JP7210186B2 - 回路基板組立体 - Google Patents
回路基板組立体 Download PDFInfo
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- JP7210186B2 JP7210186B2 JP2018148540A JP2018148540A JP7210186B2 JP 7210186 B2 JP7210186 B2 JP 7210186B2 JP 2018148540 A JP2018148540 A JP 2018148540A JP 2018148540 A JP2018148540 A JP 2018148540A JP 7210186 B2 JP7210186 B2 JP 7210186B2
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- Prior art keywords
- circuit board
- board
- conductive material
- covered
- terminal portion
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
- H01Q9/42—Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Details Of Aerials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Description
おもて面とうら面とを有し垂直に広がる第1回路基板であって、該第1回路基板の側端面から該第1回路基板の厚みを持って突き出た、該第1回路基板のおもて面と面一な第1面および該第1回路基板のうら面と面一な第2面を有し、該第1面および該第2面に、さらに該第1面および該第2面に交わる両側面を加えた4面が、導電性材料で覆われている第1端子部、並びに、該第1回路基板の下端面から該第1回路基板の厚みを持って突き出た、該第1回路基板のおもて面と面一な第3面および該第1回路基板のうら面と面一な第4面を有し、該第3面および該第4面に、さらに該第3面および該第4面に交わる両側面を加えた4面が、導電性材料で覆われている第2端子部を有する第1回路基板、
おもて面とうら面とを有し垂直に広がる第2回路基板であって、前記第1端子部が挿し込まれる、該第2回路基板の縦に延びる第1辺に隣接した位置に形成され内壁面全周面が導電性材料で覆われたスルーホール、および該第2回路基板の下端面から該第2回路基板の厚みを持って突き出た、該第2回路基板のおもて面と面一な第5面および該第2回路基板のうら面と面一な第6面を有し、該第5面および該第6面に、さらに該第5面および該第6面に交わる両側面を加えた4面が、導電性材料で覆われている第3端子部を有する第2回路基板、および
おもて面とうら面とを有し水平に広がる第3回路基板であって、該第3回路基板の、第1の向きに延びる第2辺に隣接した位置に形成され、前記第1回路基板のおもて面を該第2辺側に向けて前記第2端子部が挿し込まれる、内壁面全周面が導電性材料で覆われた第1スルーホール、および該第3回路基板の、該第2辺に接して該第1の向きと交わる第2の向きに延びる第3辺に隣接した位置に形成され、前記第2回路基板のおもて面を該第3辺側に向けて前記第3端子部が挿し込まれる、内壁面全周面が導電性材料で覆われた第2スルーホールを有する第3回路基板を備え、
前記第1回路基板の、前記第2辺側を向いたおもて面と、前記第2回路基板の、前記第3辺側を向いたおもて面とに跨って形成されたアンテナパターンを有することを特徴とする。
11,12 スルーホール
20 第1子基板
21 おもて面
22 回路パターン
23 側端面
24 端子部
241 第1面
242 端面
25 下端面
26 端子部
261 第1面
262 端面
30 第2子基板
31 おもて面
32 アンテナパターン
34 スルーホール
35 下端面
36 端子部
361 第1面
362 第2面
363 端面
39 うら面
100 回路基板組立体
Claims (2)
- おもて面とうら面とを有し垂直に広がる第1回路基板であって、該第1回路基板の側端面から該第1回路基板の厚みを持って突き出た、該第1回路基板のおもて面と面一な第1面および該第1回路基板のうら面と面一な第2面を有し、該第1面および該第2面に、さらに該第1面および該第2面に交わる両側面を加えた4面が、導電性材料で覆われている第1端子部、並びに、該第1回路基板の下端面から該第1回路基板の厚みを持って突き出た、該第1回路基板のおもて面と面一な第3面および該第1回路基板のうら面と面一な第4面を有し、該第3面および該第4面に、さらに該第3面および該第4面に交わる両側面を加えた4面が、導電性材料で覆われている第2端子部を有する第1回路基板、
おもて面とうら面とを有し垂直に広がる第2回路基板であって、前記第1端子部が挿し込まれる、該第2回路基板の縦に延びる第1辺に隣接した位置に形成され内壁面全周面が導電性材料で覆われたスルーホール、および該第2回路基板の下端面から該第2回路基板の厚みを持って突き出た、該第2回路基板のおもて面と面一な第5面および該第2回路基板のうら面と面一な第6面を有し、該第5面および該第6面に、さらに該第5面および該第6面に交わる両側面を加えた4面が、導電性材料で覆われている第3端子部を有する第2回路基板、および
おもて面とうら面とを有し水平に広がる第3回路基板であって、該第3回路基板の、第1の向きに延びる第2辺に隣接した位置に形成され、前記第1回路基板のおもて面を該第2辺側に向けて前記第2端子部が挿し込まれる、内壁面全周面が導電性材料で覆われた第1スルーホール、および該第3回路基板の、該第2辺に接して該第1の向きと交わる第2の向きに延びる第3辺に隣接した位置に形成され、前記第2回路基板のおもて面を該第3辺側に向けて前記第3端子部が挿し込まれる、内壁面全周面が導電性材料で覆われた第2スルーホールを有する第3回路基板を備え、
前記第1回路基板の、前記第2辺側を向いたおもて面と、前記第2回路基板の、前記第3辺側を向いたおもて面とに跨って形成されたアンテナパターンを有することを特徴とする回路基板組立体。 - 前記第1端子部、前記第2端子部、および前記第3端子部各々の突き出た先端面が、導電性材料で覆われていることを特徴とする請求項1に記載の回路基板組立体。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018148540A JP7210186B2 (ja) | 2018-08-07 | 2018-08-07 | 回路基板組立体 |
EP19847204.5A EP3836763A4 (en) | 2018-08-07 | 2019-07-08 | PCB WITH TERMINAL AND PCB ARRANGEMENT |
CN201980051922.6A CN112655282A (zh) | 2018-08-07 | 2019-07-08 | 带有端子的电路基板和电路基板组件 |
PCT/JP2019/026993 WO2020031584A1 (ja) | 2018-08-07 | 2019-07-08 | 端子付き回路基板および回路基板組立体 |
US17/167,477 US11664615B2 (en) | 2018-08-07 | 2021-02-04 | Circuit board having terminal, and circuit board assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018148540A JP7210186B2 (ja) | 2018-08-07 | 2018-08-07 | 回路基板組立体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020025012A JP2020025012A (ja) | 2020-02-13 |
JP7210186B2 true JP7210186B2 (ja) | 2023-01-23 |
Family
ID=69413745
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018148540A Active JP7210186B2 (ja) | 2018-08-07 | 2018-08-07 | 回路基板組立体 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11664615B2 (ja) |
EP (1) | EP3836763A4 (ja) |
JP (1) | JP7210186B2 (ja) |
CN (1) | CN112655282A (ja) |
WO (1) | WO2020031584A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6947657B2 (ja) * | 2018-01-31 | 2021-10-13 | 株式会社デンソー | 電子回路 |
JP2022178257A (ja) | 2021-05-19 | 2022-12-02 | タイコエレクトロニクスジャパン合同会社 | 回路基板組立体 |
US12069800B2 (en) * | 2021-09-08 | 2024-08-20 | Rohde & Schwarz Gmbh & Co. Kg | Circuit board arrangement, differential probe circuit and method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009207142A (ja) | 2008-02-27 | 2009-09-10 | Thomson Licensing | それぞれが少なくとも1つの伝送ラインを含む2つの基板を相互接続するシステム |
JP2011222826A (ja) | 2010-04-12 | 2011-11-04 | Mitsubishi Electric Engineering Co Ltd | プリント基板間の接続構造 |
Family Cites Families (63)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2013258C3 (de) * | 1970-03-20 | 1975-05-22 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | Verfahren zur Herstellung von stiftförmigen Anschlußteilen einer gedruckten Schaltungsplatte |
JPS534146Y2 (ja) | 1973-02-21 | 1978-02-01 | ||
JPS558953Y2 (ja) * | 1975-04-04 | 1980-02-27 | ||
JPS5493455A (en) | 1977-12-30 | 1979-07-24 | Matsushita Electric Works Ltd | Printed circuit board for small electronic appliance |
JPS5996874U (ja) | 1982-12-21 | 1984-06-30 | オムロン株式会社 | 電子機器の組立構造 |
JPH02132970A (ja) | 1988-11-14 | 1990-05-22 | Sanyo Electric Co Ltd | 2値画像列中のデータ変化点の検出方法 |
JPH02132970U (ja) * | 1989-04-11 | 1990-11-05 | ||
US6239765B1 (en) * | 1999-02-27 | 2001-05-29 | Rangestar Wireless, Inc. | Asymmetric dipole antenna assembly |
EP1192841B1 (de) * | 1999-05-31 | 2003-07-09 | Tyco Electronics Logistics AG | Intelligentes leistungsmodul |
US6404394B1 (en) * | 1999-12-23 | 2002-06-11 | Tyco Electronics Logistics Ag | Dual polarization slot antenna assembly |
US6824391B2 (en) * | 2000-02-03 | 2004-11-30 | Tyco Electronics Corporation | Electrical connector having customizable circuit board wafers |
JP2001284761A (ja) | 2000-03-30 | 2001-10-12 | Omron Corp | プリント配線板固定装置と、このプリント配線板固定装置を用いた電子機器 |
US6461169B1 (en) * | 2001-05-04 | 2002-10-08 | Intel Corporation | Interconnecting circuit modules to a motherboard using an edge connector with conductive polymer contacts |
US7109948B2 (en) * | 2001-11-20 | 2006-09-19 | Ube Industries, Ltd. | Dielectric antenna module |
US6808399B2 (en) * | 2002-12-02 | 2004-10-26 | Tyco Electronics Corporation | Electrical connector with wafers having split ground planes |
KR100586698B1 (ko) * | 2003-12-23 | 2006-06-08 | 삼성전자주식회사 | 수직 실장된 반도체 칩 패키지를 갖는 반도체 모듈 |
JP2005197493A (ja) | 2004-01-08 | 2005-07-21 | Ihi Aerospace Co Ltd | 回路基板組立体 |
JP2005236089A (ja) | 2004-02-20 | 2005-09-02 | Matsushita Electric Ind Co Ltd | 三次元実装構造体、三次元実装構造体を備えた携帯用電子機器、および、三次元実装構造体の製造方法 |
US6932649B1 (en) * | 2004-03-19 | 2005-08-23 | Tyco Electronics Corporation | Active wafer for improved gigabit signal recovery, in a serial point-to-point architecture |
ATE383064T1 (de) * | 2005-05-31 | 2008-01-15 | Siemens Ag | Verfahren zur herstellung einer leiterplatte und eines leiterplattensystems sowie mittels solcher verfahren hergestellte leiterplattten und leiterplattensysteme |
JP2007068106A (ja) | 2005-09-02 | 2007-03-15 | Auto Network Gijutsu Kenkyusho:Kk | 車載用無線受信装置 |
US7379021B2 (en) * | 2005-11-01 | 2008-05-27 | Arcadyan Technology Corporation | Circuit board |
EP1804561B1 (en) * | 2005-12-30 | 2015-01-28 | Omron Europe B.V. | Printed circuit board for perpendicularly connecting electronic components |
US7705365B2 (en) * | 2006-01-24 | 2010-04-27 | Denso Corporation | Lighting device and light emitting module for the same |
US7338292B2 (en) * | 2006-01-26 | 2008-03-04 | Agilent Technologies, Inc. | Board-to-board electronic interface using hemi-ellipsoidal surface features |
DE202006020076U1 (de) * | 2006-04-06 | 2007-10-04 | Behr-Hella Thermocontrol Gmbh | Leiterkartenanordnung |
JP2008027869A (ja) | 2006-07-25 | 2008-02-07 | Jisedai Gijutsu:Kk | 基板コネクタ |
US8264856B2 (en) * | 2006-08-18 | 2012-09-11 | Delphi Technologies, Inc. | Lightweight audio system for automotive: applications and method |
AT504960B1 (de) * | 2007-01-31 | 2012-11-15 | Siemens Ag | Anordnung eines ersten schaltungsträgers auf einem zweiten schaltungsträger |
US7864544B2 (en) * | 2007-08-01 | 2011-01-04 | Delphi Technologies, Inc. | Printed circuit board assembly |
US7716821B2 (en) * | 2007-12-12 | 2010-05-18 | Sauer-Danfoss Inc. | Method of manufacturing a circuit board assembly for a controller |
CN101752735B (zh) * | 2008-12-16 | 2012-08-29 | 鸿富锦精密工业(深圳)有限公司 | 板卡固定装置 |
KR101675375B1 (ko) * | 2009-11-23 | 2016-11-14 | 삼성전자 주식회사 | 휴대단말기 내장용 pcb 안테나 |
JP2011129708A (ja) * | 2009-12-17 | 2011-06-30 | Panasonic Electric Works Co Ltd | プリント配線板の接続構造 |
TWI417013B (zh) * | 2010-05-14 | 2013-11-21 | Kuang Hong Prec Co Ltd | 立體電路元件及其製作方法 |
US8897032B2 (en) * | 2011-05-24 | 2014-11-25 | Xirrus, Inc. | Surface mount antenna contacts |
WO2012171565A1 (de) * | 2011-06-16 | 2012-12-20 | Siemens Aktiengesellschaft | Elektrische kontakteinrichtung zur verbindung von leiterplatten |
EP2544300A1 (en) * | 2011-07-08 | 2013-01-09 | Tyco Electronics Belgium EC BVBA | Printed antenna |
JP2013219109A (ja) | 2012-04-05 | 2013-10-24 | Denso Corp | 基板組立体、およびこの基板組立体を用いた燃料性状センサ |
US9252528B2 (en) * | 2013-07-02 | 2016-02-02 | Germane Systems, Llc | Printed circuit board, method of manufacturing same, and method of mounting the circuit board in a connector socket |
JP2015082538A (ja) | 2013-10-22 | 2015-04-27 | 住友電装株式会社 | プリント基板およびプリント基板を備えた電子機器並びにプリント基板の製造方法 |
JP6215068B2 (ja) * | 2014-01-28 | 2017-10-18 | 日本航空電子工業株式会社 | コネクタ |
US9356366B2 (en) * | 2014-04-24 | 2016-05-31 | Tyco Electronics Corporation | Cable connector assembly for a communication system |
WO2015177060A1 (en) * | 2014-05-22 | 2015-11-26 | Koninklijke Philips N.V. | Printed circuit board arrangement and method for mounting a product to a main printed circuit board |
CN105698037A (zh) * | 2014-11-25 | 2016-06-22 | 鸿富锦精密工业(深圳)有限公司 | 灯具 |
US20160268034A1 (en) * | 2015-03-13 | 2016-09-15 | Bose Corporation | Planar Magnetic Components and Assemblies |
WO2016171749A1 (en) * | 2015-04-20 | 2016-10-27 | Thomson Licensing | Strain relief antenna wiring connector in an electronic device |
JP2017017089A (ja) | 2015-06-29 | 2017-01-19 | 三菱電機株式会社 | 立体型プリント基板 |
CA2941284C (en) * | 2015-09-08 | 2022-04-05 | Ross Video Limited | Circuit board pad layout and mechanical retainer |
KR102030704B1 (ko) * | 2015-11-05 | 2019-10-10 | 주식회사 아모텍 | 콤보형 안테나 모듈 |
JP6672737B2 (ja) | 2015-11-19 | 2020-03-25 | 三菱電機株式会社 | 調光器、照明システム |
DE202015008007U1 (de) * | 2015-11-19 | 2016-01-11 | Siemens Aktiengesellschaft | Leiterplattenanordnung |
US9976898B2 (en) * | 2015-12-09 | 2018-05-22 | Pixart Imaging Inc. | Optical sensing module with multi-directional optical sensing function |
DE202016101086U1 (de) * | 2016-03-01 | 2017-06-02 | Tridonic Gmbh & Co Kg | Leiterplattenanordnung |
US10971880B2 (en) * | 2016-10-26 | 2021-04-06 | Neptune Technology Group Inc. | Connection for printed circuit board assemblies |
JP6914583B2 (ja) | 2016-12-26 | 2021-08-04 | ダイハツ工業株式会社 | 車載用無線受信装置 |
CN111279803B (zh) * | 2017-11-02 | 2023-02-03 | 三菱电机株式会社 | 印刷电路基板组装体 |
EP3489082B1 (de) * | 2017-11-28 | 2021-10-06 | ZKW Group GmbH | Lichtmodul und fahrzeugscheinwerfer |
US11266018B2 (en) * | 2017-12-08 | 2022-03-01 | Mitsubishi Electric Corporation | Printed wiring board and method for manufacturing the same |
CN112425273B (zh) * | 2018-07-26 | 2023-11-14 | 三菱电机株式会社 | 印刷电路板 |
WO2020200464A1 (en) * | 2019-04-04 | 2020-10-08 | Huawei Technologies Co., Ltd. | Method for manufacturing an antenna element |
DE102020104100B3 (de) * | 2020-02-17 | 2021-08-05 | Interplex NAS Electronics GmbH | Leiterkarten-Eckverbinder sowie Kartenverbindungsanordnung |
US10998678B1 (en) * | 2020-03-26 | 2021-05-04 | TE Connectivity Services Gmbh | Modular electrical connector with additional grounding |
-
2018
- 2018-08-07 JP JP2018148540A patent/JP7210186B2/ja active Active
-
2019
- 2019-07-08 EP EP19847204.5A patent/EP3836763A4/en active Pending
- 2019-07-08 CN CN201980051922.6A patent/CN112655282A/zh active Pending
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009207142A (ja) | 2008-02-27 | 2009-09-10 | Thomson Licensing | それぞれが少なくとも1つの伝送ラインを含む2つの基板を相互接続するシステム |
JP2011222826A (ja) | 2010-04-12 | 2011-11-04 | Mitsubishi Electric Engineering Co Ltd | プリント基板間の接続構造 |
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WO2020031584A1 (ja) | 2020-02-13 |
CN112655282A (zh) | 2021-04-13 |
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EP3836763A4 (en) | 2022-04-27 |
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US11664615B2 (en) | 2023-05-30 |
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