CN101429337B - 一种低介电损耗氰酸酯树脂的制备方法 - Google Patents
一种低介电损耗氰酸酯树脂的制备方法 Download PDFInfo
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- CN101429337B CN101429337B CN2008102435021A CN200810243502A CN101429337B CN 101429337 B CN101429337 B CN 101429337B CN 2008102435021 A CN2008102435021 A CN 2008102435021A CN 200810243502 A CN200810243502 A CN 200810243502A CN 101429337 B CN101429337 B CN 101429337B
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- hollow glass
- cyanate resin
- resin
- dielectric loss
- coupling agent
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- 229920005989 resin Polymers 0.000 title claims abstract description 66
- 239000011347 resin Substances 0.000 title claims abstract description 66
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 11
- 230000008569 process Effects 0.000 title claims abstract description 5
- 239000011521 glass Substances 0.000 claims abstract description 43
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 22
- 239000000203 mixture Substances 0.000 claims abstract description 14
- 239000007788 liquid Substances 0.000 claims abstract description 9
- 239000004643 cyanate ester Substances 0.000 claims description 19
- AHZMUXQJTGRNHT-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(C)C1=CC=C(OC#N)C=C1 AHZMUXQJTGRNHT-UHFFFAOYSA-N 0.000 claims description 14
- 238000002360 preparation method Methods 0.000 claims description 12
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 10
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 claims description 8
- 230000008878 coupling Effects 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 claims description 7
- 238000005859 coupling reaction Methods 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 2
- 238000001721 transfer moulding Methods 0.000 claims description 2
- 238000002156 mixing Methods 0.000 abstract description 2
- 239000011325 microbead Substances 0.000 abstract 4
- 239000003054 catalyst Substances 0.000 abstract 2
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 150000001913 cyanates Chemical class 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000009745 resin transfer moulding Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- -1 modified cyanic acid ester Chemical class 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000012805 post-processing Methods 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 206010013786 Dry skin Diseases 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000011157 advanced composite material Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Landscapes
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
Description
| 测试项目 | 实施例1 | 实施例2 | 实施例3 | 实施例4 | 实施例5 | 对比例 |
| 介电常数 | 2.82 | 2.76 | 2.85 | 3.03 | 3.30 | 2.87 |
| 介电损耗角正切值 | 0.0014 | 0.0016 | 0.0019 | 0.0023 | 0.0032 | 0.0036 |
| 水煮48h吸水率 (％) | 1.06 | 0.85 | 1.05 | 1.12 | 1.20 | 1.52 |
| 冲击强度(kJ/m<sup>-2</sup>) | 10.816 | 14.805 | 13.632 | 9.862 | 9.137 | 10.709 |
| 弯曲强度(Mpa) | 110 | 130 | 125 | 120 | 107 | 78 |
| 弯曲模量(Gpa) | 2.8 | 2.9 | 3.2 | 3.4 | 3.8 | 2.6 |
| 拉伸强度(Mpa) | 82 | 78 | 77 | 75 | 72 | 80 |
| 断裂伸长率(％) | 1.28 | 1.23 | 1.22 | 1.20 | 1.17 | 1.32 |
| 热变形温度 (HDT，℃) | 225 | 230 | 230 | 225 | 223 | 220 |
| 玻璃化转变温度 (Tg，℃) | 248 | 255 | 263 | 268 | 265 | 248 |
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102435021A CN101429337B (zh) | 2008-12-15 | 2008-12-15 | 一种低介电损耗氰酸酯树脂的制备方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102435021A CN101429337B (zh) | 2008-12-15 | 2008-12-15 | 一种低介电损耗氰酸酯树脂的制备方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101429337A CN101429337A (zh) | 2009-05-13 |
| CN101429337B true CN101429337B (zh) | 2010-10-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2008102435021A Active CN101429337B (zh) | 2008-12-15 | 2008-12-15 | 一种低介电损耗氰酸酯树脂的制备方法 |
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| CN (1) | CN101429337B (zh) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102604187A (zh) * | 2012-02-29 | 2012-07-25 | 深圳光启创新技术有限公司 | 一种天线罩基板及其制备方法 |
| CN104761897B (zh) * | 2015-03-20 | 2017-07-28 | 西北工业大学 | 一种改性pbo纤维/氰酸酯树脂透波复合材料及其制备方法 |
| CN106147227B (zh) * | 2015-04-09 | 2020-09-08 | 深圳光启岗达创新科技有限公司 | 一种高频覆铜板、预浸料及其制作方法 |
| CN108250939A (zh) * | 2017-12-28 | 2018-07-06 | 安徽鑫铂铝业股份有限公司 | 一种高耐磨性中空轨道铝合金板 |
| CN109082117B (zh) * | 2018-07-13 | 2021-03-23 | 航天特种材料及工艺技术研究所 | 一种具有低介电常数、低介电损耗并可中温固化的树脂基透波复合材料及其制备方法 |
| CN110590990B (zh) * | 2019-09-25 | 2021-09-21 | 哈尔滨工业大学 | 一种超低介电常数玻璃微珠/树脂复合材料制备方法 |
| CN115651401A (zh) * | 2022-08-12 | 2023-01-31 | 中国人民解放军空军工程大学 | 一种可雷达透波的连续纤维增强复合材料及其增材制备方法 |
| CN115746561A (zh) * | 2022-12-06 | 2023-03-07 | 陕西科技大学 | 一种高导热低介损中空六方氮化硼/氰酸酯复合材料及制备方法和应用 |
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- 2008-12-15 CN CN2008102435021A patent/CN101429337B/zh active Active
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