CN101460016B - 制造控制器的电路板组件的方法 - Google Patents

制造控制器的电路板组件的方法 Download PDF

Info

Publication number
CN101460016B
CN101460016B CN2008101846727A CN200810184672A CN101460016B CN 101460016 B CN101460016 B CN 101460016B CN 2008101846727 A CN2008101846727 A CN 2008101846727A CN 200810184672 A CN200810184672 A CN 200810184672A CN 101460016 B CN101460016 B CN 101460016B
Authority
CN
China
Prior art keywords
circuit board
printed circuit
pcb
slit
power key
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2008101846727A
Other languages
English (en)
Other versions
CN101460016A (zh
Inventor
严晓
T·J·伯格赫尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Danfoss Power Solutions Inc
Original Assignee
Sol Danfoss
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sol Danfoss filed Critical Sol Danfoss
Publication of CN101460016A publication Critical patent/CN101460016A/zh
Application granted granted Critical
Publication of CN101460016B publication Critical patent/CN101460016B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09172—Notches between edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

一种制造控制器的电路板组件的方法。该方法包括：提供第一和第二印刷电路板，其中第一印刷电路板具有其中包含缝隙的多个铜垫，这些铜垫相应于第二印刷电路板中的多个动力键片。动力键片然后滑入缝隙并且用铜淹没键片。此时，动力键片焊接在缝隙内以在第一和第二电路板之间提供电连接，这允许在板之间传输大于3安培的电流。

Description

制造控制器的电路板组件的方法
技术领域
本发明涉及控制器的电路板组件。更具体地，本发明涉及制造使用榫眼和榫类型连接的电路板组件的方法。
背景技术
将较高的电流(大于3安培)传输进出机器控制器的需要一直在增长。更重要的是，与主要设计通用产品的机器控制相比照，在动力管理的很多应用中也存在着需要。这些应用包括滑移转向装载机、履带式装载机、垃圾车和定向钻头。要控制设备的类型包括高强度发光体、警告信标、燃料电磁阀、刮水器电动机和座椅加热器。这些类型的元件存在于大多应用上并且通过将这些元件加入车辆控制系统会引起额外的自动化、定时特点并且减少熔融的需要。
对于管理这些高动力需要的控制器，电流必须被带入电路板。经常主电路存在于由于封闭设计而垂直于连接器板的PCB(印刷电路板)上。为了将主板与连接器板相连接，通常使用直角连接器。然而，大多直角连接器不能在不牺牲板空间之下承载大量电流。
电路板中存在的另一情况是要最小化在传输电流时产生的热量。一个解决方案是在主板和连接器板之间提供连接的定制铜键片。然而，这个解决方案将显得非常昂贵。因而，本领域需要一种成本有效的制造电路板组件的方法，其最小化由于大量电流在主板和连接器板之间经过而产生的热量。
发明内容
因而，本发明的主要目的是提供一种在两个印刷电路板之间传输大于3安培电流的电路板组件。
本发明的又一目的是提供一种成本有效的制造电路板组件的方法。
本发明的另一目的是提供一种在电流从主板传输至连接器板期间产生最小热量的电路板组件。
本发明的这些和其它目的、特点或优点从说明书中将变得明显。
为了达到上述目的，本发明提出了一种制造控制器的电路板组件的方法。该方法包括：提供其中具有多个铜垫的第一印刷电路板，其中每个铜垫具有贯穿其中地布置的缝隙。然后提供具有与铜垫(具体地第一印刷电路板的铜垫内的缝隙)相应的多个动力键片的第二印刷电路板。第二印刷电路板的动力键片然后滑动穿过第一印刷电路板的缝隙以在第一和第二电路板之间提供电连接，其中电流能从第一印刷电路板经过至第二印刷电路板。然后用铜将所述多个动力键片淹没至第二印刷电路板的边缘，以最大化第一印刷电路板和第二印刷电路板之间的电流承载能力。最后，动力键片焊接至铜垫以完成第一和第二印刷电路板之间的连接。
附图说明
图1是电路板组件的侧面透视图；
图2是第一印刷电路板的侧面图；
图3是第二印刷电路板的侧面图，并且
图4是第一和第二印刷电路板之间连接的侧面截面图。
具体实施方式
图1示出电路板组件10，其由第一印刷电路板12和第二印刷电路板14组成。在优选实施例中，第一印刷电路板12被认为是主板，而第二印刷电路板14被认为是连接器板。第一和第二印刷电路板12、14如现有技术已知的那样印刷。
第一印刷电路板12具有细长主体16，其具有带边缘18的第一和第二侧17a和17b。边缘18包括多个由此延伸的铜垫20。这些铜垫20具有贯穿其中地布置的缝隙22。优选实施例中的缝隙22是电镀的；然而，为了最小化成本不是必须要电镀。类似地，根据成本限制，铜垫20可以电镀或不电镀。每个铜垫20另外具有基部24，其中在基部24附近提供底切半径26以增强焊接。
第二印刷电路板14也具有带边缘30的细长主体28。边缘30具有多个布置于其中的腔室32，其相应于第一印刷电路板12的铜垫20。这些腔室30具有布置于其中的动力键片34，在优选实施例中，其由铜制成。而且，优选地动力键片34不具有焊接掩模以使得铜暴露以焊接至第一印刷电路板12。非常类似于第一印刷电路板的铜垫20，第二印刷电路板14的动力键片34具有基部36，其中底切半径38定位于基部36附近以增强焊接。
因此，第一和第二印刷电路板12、14设计为使得动力键片34布置为通过缝隙22以便以直角连接第一和第二印刷电路板12、14，并且在其中没有另外的连接之下完全地支撑所述连接。虽然能够存在另外的连接，但是在本设计中另外的连接点是不需要的并且因而与其它这种连接相比提供了成本节省。在动力键片36滑入缝隙22中时，多个焊接点40如图4最佳地所示那样存在。
在制造过程期间，第二印刷电路板14或连接器板首先组装并且然后回流焊。焊剂然后在第一印刷电路板12的第一侧17a上放置于缝隙22上并遍布。操作者然后使第二印刷电路板14的动力键片34滑动通过第一印刷电路板12的缝隙22，因而将焊剂推至第一印刷电路板12的第二侧17b。因此，动力键片34必须具有一定的长度以使得它们足够的短以利用被推动通过的焊剂，但是也不是太短以致于通过布置通过缝隙22而产生的连接松脱。
一旦动力键片34滑动通过缝隙22，第一印刷电路板12保持与第二印刷电路板14垂直。而任选地，能承载输入和输出信号的直角连接能用来保持第一和第二印刷电路板12、14互相垂直，这些是不必要的。
一旦动力键片34布置为通过缝隙22，第二印刷电路板14或连接器板然后再次与第一印刷电路板12或主板回流焊。这时，为了最大化这个设计的电流承载能力和可焊接性，动力键片34用铜淹没至第二印刷电路板14的边缘30。
最后，动力键片34焊接于缝隙22内以便完成连接。如图4最佳地所示，键片和缝隙仔细地设计来确保第一和第二印刷电路板12、14的顶层和底层都焊接在一起，每个键片总共四个焊接点40。具体地，第一和第二印刷电路板12、14内的底切半径26、38提高了可焊接性并且在组装时确保了尺寸可重复性。
最终结果是两个分离印刷电路板的连接，其中这两个板之间的连接还显示了板之间的电连接以使得高电流(比如那些大于3安培的电流)传输通过板。这个连接和制造工艺不仅价廉而且可重复。而且，由于电路板组件10的结果产生的热量最小，并且因此至少已经实现了所有所述目的。
本领域技术人员将理解到，在不偏离本发明精神和范围之下能对设备做出各种其它变型。所有这些变型和变化落入权利要求的范围并且因而将由其覆盖。

Claims (13)

1.一种制造控制器的电路板组件的方法，其步骤包括：
提供具有多个铜垫的第一印刷电路板，多个铜垫中的至少一个铜垫布置有缝隙；
提供具有与所述多个铜垫相应的多个动力键片的第二印刷电路板；
滑动至少一个动力键片穿过缝隙以在第一和第二电路板之间提供电连接，其中电流从第一印刷电路板经过至第二印刷电路板；并且
用铜将所述多个动力键片淹没至第二印刷电路板的边缘以最大化第一印刷电路板和第二印刷电路板之间的电流承载能力。
2.根据权利要求1的方法，其中缝隙是电镀的。
3.根据权利要求1的方法，其中动力键片不具有焊接掩模。
4.根据权利要求1的方法，其中第一印刷电路板和第二印刷电路板之间仅有的连接是布置为穿过缝隙的动力键片。
5.根据权利要求1的方法，其中所述多个铜垫均具有基部，其中切口半径定位于每个基部附近以便增强焊接。
6.根据权利要求1的方法，其中所述多个动力键片均具有基部，其中切口半径定位于每个基部附近以便增强焊接。
7.根据权利要求1的方法，还包括在缝隙的第一侧上放置焊剂的步骤。
8.根据权利要求7的方法，还包括在动力键片布置为穿过缝隙时用动力键片将焊剂推动穿过缝隙的第一侧面到达缝隙的第二侧面的步骤。
9.根据权利要求8的方法，还包括在缝隙的第一和第二侧处将动力键片焊接至铜垫的步骤。
10.根据权利要求1的方法，其中将至少一个动力键片滑动穿过缝隙保证使第一印刷电路板与第二印刷电路板垂直。
11.根据权利要求1的方法，其中所述铜垫从第一印刷电路板的边缘向外延伸。
12.根据权利要求1的方法，其中所述动力键片布置在第二印刷电路板的边缘的多个腔室中。
13.根据权利要求1的方法，其中第一印刷电路板的边缘定位成与第二印刷电路板的边缘形成互相啮合的关系。
CN2008101846727A 2007-12-12 2008-12-11 制造控制器的电路板组件的方法 Active CN101460016B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/954,419 US7716821B2 (en) 2007-12-12 2007-12-12 Method of manufacturing a circuit board assembly for a controller
US11/954,419 2007-12-12

Publications (2)

Publication Number Publication Date
CN101460016A CN101460016A (zh) 2009-06-17
CN101460016B true CN101460016B (zh) 2012-08-22

Family

ID=40680263

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008101846727A Active CN101460016B (zh) 2007-12-12 2008-12-11 制造控制器的电路板组件的方法

Country Status (5)

Country Link
US (1) US7716821B2 (zh)
CN (1) CN101460016B (zh)
DE (1) DE102008058749B4 (zh)
SE (1) SE0802539L (zh)
TW (1) TWI450664B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2494919B (en) * 2011-09-23 2015-06-17 Control Tech Ltd Method for connecting printed circuit boards.
CN103561295B (zh) * 2013-10-30 2017-11-07 深圳市九洲电器有限公司 机顶盒的pcb固定结构
JP6636460B2 (ja) * 2014-05-22 2020-01-29 シグニファイ ホールディング ビー ヴィＳｉｇｎｉｆｙ Ｈｏｌｄｉｎｇ Ｂ．Ｖ． プリント回路基板アレンジメント及び主プリント回路基板に製品を取り付けるための方法
US9504141B2 (en) * 2014-08-07 2016-11-22 Abl Ip Holding Llc Dielectric barriers with mechanical attachment
US10896898B2 (en) * 2015-10-28 2021-01-19 Indiana Integrated Circuits, LLC Edge interconnect self-assembly substrate
CN106704993A (zh) * 2017-01-09 2017-05-24 宁波亚茂光电股份有限公司 一种插卡式电源与光源板的连接结构
US10461467B2 (en) * 2017-01-20 2019-10-29 Fci Usa Llc Compact card edge connector
JP6947657B2 (ja) * 2018-01-31 2021-10-13 株式会社デンソー 電子回路
JP7210186B2 (ja) * 2018-08-07 2023-01-23 タイコエレクトロニクスジャパン合同会社 回路基板組立体
KR102337901B1 (ko) * 2018-08-28 2021-12-08 주식회사 엘지에너지솔루션 인쇄회로기판 어셈블리 및 그것을 제조하는 제조방법
CN111405757A (zh) * 2020-04-30 2020-07-10 成都菲斯洛克电子技术有限公司 一种多面体组合电路板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4109298A (en) * 1976-07-26 1978-08-22 Texas Instruments Incorporated Connector with printed wiring board structure
DE29617021U1 (de) * 1996-09-30 1996-11-14 Hella Kg Hueck & Co Leiterplatte
US5754411A (en) * 1995-09-12 1998-05-19 Allen-Bradley Company, Inc. Circuit board having a window adapted to receive a single in-line package module
EP1056319A2 (de) * 1999-05-27 2000-11-29 SEW-EURODRIVE GMBH & CO. Tochterplatine zum Einsetzen in eine Mutterplatine
US6496384B1 (en) * 2001-09-21 2002-12-17 Visteon Global Technologies, Inc. Circuit board assembly and method of fabricating same
CN1767722A (zh) * 2004-10-05 2006-05-03 三星电子株式会社 印制电路板组件

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2894241A (en) * 1956-03-28 1959-07-07 United Carr Fastener Corp Right-angle printed wire connector
US4513064A (en) 1982-12-17 1985-04-23 The United States Of America As Represented By The Secretary Of The Army Package for rugged electronics
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
US5098305A (en) * 1987-05-21 1992-03-24 Cray Research, Inc. Memory metal electrical connector
US5321585A (en) * 1992-06-25 1994-06-14 General Motors Corporation Directly solderable auxiliary circuit board assembly and methods of making and using the same
US5772451A (en) * 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US5543586A (en) * 1994-03-11 1996-08-06 The Panda Project Apparatus having inner layers supporting surface-mount components
US5455742A (en) * 1994-03-21 1995-10-03 Eaton Corporation Direct circuit board connection
US5484965A (en) * 1994-09-30 1996-01-16 Allen-Bradley Company, Inc. Circuit board adapted to receive a single in-line package module
US5648892A (en) * 1995-09-29 1997-07-15 Allen-Bradley Company, Inc. Wireless circuit board system for a motor controller
US5907475A (en) * 1996-04-16 1999-05-25 Allen-Bradley Company, Llc Circuit board system having a mounted board and a plurality of mounting boards
US5825630A (en) * 1996-11-07 1998-10-20 Ncr Corporation Electronic circuit board including a second circuit board attached there to to provide an area of increased circuit density
US5808867A (en) * 1997-03-27 1998-09-15 Wang; Joseph Power supply assembly
FR2762150A1 (fr) * 1997-04-11 1998-10-16 Framatome Connectors Int Connecteur d'entree/sortie pour dispositif portable de communication et procede de montage dudit connecteur
JPH11330766A (ja) * 1998-05-11 1999-11-30 Alps Electric Co Ltd 電子機器
US6324071B2 (en) * 1999-01-14 2001-11-27 Micron Technology, Inc. Stacked printed circuit board memory module
JP3457239B2 (ja) * 1999-11-24 2003-10-14 株式会社オートネットワーク技術研究所 電気接続箱における回路形成方法および回路の接続構造
US6422876B1 (en) * 1999-12-08 2002-07-23 Nortel Networks Limited High throughput interconnection system using orthogonal connectors
US6267604B1 (en) * 2000-02-03 2001-07-31 Tyco Electronics Corporation Electrical connector including a housing that holds parallel circuit boards
US20020071259A1 (en) * 2000-11-13 2002-06-13 Sture Roos Circuit board assembly
US6623302B2 (en) * 2000-12-21 2003-09-23 Hon Hai Precision Ind. Co., Ltd. Electrical connector having printed substrates therein electrically contacting conductive contacts thereof by solderless
EP1729555B1 (de) 2005-05-31 2008-01-02 Siemens Aktiengesellschaft Verfahren zur Herstellung einer Leiterplatte und eines Leiterplattensystems sowie mittels solcher Verfahren hergestellte Leiterplattten und Leiterplattensysteme
DE202006020076U1 (de) 2006-04-06 2007-10-04 Behr-Hella Thermocontrol Gmbh Leiterkartenanordnung

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4109298A (en) * 1976-07-26 1978-08-22 Texas Instruments Incorporated Connector with printed wiring board structure
US5754411A (en) * 1995-09-12 1998-05-19 Allen-Bradley Company, Inc. Circuit board having a window adapted to receive a single in-line package module
DE29617021U1 (de) * 1996-09-30 1996-11-14 Hella Kg Hueck & Co Leiterplatte
EP1056319A2 (de) * 1999-05-27 2000-11-29 SEW-EURODRIVE GMBH & CO. Tochterplatine zum Einsetzen in eine Mutterplatine
US6496384B1 (en) * 2001-09-21 2002-12-17 Visteon Global Technologies, Inc. Circuit board assembly and method of fabricating same
CN1767722A (zh) * 2004-10-05 2006-05-03 三星电子株式会社 印制电路板组件

Also Published As

Publication number Publication date
CN101460016A (zh) 2009-06-17
TWI450664B (zh) 2014-08-21
US7716821B2 (en) 2010-05-18
DE102008058749A1 (de) 2009-06-18
DE102008058749B4 (de) 2023-05-04
SE0802539L (sv) 2009-06-13
TW200926924A (en) 2009-06-16
US20090151156A1 (en) 2009-06-18

Similar Documents

Publication Publication Date Title
CN101460016B (zh) 制造控制器的电路板组件的方法
CN102099878B (zh) Dc/dc转换器用片状变压器
US5895277A (en) Electrical connection box with general and special circuits
US20110242725A1 (en) Capacitor arrangement and method for producing a capacitor arrangement
JP2021511619A (ja) バッテリーモジュール用ｆｐｃｂ組立体、その製造方法及びそれを含むバッテリーモジュール
JP2007299701A (ja) 複合コネクタ
US20140118973A1 (en) Pin header assembly and method of forming the same
US8681480B2 (en) Internal circuit structural element for electrical connection box and electrical connection box using the same
CN103477724A (zh) 具有高载流能力的印刷电路板和制造这种印刷电路板的方法
CN105096711A (zh) 一种免导线多功能pcb实验板
US6524113B1 (en) Automobile junction box with replaceable busbar circuit blocks
CN102970818B (zh) 层叠式印刷电路板及其制造方法
CN103370993A (zh) 用于安装在部件承载器中的连接销、用于生产包括具有包括部件承载器的可堆叠模块的母板的电子组件的方法及这样的电子组件
CN104919903A (zh) 用于电子板的制造和组装程序和由此可获得的电子设备
JP7385807B2 (ja) フレキシブルプリント基板、及び配線モジュール
CN108282957B (zh) 一种印制电路板、印制电路板的制作方法及移动终端
CN106031307A (zh) 用于生产功率印制电路的工艺和通过此工艺获得的功率印制电路
EP3770994A1 (en) Sensing assembly, manufacturing method for thereof and battery module comprising the same
CN204966737U (zh) 一种印制电路板之间的连接装置
CN201130730Y (zh) 板对板电连接器以及使用该连接器的线路板组合
CN216650104U (zh) 印刷电路板、芯片系统及电子设备
CN203760690U (zh) 开关母端焊接插片
EP4057785A1 (en) Busbar and method for manufacturing a busbar
CN201115001Y (zh) Led模组的结合装置
CN217720003U (zh) 一种fpc型连接器

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: DANFOSS POWER SOLUTIONS CORPORATION

Free format text: FORMER NAME: SOOL DANFORS CORP.

CP01 Change in the name or title of a patent holder

Address after: Iowa USA

Patentee after: DANFOSS POWER SOLUTIONS INC.

Address before: Iowa USA

Patentee before: Sauer Danfoss Inc.