述的电极引线置于所述凹槽后用胶体固定密封。
再有，所述的凹槽为条形凹槽。
又，所述的LED发光散热单元的散热器一端面开有供放置LED芯片和线路板的容置部。
另外，本发明所述的LED芯片上方设置有一透镜，并与发光散热单元整体防水密封。
所述的基座由金属材料制成。
本发明的有益效果：
本发明由于每个发光单元线路基板的独立分布和安装基座的间隔镂空排列，使整体形成一种通透结构，没有防护罩，与外界形成有效的对流散热通道。而每个LED发光散热单元均是单独密封，从而可以有效防潮防水。而基座为若干条状体，有利于模块化生产，便于组装生产和现场维护。
本发明各部件独立密封(各个发光散热单元独立密封、线路板及电缆独立密封)，每个发光散热单元表面均能与外界空气直接接触从而分别散热，从而将整个LED灯具的散热分解成多个LED发光单元的独立散热，在采用相同铝材的情况下增加了散热表面积。    
在结构强度许可的情况下，可以将几乎无穷多的LED发光散热单元组合在一起，组装成单盏功率极大的LED照明灯。在由于散热技术所限单颗LED功率的上限受到很大限制的情况下，提供了一种更大功率的具有防水性能的LED照明灯的实现方法。
附图说明
图1为本发明一实施例的结构示意图；
图2为本发明基座的结构示意图；
图3为本发明发光散热单元的立体示意图；
图4为本发明发光散热单元的结构剖视图；
图5为本发明基座的另一结构形式的示意图。
具体实施方式
参见图1～图4，本发明的对流散热式LED照明灯，包括若干LED发光散热单元1、安装发光散热单元1的基座2以及框架4；基座2与框架4固定连接；
其中，所述的基座2为若干条状体，彼此按一定间距排列，形成镂空结构，以此该基座2上形成若干可以和外界空气直接对流的通道，所述的条状体上间隔设置LED发光散热单元1；所述的LED发光散热单元1分别以可独立地接触外界空气从而分别散热。
所述的LED发光散热单元1包括LED芯片11、线路板3、电路接驳件14(本实施例为正负极引线)及相应的散热器12，并构成独立的防水密封体。所述的线路板3独立防水密封。
所述的LED发光散热单元1的电路接驳件14为从其底部引出的电极引线，该电极引线经基座2上安装LED发光散热单元1的另一端面开设的凹槽21引至电源接插件14；所述的电极引线置于所述凹槽21后用胶体固定密封；该凹槽21为条形凹槽。
又，所述的LED发光散热单元1的散热器12一端面开有供放置LED芯片1和线路板3的容置部121。所述的LED芯片11上方设置有一透镜13，并与LED发光散热单元1整体防水密封。该透镜13既能通过密封材料起到密封线路板3的目的，也能有效调节LED的发光分布。
所述的基座2由金属材料制成。
参见图5，本发明所述的基座2还可以为一网格状结构。该网格状结构上间隔设置LED发光散热单元1。

Claims (8)

1.一种对流散热式LED照明灯，包括若LED发光散热单元(1)、安装发光散热单元的基座(2)以及框架(4)；基座(2)与框架(4)固定连接，其特征在于：
所述的基座(2)为若干条状体，彼此按一定间距排列，或呈一网格状体，形成镂空结构；以此该基座(2)上形成若干可以和外界空气直接对流的通道，所述的条状体或网格状结构上间隔设置LED发光散热单元(1)；所述的基座上安装发光散热单元的另一端面开设的凹槽(21)；所述基座(2)在其凹槽(21)的两侧壁间隔设置有若干的凹口；
所述的LED发光散热单元包括LED芯片(11)、线路板(3)、电路接驳件(14)及相应的散热器(12)，并构成独立的防水密封体。
2.如权利要求1所述的对流散热式LED照明灯，其特征在于，所述的LED发光散热单元(1)在基座(2)上阵列排列，形成方形、圆形、椭圆形、梯形、六边形或梅花形。
3.如权利要求1所述的对流散热式LED照明灯，其特征在于，所述的LED发光散热单元的电路接驳件(14)为从其底部引出的电极引线，该电极引线经所述的基座上安装发光散热单元的另一端面开设的凹槽(21)引至电源接插件。
4.如权利要求3所述的对流散热式LED照明灯，其特征在于，所述的电极引线置于所述凹槽(21)后用胶体固定密封。
5.如权利要求3或4所述的对流散热式LED照明灯，其特征在于，所述的凹槽(21)为条形凹槽。
6.如权利要求1所述的对流散热式LED照明灯，其特征在于，所述的LED发光散热单元(1)的散热器(12)一端面开有供放置LED芯片(11)和线路板(3)的容置部(121)。
7.如权利要求1所述的对流散热式LED照明灯，其特征在于，所述的LED芯片(11)上方罩设一透镜(13)，并与发光散热单元(1)整体防水密封。
8.如权利要求1所述的对流散热式LED照明灯，其特征在于，所述的基座(2)由金属材料制成。
CN2008102041725A 2008-12-08 2008-12-08 一种对流散热式led照明灯 Active CN101482252B (zh)

Priority Applications (7)

Application Number Priority Date Filing Date Title
CN2008102041725A CN101482252B (zh) 2008-12-08 2008-12-08 一种对流散热式led照明灯
PCT/CN2009/070109 WO2010066117A1 (zh) 2008-12-08 2009-01-12 一种对流散热式led照明灯
EP09831394.3A EP2365246B1 (en) 2008-12-08 2009-01-12 Convective heat-dissipating led illumination lamp
US12/934,995 US20110051415A1 (en) 2008-12-08 2009-01-12 Convective heat-dissipating LED illumination lamp
ES09831394.3T ES2583640T3 (es) 2008-12-08 2009-01-12 Lámpara de iluminación de LED de disipación del calor por convección
JP2011523291A JP5628805B2 (ja) 2008-12-08 2009-01-12 対流放熱式ｌｅｄ照明ランプ
CY20161100714T CY1118155T1 (el) 2008-12-08 2016-07-20 Λαμπτηρας φωτισμου led μεταφερομενης απαγωγης θερμοτητας

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CY (1) CY1118155T1 (zh)
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CN101706074B (zh) * 2009-11-28 2011-08-17 滁州恒恩光电科技有限公司 模块化可组装led路灯
KR101641860B1 (ko) * 2010-05-12 2016-07-29 엘지이노텍 주식회사 발광소자 어레이, 조명장치 및 백라이트 장치
CN102155716A (zh) * 2011-04-03 2011-08-17 东莞勤上光电股份有限公司 一种led散热器
CN103032704B (zh) * 2011-09-30 2016-02-03 深圳市邦贝尔电子有限公司 Led灯
CN102392995B (zh) * 2011-11-18 2016-01-27 深圳市华星光电技术有限公司 一种背板、背光模组及液晶显示装置
CN104170106A (zh) * 2012-03-15 2014-11-26 松下电器产业株式会社 Led用基板、led模块和led灯
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JP5628805B2 (ja) 2014-11-19
CY1118155T1 (el) 2017-06-28
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JP2012500457A (ja) 2012-01-05
WO2010066117A1 (zh) 2010-06-17

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