CN101404271B - 音频功率放大器封装结构 - Google Patents

音频功率放大器封装结构 Download PDF

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CN101404271B
CN101404271B CN2008100962538A CN200810096253A CN101404271B CN 101404271 B CN101404271 B CN 101404271B CN 2008100962538 A CN2008100962538 A CN 2008100962538A CN 200810096253 A CN200810096253 A CN 200810096253A CN 101404271 B CN101404271 B CN 101404271B
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signal
weld pad
power amplifier
pin
audio
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CN101404271A (zh
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吴国宏
李柏钰
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YUANJING TECHNOLOGY Co Ltd
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Abstract

一种音频功率放大器封装结构，包含非信号接脚、第一非信号焊垫、第二非信号焊垫以及焊线。第一非信号焊垫以及第二非信号焊垫均位于基板上。焊线则分别将非信号接脚连接于第一非信号焊垫以及第二非信号焊垫。

Description

音频功率放大器封装结构
技术领域
本发明涉及一种封装结构，且特别涉及一种音频功率放大器(audiopower amplifier)的封装结构。
背景技术
就现今的电子产品而言，其一般的封装结构中会包括半导体芯片(chip)以及与半导体芯片作电性连接的载体(carrier)。目前，半导体芯片与载体连接的技术主要分为三种，分别为焊线接合工艺(wire-bonding process)、倒装片工艺(flip-chip process)以及卷带式自动接合工艺(tape-automated-bondingprocess，TAB)。倘若封装结构中的载体为一导线架(lead frame)的话，则大多使用焊线接合工艺，藉以于导线架上进行半导体芯片与接脚(lead)的连接工艺。
对于一般藉由焊线接合工艺所制作的音频功率放大器(audio poweramplifier)而言，为了符合在设计音频功率放大器时封装结构以及管芯(die)所需的尺寸大小，音频功率放大器中的开关电路及其他电路(如：运算放大器以及能带间隙参考电路等)，必须同时经由音频功率放大器封装结构其中之一接脚来接收供应电源，所以需要较大电源来进行切换的开关电路通常会产生一些干扰和电源噪声，而严重影响需要纯净电源(pure power)的运算放大器以及能带间隙参考电路。因此，封装结构中焊线接合及布线(layout)的部分必须进行调整，藉以解决干扰和电源噪声的问题。
发明内容
因此本发明的目的是提供一种音频功率放大器的封装结构，藉以解决一般在音频功率放大器封装结构中所存在的干扰和电源噪声问题，改善音频功率放大器的效能。
依照本发明一实施例，提出一种音频功率放大器封装结构。此音频功率放大器封装结构包含一非信号接脚、一第一非信号焊垫、一第二非信号焊垫以及多条焊线。第一非信号焊垫以及第二非信号焊垫均位于一基板上。焊线则分别连接非信号接脚于第一非信号焊垫以及第二非信号焊垫。
依照本发明另一实施例，提出一种音频功率放大器封装结构。此音频功率放大器封装结构包含一基板、多个焊垫、多个接脚以及多条焊线。上述焊垫位于基板上，并包含一第一非信号焊垫以及一第二非信号焊垫。上述接脚包含一非信号接脚。上述焊线则分别连接非信号接脚于第一非信号焊垫以及第二非信号焊垫。
根据本发明上述实施例可知，应用此音频功率放大器封装结构可解决一般在音频功率放大器封装结构中所存在的干扰和电源噪声问题，且音频功率放大器中的其他电路(如：运算放大器以及能带间隙参考电路等)可因此具有较佳的电源抑制比(power supply rejection ratio，PSRR)。此外，也可藉此改善音频功率放大器的总谐波失真附加噪声(total harmonic distortion plusnoise，THD+N)。
附图说明
图1示出依照本发明实施例的一种音频功率放大器封装结构的俯视示意图。
主要元件符号说明
100：音频功率放大器封装结构
110：芯片
112：基板
114：焊垫
114a：第一非信号焊垫
114b：第二非信号焊垫
120：接脚
122：非信号接脚
130：焊线
具体实施方式
本发明的实施例揭露一种音频功率放大器的封装结构，其包括一非信号接脚(lead)、两非信号焊垫(pad)以及多条焊线(bonding wire)。上述焊线将非信号接脚分别连接于两非信号焊垫，使得信号可分别自非信号接脚经由焊线传送至两非信号焊垫。如此一来，在音频功率放大器的操作过程中便可避免干扰和电源噪声的问题发生。
图1示出依照本发明实施例的一种音频功率放大器封装结构的俯视示意图。此音频功率放大器封装结构100包括一芯片110、多个接脚120以及多条焊线130，其中芯片110更包括一基板112以及多个焊垫114。焊垫114位于基板112上，并藉由焊线130电性连接于接脚120。此外，上述焊垫114包括一第一非信号焊垫114a以及一第二非信号焊垫114b，其中第一非信号焊垫114a以及第二非信号焊垫114b两者在本实施例中均为电源焊垫。上述接脚120则包括一非信号接脚122，其中非信号接脚122在本实施例中为一电源接脚。
上述焊线130中的一部份用以藉由焊线接合工艺(wire-bonding process)，将非信号接脚122分别连接于第一非信号焊垫114a以及第二非信号焊垫114b；亦即，电源接脚藉由焊线130分别电性连接于电源焊垫。如此一来，第一非信号焊垫114a(如：电源焊垫)便可自非信号接脚122(如：电源接脚)经由相对应的焊线130的至少其中之一，接收用来供应电源给音频功率放大器中运算放大器及能带间隙参考电路等电路的第一电源(如：纯净电源)；第二非信号焊垫114b(如：电源焊垫)也可同时自非信号接脚122经由相对应的焊线130的至少其中之一，接收用来供应电源给音频功率放大器中开关电路的第二电源(如：切换电源)。因此，不同用途的电源可如上述所言分别传送至相对应的焊垫，藉以避免当供应电源传送至芯片110时发生干扰和电源噪声的问题。
此外，上述的实施例中使用电源焊垫/接脚作为例子来说明，而在另一实施例中亦可使用接地(ground)焊垫/接脚，藉以取代上述的电源焊垫/接脚。亦即，上述「非信号」所指的是供应电源或接地的功能。
根据本发明上述实施例可知，应用此音频功率放大器封装结构可解决一般在音频功率放大器封装结构中所存在的干扰和电源噪声问题，且音频功率放大器中的其他电路(如：运算放大器以及能带间隙参考电路等)可因此具有较佳的电源抑制比(power supply rejection ratio，PSRR)。此外，也可藉此改善音频功率放大器的总谐波失真附加噪声(total harmonic distortion plusnoise，THD+N)。
虽然本发明已以实施例揭露如上，但其并非用以限定本发明，任何所属技术领域中具有通常知识者，在不脱离本发明之精神和范围内，当可作各种更动与润饰，因此本发明的保护范围当视后附的权利要求所界定者为准。

Claims (8)

1.一种音频功率放大器封装结构，包含：
非信号接脚；
第一非信号焊垫，位于基板上；
第二非信号焊垫，位于该基板上；以及
多条焊线，分别连接该非信号接脚于该第一非信号焊垫以及该第二非信号焊垫。
2.如权利要求1所述的音频功率放大器封装结构，其中该非信号接脚是电源接脚。
3.如权利要求2所述的音频功率放大器封装结构，其中该第一非信号焊垫是电源焊垫，接收自该电源接脚经由该多条焊线的至少其中之一所传送的第一电源。
4.如权利要求3所述的音频功率放大器封装结构，其中该第二非信号焊垫是另一电源焊垫，接收自该电源接脚经由该多条焊线的至少其中之一所传送的第二电源。
5.一种音频功率放大器封装结构，包含：
基板；
多个焊垫，位于该基板上，该多个焊垫包含第一非信号焊垫以及第二非信号焊垫；
多个接脚，该多个接脚包含非信号接脚；以及
多条焊线，分别连接该非信号接脚于该第一非信号焊垫以及该第二非信号焊垫。
6.如权利要求5所述的音频功率放大器封装结构，其中该非信号接脚是电源接脚。
7.如权利要求6所述的音频功率放大器封装结构，其中该第一非信号焊垫是电源焊垫，接收自该电源接脚经由该多条焊线之至少其中之一所传送的第一电源。
8.如权利要求7所述的音频功率放大器封装结构，其中该第二非信号焊垫是另一电源焊垫，接收自该电源接脚经由该多条焊线的至少其中之一所传送的第二电源。
CN2008100962538A 2007-10-01 2008-05-06 音频功率放大器封装结构 Expired - Fee Related CN101404271B (zh)

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