CN100576366C - 镀锡的Cu-Ni-Si-Zn-Sn系合金条及其镀锡条 - Google Patents
镀锡的Cu-Ni-Si-Zn-Sn系合金条及其镀锡条 Download PDFInfo
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- CN100576366C CN100576366C CN200610068327A CN200610068327A CN100576366C CN 100576366 C CN100576366 C CN 100576366C CN 200610068327 A CN200610068327 A CN 200610068327A CN 200610068327 A CN200610068327 A CN 200610068327A CN 100576366 C CN100576366 C CN 100576366C
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- 229910006680 Si—Zn—Sn Inorganic materials 0.000 title claims abstract description 28
- 229910045601 alloy Inorganic materials 0.000 title claims description 40
- 239000000956 alloy Substances 0.000 title claims description 40
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 18
- 229910052785 arsenic Inorganic materials 0.000 claims abstract description 18
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 16
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 15
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 13
- 229910052791 calcium Inorganic materials 0.000 claims abstract description 12
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 12
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 11
- 229910052718 tin Inorganic materials 0.000 claims abstract description 8
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 6
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims description 35
- 229910052751 metal Inorganic materials 0.000 claims description 35
- 229910000905 alloy phase Inorganic materials 0.000 claims description 27
- 229910020888 Sn-Cu Inorganic materials 0.000 claims description 23
- 229910019204 Sn—Cu Inorganic materials 0.000 claims description 23
- 238000007747 plating Methods 0.000 claims description 19
- 239000012535 impurity Substances 0.000 claims description 8
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 14
- 229910000952 Be alloy Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 description 75
- 238000000576 coating method Methods 0.000 description 64
- 239000011248 coating agent Substances 0.000 description 63
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 56
- 230000000052 comparative effect Effects 0.000 description 21
- 238000010438 heat treatment Methods 0.000 description 18
- 238000004070 electrodeposition Methods 0.000 description 15
- 239000000463 material Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 239000006104 solid solution Substances 0.000 description 11
- 230000032683 aging Effects 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 238000003483 aging Methods 0.000 description 9
- 238000009713 electroplating Methods 0.000 description 9
- 238000012360 testing method Methods 0.000 description 7
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 230000008646 thermal stress Effects 0.000 description 6
- 229910017755 Cu-Sn Inorganic materials 0.000 description 5
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 5
- 229910017927 Cu—Sn Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000005275 alloying Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910000967 As alloy Inorganic materials 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 239000003610 charcoal Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000005238 degreasing Methods 0.000 description 3
- 230000009931 harmful effect Effects 0.000 description 3
- 238000011835 investigation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005554 pickling Methods 0.000 description 3
- 238000004904 shortening Methods 0.000 description 3
- 239000011856 silicon-based particle Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000005098 hot rolling Methods 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000007670 refining Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(ii) oxide Chemical compound [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 description 2
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 1
- 229910000714 At alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910018098 Ni-Si Inorganic materials 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 229910018529 Ni—Si Inorganic materials 0.000 description 1
- 244000137852 Petrea volubilis Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229960002163 hydrogen peroxide Drugs 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005058 metal casting Methods 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229940044654 phenolsulfonic acid Drugs 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Conductive Materials (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005096487 | 2005-03-29 | ||
JP2005096487 | 2005-03-29 |
Publications (2)
Publication Number | Publication Date |
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CN1841570A CN1841570A (zh) | 2006-10-04 |
CN100576366C true CN100576366C (zh) | 2009-12-30 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200610068327A Active CN100576366C (zh) | 2005-03-29 | 2006-03-29 | 镀锡的Cu-Ni-Si-Zn-Sn系合金条及其镀锡条 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100774226B1 (zh) |
CN (1) | CN100576366C (zh) |
TW (1) | TW200706662A (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010084532A1 (ja) * | 2009-01-20 | 2010-07-29 | 三菱伸銅株式会社 | 導電部材及びその製造方法 |
WO2011039875A1 (ja) | 2009-09-30 | 2011-04-07 | Jx日鉱日石金属株式会社 | すずめっきの耐熱剥離性に優れるCu-Ni-Si系合金すずめっき条 |
TW201311944A (zh) * | 2011-08-12 | 2013-03-16 | Mitsubishi Materials Corp | 插拔性優異的鍍錫銅合金端子材及其製造方法 |
CN103014409B (zh) * | 2011-09-21 | 2016-04-06 | 三菱伸铜株式会社 | 凸焊特性优异的Cu-Ni-Si系铜合金及其制造方法 |
JP5874827B2 (ja) * | 2012-06-19 | 2016-03-02 | 株式会社村田製作所 | 接合用部材 |
CN105112715B (zh) * | 2015-09-08 | 2017-10-20 | 长沙中工新材料有限公司 | CuZnNiSi合金及其制备方法以及该合金制备带材的方法 |
CN105695797A (zh) * | 2016-04-20 | 2016-06-22 | 苏州市相城区明达复合材料厂 | 一种铸造加工零部件用青铜合金 |
DE102016008753B4 (de) * | 2016-07-18 | 2020-03-12 | Wieland-Werke Ag | Kupfer-Nickel-Zinn-Legierung, Verfahren zu deren Herstellung sowie deren Verwendung |
KR101900793B1 (ko) * | 2017-06-08 | 2018-09-20 | 주식회사 풍산 | 전기·전자, 자동차 부품용 동합금의 주석 도금 방법 및 이로부터 제조된 동합금의 주석 도금재 |
CN115233131A (zh) * | 2022-06-17 | 2022-10-25 | 武汉凌云光电科技有限责任公司 | 一种有色金属浸镀锡后激光熔覆、抛光的方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0830235B2 (ja) * | 1991-04-24 | 1996-03-27 | 日鉱金属株式会社 | 導電性ばね用銅合金 |
JP3391427B2 (ja) * | 1996-05-14 | 2003-03-31 | 三菱伸銅株式会社 | メッキ銅合金薄板およびその薄板で製造したコネクタ |
-
2006
- 2006-03-24 TW TW095110265A patent/TW200706662A/zh unknown
- 2006-03-29 KR KR1020060028172A patent/KR100774226B1/ko active IP Right Grant
- 2006-03-29 CN CN200610068327A patent/CN100576366C/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR100774226B1 (ko) | 2007-11-07 |
TWI323287B (zh) | 2010-04-11 |
KR20060105509A (ko) | 2006-10-11 |
CN1841570A (zh) | 2006-10-04 |
TW200706662A (en) | 2007-02-16 |
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Owner name: NIPPON MINING + METALS CO., LTD. Free format text: FORMER OWNER: NIPPON MINING + METALS PROCESSING CO., LTD. Effective date: 20110524 Owner name: JX NIPPON MINING + METALS CORPORATION Free format text: FORMER OWNER: NIPPON MINING + METALS CO., LTD. Effective date: 20110524 |
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Free format text: CORRECT: ADDRESS; FROM: KANAGAWA PREFECTURE, JAPAN TO: TOKYO, JAPAN |
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Effective date of registration: 20110524 Address after: Tokyo, Japan Patentee after: JX Nippon Mining & Metals Corp. Address before: Tokyo, Japan Patentee before: Nippon Mining & Metals Co.,Ltd. Effective date of registration: 20110524 Address after: Tokyo, Japan Patentee after: Nippon Mining & Metals Co.,Ltd. Address before: Kanagawa Patentee before: Nikko Metal Manufacturing Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: JX NIPPON MINING & METALS Corp. Address before: Tokyo, Japan Patentee before: JX Nippon Mining & Metals Corp. |
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CP01 | Change in the name or title of a patent holder | ||
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Address after: No. 10-4, erdingmu, tiger gate, Tokyo port, Japan Patentee after: JX NIPPON MINING & METALS Corp. Address before: Tokyo, Japan Patentee before: JX NIPPON MINING & METALS Corp. |
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