CN101427168B - 安装于电路板上的光纤耦合光学装置 - Google Patents
安装于电路板上的光纤耦合光学装置 Download PDFInfo
- Publication number
- CN101427168B CN101427168B CN2007800144542A CN200780014454A CN101427168B CN 101427168 B CN101427168 B CN 101427168B CN 2007800144542 A CN2007800144542 A CN 2007800144542A CN 200780014454 A CN200780014454 A CN 200780014454A CN 101427168 B CN101427168 B CN 101427168B
- Authority
- CN
- China
- Prior art keywords
- optical fiber
- circuit board
- fiber
- optical
- segment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
- G02B6/4243—Mounting of the optical light guide into a groove
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US77877706P | 2006-03-03 | 2006-03-03 | |
| US60/778,777 | 2006-03-03 | ||
| US82118106P | 2006-08-02 | 2006-08-02 | |
| US60/821,181 | 2006-08-02 | ||
| US11/681,352 | 2007-03-02 | ||
| US11/681,352 US7543993B2 (en) | 2006-03-03 | 2007-03-02 | Fiber-coupled optical device mounted on a circuit board |
| PCT/US2007/063245 WO2007103836A2 (en) | 2006-03-03 | 2007-03-03 | Fiber-coupled optical device mounted on a circuit board |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100099475A Division CN102023351A (zh) | 2006-03-03 | 2007-03-03 | 安装于电路板上的光纤耦合光学装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101427168A CN101427168A (zh) | 2009-05-06 |
| CN101427168B true CN101427168B (zh) | 2012-05-30 |
Family
ID=38471574
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007800144542A Active CN101427168B (zh) | 2006-03-03 | 2007-03-03 | 安装于电路板上的光纤耦合光学装置 |
| CN2011100099475A Pending CN102023351A (zh) | 2006-03-03 | 2007-03-03 | 安装于电路板上的光纤耦合光学装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100099475A Pending CN102023351A (zh) | 2006-03-03 | 2007-03-03 | 安装于电路板上的光纤耦合光学装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7543993B2 (enExample) |
| EP (1) | EP2016450B1 (enExample) |
| JP (2) | JP5089617B2 (enExample) |
| KR (1) | KR101050809B1 (enExample) |
| CN (2) | CN101427168B (enExample) |
| WO (1) | WO2007103836A2 (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7785017B2 (en) * | 2007-09-27 | 2010-08-31 | Corning Cable Systems Llc | Strain-relief assemblies and methods for a field-installable fiber optic connector |
| WO2011038165A2 (en) * | 2009-09-23 | 2011-03-31 | Hoya Corporation Usa | Fiber-coupled optoelectronic device mounted on a circuit board |
| CN103003732B (zh) * | 2010-07-01 | 2019-02-05 | Otx有限公司 | 光学元件的组装与封装方法及系统 |
| WO2012161814A1 (en) * | 2011-02-28 | 2012-11-29 | Corning Cable Systems Llc | Mounting devices for optical devices, and related sub- assemblies, apparatuses, and methods |
| US8430576B2 (en) * | 2011-03-15 | 2013-04-30 | Intel Corporation | Fiber termination in light peak lenses |
| US8792759B2 (en) * | 2011-04-11 | 2014-07-29 | Advanced Fiber Products, LLC | Gigabit wet mate active cable |
| US8888383B2 (en) * | 2011-05-03 | 2014-11-18 | Avego Technologies General Ip (Singapore) Pte. Ltd. | Active optical cable (AOC) connector having a molded plastic leadframe, an AOC that incorporates the AOC connector, and a method of using an AOC |
| US9417418B2 (en) | 2011-09-12 | 2016-08-16 | Commscope Technologies Llc | Flexible lensed optical interconnect device for signal distribution |
| US9229172B2 (en) | 2011-09-12 | 2016-01-05 | Commscope Technologies Llc | Bend-limited flexible optical interconnect device for signal distribution |
| EP2764388B1 (en) * | 2011-10-05 | 2016-08-17 | Corning Optical Communications LLC | Attachment structure for fiber-optic cables and assemblies using same |
| CN102436045A (zh) * | 2011-12-29 | 2012-05-02 | 武汉电信器件有限公司 | 一种光电子器件的光导纤维的安装固定结构 |
| CN102722006B (zh) * | 2012-05-25 | 2014-06-11 | 华为技术有限公司 | 光纤连接器的小型可插拔模块 |
| WO2014052446A1 (en) | 2012-09-28 | 2014-04-03 | Tyco Electronics Uk Ltd. | Manufacture and testing of fiber optic cassette |
| EP2901192B1 (en) | 2012-09-28 | 2020-04-01 | CommScope Connectivity UK Limited | Fiber optic cassette |
| US9223094B2 (en) | 2012-10-05 | 2015-12-29 | Tyco Electronics Nederland Bv | Flexible optical circuit, cassettes, and methods |
| US9310572B2 (en) | 2012-10-18 | 2016-04-12 | Corning Cable Systems Llc | Cable bend relief for fiber optic sub-assemblies and methods of assembling |
| US9523829B2 (en) * | 2012-10-18 | 2016-12-20 | Corning Optical Communications LLC | Fiber optic cable sub-assemblies with strain-relief to a circuit board and methods of assembling |
| CN103676055A (zh) * | 2013-12-13 | 2014-03-26 | 中国航空工业集团公司第六三一研究所 | 一种光电器件尾纤的加固方法 |
| TWI498619B (zh) * | 2014-08-22 | 2015-09-01 | Applied Optoelectronics Inc | 雙向光傳輸次組件 |
| WO2016069620A1 (en) * | 2014-10-27 | 2016-05-06 | Coriant Advanced Technology, LLC | Photonic interface for electronic circuit |
| JP5905563B1 (ja) * | 2014-12-01 | 2016-04-20 | 株式会社フジクラ | 半導体レーザモジュールの製造方法 |
| US9921378B2 (en) * | 2015-04-17 | 2018-03-20 | Cisco Technology, Inc. | Optical bench for aligning an optical device |
| US10705306B2 (en) | 2016-09-08 | 2020-07-07 | CommScope Connectivity Belgium BVBA | Telecommunications distribution elements |
| JP2018132553A (ja) * | 2017-02-13 | 2018-08-23 | 住友電気工業株式会社 | 光接続デバイス、光処理装置、光接続デバイスを作製する方法、光処理装置を作製する方法 |
| US11409068B2 (en) | 2017-10-02 | 2022-08-09 | Commscope Technologies Llc | Fiber optic circuit and preparation method |
| WO2021202700A1 (en) | 2020-03-31 | 2021-10-07 | Commscope Technologies Llc | Fiber optic cable management systems and methods |
| WO2025126328A1 (ja) * | 2023-12-12 | 2025-06-19 | 古河電気工業株式会社 | 光学装置および光学装置の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5245683A (en) * | 1992-08-21 | 1993-09-14 | Molex Incorporated | Board mounted fiber optic connector |
| US6905569B2 (en) * | 2002-08-16 | 2005-06-14 | Samsung Electro-Mechanics Co., Ltd. | Method of embedding optical fiber in multilayer printed circuit board |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4307934A (en) | 1978-05-08 | 1981-12-29 | General Dynamics, Pomona Division | Packaged fiber optic modules |
| DE3751810T2 (de) | 1986-11-15 | 1996-09-26 | Sumitomo Electric Industries, Ltd., Osaka | Verfahren für die Herstellung eines optischen Steckers |
| JPH01270012A (ja) * | 1988-04-22 | 1989-10-27 | Sumitomo Electric Ind Ltd | 光ファイバ固定台 |
| JP2590266B2 (ja) | 1989-06-23 | 1997-03-12 | 住友電気工業株式会社 | 光コネクタ |
| DE69009688T2 (de) | 1989-11-20 | 1994-10-06 | At & T Corp | Anordnung zum Spleissen von Lichtwellenleitern. |
| US5535296A (en) | 1994-09-28 | 1996-07-09 | Optobahn Corporation | Integrated optoelectronic coupling and connector |
| JPH08166523A (ja) | 1994-12-13 | 1996-06-25 | Hitachi Ltd | 光アセンブリ |
| GB2297626A (en) | 1995-01-27 | 1996-08-07 | Cambridge Consultants | Miniature mounting grooved substrate |
| JPH1096837A (ja) * | 1996-09-24 | 1998-04-14 | Mitsubishi Electric Corp | 半導体レーザモジュール |
| JP3514609B2 (ja) * | 1997-05-29 | 2004-03-31 | 新光電気工業株式会社 | 光半導体装置用リードフレームと光半導体装置 |
| JP3684305B2 (ja) * | 1998-09-17 | 2005-08-17 | 日本オプネクスト株式会社 | 半導体レーザ結合装置および半導体受光装置 |
| JP2000121889A (ja) | 1998-10-21 | 2000-04-28 | Nec Corp | 光モジュール及び該光モジュールの製造方法 |
| JP3780769B2 (ja) * | 1999-09-28 | 2006-05-31 | 住友電気工業株式会社 | 光通信装置 |
| KR100349598B1 (ko) * | 2000-02-03 | 2002-08-23 | 삼성전자 주식회사 | 실리콘 광벤치를 이용한 스몰 폼 팩터 광송수신 집적 모듈 |
| JP2001318283A (ja) * | 2000-02-29 | 2001-11-16 | Kyocera Corp | 光モジュール |
| US6467972B2 (en) * | 2000-02-29 | 2002-10-22 | Kyocera Corporation | Optical interconnection module |
| JP2002232054A (ja) * | 2001-01-31 | 2002-08-16 | Kyocera Corp | 光モジュールの実装構造 |
| US6345139B1 (en) | 2000-04-04 | 2002-02-05 | Kabushiki Kaisha Toshiba | Semiconductor light emitting element coupled with optical fiber |
| EP1154298A1 (en) * | 2000-05-09 | 2001-11-14 | Alcatel | Arrangement consisting of a photodiode and an optical fiber |
| US6530701B2 (en) | 2001-02-14 | 2003-03-11 | Jds Uniphase Inc. | Hermetic package with optical fiber feedthrough |
| JP2002333552A (ja) | 2001-05-08 | 2002-11-22 | Fujitsu Ltd | 光装置 |
| JP2003098379A (ja) * | 2001-09-20 | 2003-04-03 | Sumitomo Electric Ind Ltd | 光コネクタフェルール、光コネクタ及び光コネクタ付光ファイバ心線 |
| JP4094407B2 (ja) | 2001-11-15 | 2008-06-04 | セイコーインスツル株式会社 | 光スイッチ |
| JP4375597B2 (ja) | 2001-11-16 | 2009-12-02 | 日本碍子株式会社 | 光導波路デバイスおよび進行波形光変調器 |
| JP2003279783A (ja) * | 2002-03-25 | 2003-10-02 | Hata Kensaku:Kk | 光ファイバアレイおよびフェルール |
| JP2004031573A (ja) * | 2002-06-25 | 2004-01-29 | Oki Electric Ind Co Ltd | 光送受信モジュール |
| JP3804632B2 (ja) * | 2003-05-21 | 2006-08-02 | 住友電気工業株式会社 | 光データリンク |
| US6942397B2 (en) | 2003-07-25 | 2005-09-13 | Xponent Photonics Inc | Packaging for a fiber-coupled optical device |
| JP4409303B2 (ja) * | 2004-01-27 | 2010-02-03 | 京セラ株式会社 | 光レセプタクル及びそれを用いた光モジュール |
| EP1610162B1 (en) * | 2004-06-25 | 2010-12-22 | Andrea Pizzarulli | A method of assembling optoelectronic devices and an optoelectronic device assembled according to this method |
| JP2008505362A (ja) | 2004-06-30 | 2008-02-21 | イクスポーネント フォトニクス,インコーポレイティド | ファイバ結合光学機器のパッケージ化 |
-
2007
- 2007-03-02 US US11/681,352 patent/US7543993B2/en active Active
- 2007-03-03 KR KR1020087024166A patent/KR101050809B1/ko not_active Expired - Fee Related
- 2007-03-03 JP JP2008558485A patent/JP5089617B2/ja active Active
- 2007-03-03 EP EP07757855.7A patent/EP2016450B1/en active Active
- 2007-03-03 WO PCT/US2007/063245 patent/WO2007103836A2/en not_active Ceased
- 2007-03-03 CN CN2007800144542A patent/CN101427168B/zh active Active
- 2007-03-03 CN CN2011100099475A patent/CN102023351A/zh active Pending
-
2012
- 2012-05-23 JP JP2012117217A patent/JP2012163985A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5245683A (en) * | 1992-08-21 | 1993-09-14 | Molex Incorporated | Board mounted fiber optic connector |
| US6905569B2 (en) * | 2002-08-16 | 2005-06-14 | Samsung Electro-Mechanics Co., Ltd. | Method of embedding optical fiber in multilayer printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2016450A4 (en) | 2013-04-24 |
| WO2007103836B1 (en) | 2008-08-28 |
| CN102023351A (zh) | 2011-04-20 |
| WO2007103836A3 (en) | 2008-07-10 |
| JP2009529156A (ja) | 2009-08-13 |
| US20070206902A1 (en) | 2007-09-06 |
| US7543993B2 (en) | 2009-06-09 |
| JP2012163985A (ja) | 2012-08-30 |
| JP5089617B2 (ja) | 2012-12-05 |
| KR101050809B1 (ko) | 2011-07-20 |
| CN101427168A (zh) | 2009-05-06 |
| KR20080106959A (ko) | 2008-12-09 |
| WO2007103836A2 (en) | 2007-09-13 |
| EP2016450A2 (en) | 2009-01-21 |
| EP2016450B1 (en) | 2015-04-22 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160107 Address after: 518129 Bantian HUAWEI headquarters office building, Longgang District, Guangdong, Shenzhen Patentee after: Huawei Technologies Co., Ltd. Address before: American California Patentee before: HOYA Corp. USA DBA Xponent |