CN101426960B - Cu-Ni-Si合金镀锡条 - Google Patents
Cu-Ni-Si合金镀锡条 Download PDFInfo
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- CN101426960B CN101426960B CN2007800145193A CN200780014519A CN101426960B CN 101426960 B CN101426960 B CN 101426960B CN 2007800145193 A CN2007800145193 A CN 2007800145193A CN 200780014519 A CN200780014519 A CN 200780014519A CN 101426960 B CN101426960 B CN 101426960B
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 46
- 239000000956 alloy Substances 0.000 title claims abstract description 46
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 title claims abstract description 32
- 229910052718 tin Inorganic materials 0.000 claims abstract description 9
- 239000012535 impurity Substances 0.000 claims abstract description 7
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 4
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 4
- 229910052742 iron Inorganic materials 0.000 claims abstract description 4
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 4
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 4
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 4
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 4
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 4
- 239000010949 copper Substances 0.000 claims description 85
- 238000000576 coating method Methods 0.000 claims description 82
- 239000011248 coating agent Substances 0.000 claims description 81
- 239000002184 metal Substances 0.000 claims description 53
- 229910052751 metal Inorganic materials 0.000 claims description 53
- 229910000905 alloy phase Inorganic materials 0.000 claims description 27
- 229910020888 Sn-Cu Inorganic materials 0.000 claims description 25
- 229910019204 Sn—Cu Inorganic materials 0.000 claims description 25
- 239000010731 rolling oil Substances 0.000 claims description 20
- 238000003490 calendering Methods 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000011135 tin Substances 0.000 abstract description 56
- 238000007747 plating Methods 0.000 abstract description 29
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 2
- 239000010953 base metal Substances 0.000 abstract 3
- 238000000926 separation method Methods 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 46
- 239000000463 material Substances 0.000 description 32
- 230000000052 comparative effect Effects 0.000 description 18
- 238000010438 heat treatment Methods 0.000 description 11
- 238000009826 distribution Methods 0.000 description 8
- 238000003825 pressing Methods 0.000 description 8
- 229910000881 Cu alloy Inorganic materials 0.000 description 7
- 238000005238 degreasing Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 238000003483 aging Methods 0.000 description 6
- 230000008646 thermal stress Effects 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000035882 stress Effects 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 230000032683 aging Effects 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 229910052717 sulfur Inorganic materials 0.000 description 4
- 229910017755 Cu-Sn Inorganic materials 0.000 description 3
- 229910017927 Cu—Sn Inorganic materials 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000005554 pickling Methods 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid group Chemical class S(O)(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- 229910018098 Ni-Si Inorganic materials 0.000 description 2
- 229910018529 Ni—Si Inorganic materials 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000003610 charcoal Substances 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- FEPBITJSIHRMRT-UHFFFAOYSA-N 4-hydroxybenzenesulfonic acid Chemical compound OC1=CC=C(S(O)(=O)=O)C=C1 FEPBITJSIHRMRT-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 244000027321 Lychnis chalcedonica Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 240000003936 Plumbago auriculata Species 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001651 emery Inorganic materials 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005058 metal casting Methods 0.000 description 1
- 229910052752 metalloid Inorganic materials 0.000 description 1
- 150000002738 metalloids Chemical class 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005211 surface analysis Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
Abstract
Description
Claims (5)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP121848/2006 | 2006-04-26 | ||
JP2006121848A JP4986499B2 (ja) | 2006-04-26 | 2006-04-26 | Cu−Ni−Si合金すずめっき条の製造方法 |
PCT/JP2007/059084 WO2007126011A1 (ja) | 2006-04-26 | 2007-04-26 | Cu-Ni-Si合金すずめっき条 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101426960A CN101426960A (zh) | 2009-05-06 |
CN101426960B true CN101426960B (zh) | 2011-04-13 |
Family
ID=38655535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007800145193A Active CN101426960B (zh) | 2006-04-26 | 2007-04-26 | Cu-Ni-Si合金镀锡条 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20090176125A1 (zh) |
JP (1) | JP4986499B2 (zh) |
KR (1) | KR101058764B1 (zh) |
CN (1) | CN101426960B (zh) |
WO (1) | WO2007126011A1 (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2270242B1 (en) * | 2008-03-31 | 2014-06-04 | The Furukawa Electric Co., Ltd. | Copper alloy material for electric or electronic apparatuses, method for producing it and component |
CN102234827B (zh) * | 2010-04-20 | 2014-01-08 | Jx日矿日石金属株式会社 | 焊料润湿性、插拔性能优良的铜合金镀锡条 |
JP5192536B2 (ja) * | 2010-12-10 | 2013-05-08 | 三菱伸銅株式会社 | 深絞り加工性及び耐疲労特性に優れたCu−Ni−Si系銅合金板及びその製造方法 |
JP5180283B2 (ja) * | 2010-12-24 | 2013-04-10 | 三菱伸銅株式会社 | 曲げ加工後の耐疲労特性及びばね特性に優れたCu−Ni−Si系銅合金板及びその製造方法 |
JP6046406B2 (ja) | 2011-07-26 | 2016-12-14 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 高温耐性銀コート基体 |
TW201311944A (zh) * | 2011-08-12 | 2013-03-16 | Mitsubishi Materials Corp | 插拔性優異的鍍錫銅合金端子材及其製造方法 |
JP5789207B2 (ja) * | 2012-03-07 | 2015-10-07 | 株式会社神戸製鋼所 | 嵌合型接続端子用Sn被覆層付き銅合金板及び嵌合型接続端子 |
JP6221695B2 (ja) * | 2013-03-25 | 2017-11-01 | 三菱マテリアル株式会社 | 挿抜性に優れた錫めっき銅合金端子材 |
JP6173943B2 (ja) * | 2014-02-20 | 2017-08-02 | 株式会社神戸製鋼所 | 耐熱性に優れる表面被覆層付き銅合金板条 |
JP6377599B2 (ja) * | 2015-12-08 | 2018-08-22 | 株式会社オートネットワーク技術研究所 | 端子対およびコネクタ |
JP7296757B2 (ja) * | 2019-03-28 | 2023-06-23 | Jx金属株式会社 | 銅合金、伸銅品及び電子機器部品 |
CN115029581B (zh) * | 2022-06-10 | 2022-12-09 | 中铁建电气化局集团轨道交通器材有限公司 | 硅青铜锻件及其无内应力一体式锻压及热处理方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1368562A (zh) * | 2001-01-31 | 2002-09-11 | 同和矿业株式会社 | 耐热性保护薄膜,其制造方法及电气电子元件 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH03223482A (ja) * | 1990-01-26 | 1991-10-02 | Kobe Steel Ltd | 銅および銅合金の脱脂方法 |
JPH0830235B2 (ja) * | 1991-04-24 | 1996-03-27 | 日鉱金属株式会社 | 導電性ばね用銅合金 |
KR100392528B1 (ko) * | 1998-09-11 | 2003-07-23 | 닛코 킨조쿠 가부시키가이샤 | 금속재료, 금속재료의 제조방법 및 금속재료를 이용한 단자 및 커넥터 |
JP2000169996A (ja) * | 1998-09-28 | 2000-06-20 | Nippon Mining & Metals Co Ltd | 金属材料 |
DE19953230C2 (de) * | 1999-11-04 | 2003-08-28 | C D Waelzholz Produktionsgmbh | Kaltwalzverfahren |
JP3520034B2 (ja) * | 2000-07-25 | 2004-04-19 | 古河電気工業株式会社 | 電子電気機器部品用銅合金材 |
JP2005105419A (ja) * | 2001-01-19 | 2005-04-21 | Furukawa Electric Co Ltd:The | めっき材料とその製造方法、それを用いた電気・電子部品 |
TW575688B (en) * | 2001-01-19 | 2004-02-11 | Furukawa Electric Co Ltd | Metal-plated material and method for preparation thereof, and electric and electronic parts using the same |
JP2002317295A (ja) * | 2001-04-19 | 2002-10-31 | Furukawa Electric Co Ltd:The | リフロー処理Sn合金めっき材料、それを用いた嵌合型接続端子 |
EP1281789B1 (en) * | 2001-07-31 | 2006-05-31 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | A plated copper alloy material and process for production thereof |
JP4090302B2 (ja) * | 2001-07-31 | 2008-05-28 | 株式会社神戸製鋼所 | 接続部品成形加工用導電材料板 |
JP3880877B2 (ja) * | 2002-03-29 | 2007-02-14 | Dowaホールディングス株式会社 | めっきを施した銅または銅合金およびその製造方法 |
JP2004232049A (ja) * | 2003-01-31 | 2004-08-19 | Nikko Metal Manufacturing Co Ltd | Cuめっきチタン銅 |
JP2004300524A (ja) * | 2003-03-31 | 2004-10-28 | Dowa Mining Co Ltd | Sn被覆を施した銅または銅合金部材およびその製造方法 |
JP4255330B2 (ja) * | 2003-07-31 | 2009-04-15 | 日鉱金属株式会社 | 疲労特性に優れたCu−Ni−Si系合金部材 |
DE102004040375A1 (de) * | 2004-06-09 | 2005-12-29 | Sms Demag Ag | Verfahren und Walzgerüst zum Kaltwalzen von metallischem Walzgut, insbesondere von Walzband, mit Düsen für gasförmige oder flüssige Behandlungsmedien |
JP4814552B2 (ja) * | 2005-06-13 | 2011-11-16 | Dowaメタルテック株式会社 | 表面処理法 |
JP4489738B2 (ja) * | 2005-08-31 | 2010-06-23 | 日鉱金属株式会社 | Cu−Ni−Si−Zn系合金すずめっき条 |
-
2006
- 2006-04-26 JP JP2006121848A patent/JP4986499B2/ja active Active
-
2007
- 2007-04-26 WO PCT/JP2007/059084 patent/WO2007126011A1/ja active Application Filing
- 2007-04-26 CN CN2007800145193A patent/CN101426960B/zh active Active
- 2007-04-26 KR KR1020087024684A patent/KR101058764B1/ko active IP Right Grant
- 2007-04-26 US US12/226,635 patent/US20090176125A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1368562A (zh) * | 2001-01-31 | 2002-09-11 | 同和矿业株式会社 | 耐热性保护薄膜,其制造方法及电气电子元件 |
Non-Patent Citations (2)
Title |
---|
JP特开平11-135226A 1999.05.21 |
JP特开平5-59468A 1993.03.09 |
Also Published As
Publication number | Publication date |
---|---|
JP2007291458A (ja) | 2007-11-08 |
KR20080110614A (ko) | 2008-12-18 |
KR101058764B1 (ko) | 2011-08-24 |
CN101426960A (zh) | 2009-05-06 |
JP4986499B2 (ja) | 2012-07-25 |
WO2007126011A1 (ja) | 2007-11-08 |
US20090176125A1 (en) | 2009-07-09 |
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