CN101481468B - 具有高填料含量的硅烷制剂 - Google Patents
具有高填料含量的硅烷制剂 Download PDFInfo
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- CN101481468B CN101481468B CN200910003714.7A CN200910003714A CN101481468B CN 101481468 B CN101481468 B CN 101481468B CN 200910003714 A CN200910003714 A CN 200910003714A CN 101481468 B CN101481468 B CN 101481468B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/28—Compounds of silicon
- C09C1/30—Silicic acid
- C09C1/3081—Treatment with organo-silicon compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/36—Compounds of titanium
- C09C1/3607—Titanium dioxide
- C09C1/3684—Treatment with organo-silicon compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/40—Compounds of aluminium
- C09C1/407—Aluminium oxides or hydroxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/51—Particles with a specific particle size distribution
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
Abstract
Description
Claims (19)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10330020A DE10330020A1 (de) | 2003-07-03 | 2003-07-03 | Hochgefüllte Silan-Zubereitung |
DE10330020.1 | 2003-07-03 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200480019036.9A Division CN1816590B (zh) | 2003-07-03 | 2004-05-14 | 具有高填料含量的硅烷制剂 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101481468A CN101481468A (zh) | 2009-07-15 |
CN101481468B true CN101481468B (zh) | 2011-12-14 |
Family
ID=33521299
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200480019036.9A Expired - Fee Related CN1816590B (zh) | 2003-07-03 | 2004-05-14 | 具有高填料含量的硅烷制剂 |
CN200910003714.7A Expired - Fee Related CN101481468B (zh) | 2003-07-03 | 2004-05-14 | 具有高填料含量的硅烷制剂 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200480019036.9A Expired - Fee Related CN1816590B (zh) | 2003-07-03 | 2004-05-14 | 具有高填料含量的硅烷制剂 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8119730B2 (zh) |
EP (1) | EP1641867A1 (zh) |
JP (1) | JP2009513741A (zh) |
CN (2) | CN1816590B (zh) |
DE (1) | DE10330020A1 (zh) |
WO (1) | WO2005003218A1 (zh) |
Families Citing this family (49)
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DE102004031785A1 (de) * | 2004-07-01 | 2006-01-26 | Degussa Ag | Polyol enthaltende Siliciumdioxid-Dispersion |
DE102005004872A1 (de) * | 2005-02-03 | 2006-08-10 | Degussa Ag | Wässrige Emulsionen von funktionellen Alkoxysilanen und deren kondensierten Oligomeren, deren Herstellung und Verwendung zur Oberflächenbehandlung |
DE102005032427A1 (de) * | 2005-07-12 | 2007-01-18 | Degussa Ag | Aluminiumoxid-Dispersion |
DE102006006656A1 (de) * | 2005-08-26 | 2007-03-01 | Degussa Ag | Silan enthaltendes Bindemittel für Verbundwerkstoffe |
DE102006006655A1 (de) * | 2005-08-26 | 2007-03-01 | Degussa Ag | Cellulose- bzw. lignocellulosehaltige Verbundwerkstoffe auf der Basis eines auf Silan basierenden Komposits als Bindemittel |
DE102005052938A1 (de) * | 2005-11-03 | 2007-05-10 | Degussa Gmbh | Verfahren zur Beschichtung von Substraten mit Beschichtungssystemen enthaltend reaktive hydrophobe anorganische Füllstoffe |
DE102005053071A1 (de) * | 2005-11-04 | 2007-05-16 | Degussa | Verfahren zur Herstellung von ultrafeinen Pulvern auf Basis Polymaiden, ultrafeinen Polyamidpulver sowie deren Verwendung |
DE102006003956A1 (de) * | 2006-01-26 | 2007-08-02 | Degussa Gmbh | Korrossionsschutzschicht auf Metalloberflächen |
US7885668B2 (en) | 2006-01-31 | 2011-02-08 | Microsoft Corporation | Determining the network location of a user device based on transmitter fingerprints |
DE102006013090A1 (de) * | 2006-03-20 | 2007-09-27 | Georg-August-Universität Göttingen | Kompositwerkstoff aus Holz und thermoplastischem Kunststoff |
DE102006017592A1 (de) * | 2006-04-13 | 2007-10-18 | Wacker Chemie Ag | Rheologiesteuerung stark basischer Flüssigkeiten |
DE102006017701A1 (de) * | 2006-04-15 | 2007-10-25 | Degussa Gmbh | Silicium-Titan-Mischoxidpulver, Dispersion hiervon und daraus hergestellter titanhaltiger Zeolith |
DE102006020987A1 (de) * | 2006-05-04 | 2007-11-08 | Degussa Gmbh | Dispersion von pyrogen hergestelltem Siliciumdioxid |
DE102006027480A1 (de) * | 2006-06-14 | 2008-01-10 | Evonik Degussa Gmbh | Kratz- und abriebfeste Beschichtungen auf polymeren Oberflächen |
DE102006039269A1 (de) * | 2006-08-22 | 2008-02-28 | Evonik Degussa Gmbh | Dispersion von Aluminiumoxid, Beschichtungszusammensetzung und tintenaufnehmendes Medium |
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JP5194563B2 (ja) * | 2007-05-28 | 2013-05-08 | 信越化学工業株式会社 | 耐擦傷性コーティング組成物、及び被覆物品 |
DE102007038314A1 (de) | 2007-08-14 | 2009-04-16 | Evonik Degussa Gmbh | Verfahren zur kontrollierten Hydrolyse und Kondensation von Epoxy-funktionellen Organosilanen sowie deren Condensation mit weiteren organofunktionellen Alkoxysilanen |
DE102007040246A1 (de) * | 2007-08-25 | 2009-02-26 | Evonik Degussa Gmbh | Strahlenhärtbare Formulierungen |
DE102008007261A1 (de) | 2007-08-28 | 2009-03-05 | Evonik Degussa Gmbh | Wässrige Silansysteme basierend auf Bis(trialkoxysilyalkyl)aminen |
DE102007045186A1 (de) * | 2007-09-21 | 2009-04-09 | Continental Teves Ag & Co. Ohg | Rückstandsfreies, schichtbildendes, wässriges Versiegelungssystem für metallische Oberflächen auf Silan-Basis |
DE102007049743A1 (de) * | 2007-10-16 | 2009-04-23 | Evonik Degussa Gmbh | Silicium-Titan-Mischoxidpulver, Dispersion hiervon und daraus hergestellter titanhaltiger Zeolith |
DE102007060376B3 (de) * | 2007-12-12 | 2009-04-23 | Kronotec Ag | Verfahren zum Funktionalisieren von Korund |
CN102341463B (zh) * | 2009-03-13 | 2014-06-11 | 阿克佐诺贝尔化学国际公司 | 硅烷化二氧化硅水分散体 |
DE102009017822A1 (de) | 2009-04-20 | 2010-10-21 | Evonik Degussa Gmbh | Wässrige Silansysteme basierend auf Tris(alkoxysilylalkyl)aminen und deren Verwendung |
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ATE366279T1 (de) * | 2001-03-30 | 2007-07-15 | Degussa | Siliciumorganische nano-mikrohybridsysteme oder mikrohybridsysteme enthaltende zusammensetzung für kratz- und abriebfeste beschichtungen |
TWI242584B (en) * | 2001-07-03 | 2005-11-01 | Lord Corp | High thermal conductivity spin castable potting compound |
DE10132942A1 (de) | 2001-07-06 | 2003-01-23 | Degussa | Siloxan-Oligomere, Verfahren zu deren Herstellung und deren Verwendung |
DE10141687A1 (de) * | 2001-08-25 | 2003-03-06 | Degussa | Siliciumverbindungen enthaltendes Mittel zur Beschichtung von Oberflächen |
DE10151264A1 (de) | 2001-10-17 | 2003-04-30 | Degussa | Aminoalkylalkoxysiloxanhaltige Gemische, deren Herstellung und deren Verwendung |
DE10212523A1 (de) | 2002-03-21 | 2003-10-02 | Degussa | Lufttrocknende, silanhaltige Beschichtungsmittel |
-
2003
- 2003-07-03 DE DE10330020A patent/DE10330020A1/de not_active Withdrawn
-
2004
- 2004-05-14 WO PCT/EP2004/050812 patent/WO2005003218A1/en active Application Filing
- 2004-05-14 JP JP2006518188A patent/JP2009513741A/ja not_active Withdrawn
- 2004-05-14 CN CN200480019036.9A patent/CN1816590B/zh not_active Expired - Fee Related
- 2004-05-14 US US10/563,022 patent/US8119730B2/en not_active Expired - Fee Related
- 2004-05-14 CN CN200910003714.7A patent/CN101481468B/zh not_active Expired - Fee Related
- 2004-05-14 EP EP04741577A patent/EP1641867A1/en not_active Withdrawn
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US5164501A (en) * | 1988-07-11 | 1992-11-17 | Degussa Ag | Method of preparing pure 3-butenyl triorganooxysilanes, the intermediate products 3,4-dichlorobutyl triorganooxysilanes and use of the final products |
CN1121044A (zh) * | 1994-06-01 | 1996-04-24 | 瓦克化学有限公司 | 无机氧化物的甲硅烷基化方法 |
US6054651A (en) * | 1996-06-21 | 2000-04-25 | International Business Machines Corporation | Foamed elastomers for wafer probing applications and interposer connectors |
CN1328504A (zh) * | 1998-07-09 | 2001-12-26 | 格雷斯公司 | 适用于吸墨性涂料的配制剂 |
Also Published As
Publication number | Publication date |
---|---|
DE10330020A1 (de) | 2005-01-20 |
CN1816590B (zh) | 2010-05-26 |
US8119730B2 (en) | 2012-02-21 |
US20070110906A1 (en) | 2007-05-17 |
CN1816590A (zh) | 2006-08-09 |
WO2005003218A1 (en) | 2005-01-13 |
EP1641867A1 (en) | 2006-04-05 |
CN101481468A (zh) | 2009-07-15 |
JP2009513741A (ja) | 2009-04-02 |
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