CN101395725B - 光电子半导体芯片 - Google Patents

光电子半导体芯片 Download PDF

Info

Publication number
CN101395725B
CN101395725B CN200680053614XA CN200680053614A CN101395725B CN 101395725 B CN101395725 B CN 101395725B CN 200680053614X A CN200680053614X A CN 200680053614XA CN 200680053614 A CN200680053614 A CN 200680053614A CN 101395725 B CN101395725 B CN 101395725B
Authority
CN
China
Prior art keywords
substrate
semiconductor layer
semiconductor chip
layer sequence
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200680053614XA
Other languages
English (en)
Chinese (zh)
Other versions
CN101395725A (zh
Inventor
迈克尔·费雷尔
乌韦·施特劳斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of CN101395725A publication Critical patent/CN101395725A/zh
Application granted granted Critical
Publication of CN101395725B publication Critical patent/CN101395725B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10H20/833—Transparent materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10H20/835—Reflective materials

Landscapes

  • Led Devices (AREA)
  • Photovoltaic Devices (AREA)
  • Drying Of Semiconductors (AREA)
CN200680053614XA 2006-01-27 2006-12-20 光电子半导体芯片 Active CN101395725B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102006004172.0 2006-01-27
DE102006004172 2006-01-27
DE102006015788A DE102006015788A1 (de) 2006-01-27 2006-04-04 Optoelektronischer Halbleiterchip
DE102006015788.5 2006-04-04
PCT/DE2006/002293 WO2007085218A1 (de) 2006-01-27 2006-12-20 Optoelektronischer halbleiterchip

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201010277177.8A Division CN101976718B (zh) 2006-01-27 2006-12-20 光电子半导体芯片

Publications (2)

Publication Number Publication Date
CN101395725A CN101395725A (zh) 2009-03-25
CN101395725B true CN101395725B (zh) 2010-11-10

Family

ID=37898325

Family Applications (2)

Application Number Title Priority Date Filing Date
CN200680053614XA Active CN101395725B (zh) 2006-01-27 2006-12-20 光电子半导体芯片
CN201010277177.8A Active CN101976718B (zh) 2006-01-27 2006-12-20 光电子半导体芯片

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201010277177.8A Active CN101976718B (zh) 2006-01-27 2006-12-20 光电子半导体芯片

Country Status (8)

Country Link
US (1) US8581280B2 (cg-RX-API-DMAC10.html)
EP (1) EP1977457B1 (cg-RX-API-DMAC10.html)
JP (1) JP2009524918A (cg-RX-API-DMAC10.html)
KR (1) KR20080091249A (cg-RX-API-DMAC10.html)
CN (2) CN101395725B (cg-RX-API-DMAC10.html)
DE (1) DE102006015788A1 (cg-RX-API-DMAC10.html)
TW (1) TWI350597B (cg-RX-API-DMAC10.html)
WO (1) WO2007085218A1 (cg-RX-API-DMAC10.html)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5286641B2 (ja) * 2006-03-29 2013-09-11 日亜化学工業株式会社 半導体発光素子及び半導体発光装置
DE102007002416A1 (de) 2006-04-13 2007-10-18 Osram Opto Semiconductors Gmbh Strahlungsemittierender Körper und Verfahren zur Herstellung eines strahlungsemittierenden Körpers
DE102006061167A1 (de) 2006-04-25 2007-12-20 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement
DE102007027641B4 (de) * 2007-06-15 2015-12-03 Huga Optotech Inc. Verfahren zum Herstellen einer Licht emittierenden Diode
DE102007035687A1 (de) * 2007-07-30 2009-02-05 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement mit einem Schichtenstapel
JP5126884B2 (ja) * 2008-01-16 2013-01-23 シャープ株式会社 窒化物半導体発光素子および窒化物半導体発光素子の製造方法
DE102008006987A1 (de) 2008-01-31 2009-08-06 Osram Opto Semiconductors Gmbh Strahlungsempfänger und Verfahren zur Herstellung eines Strahlungsempfängers
CN102047454B (zh) * 2008-04-16 2013-04-10 Lg伊诺特有限公司 发光器件及其制造方法
DE102008052405A1 (de) * 2008-10-21 2010-04-22 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement
JP2010192835A (ja) * 2009-02-20 2010-09-02 Showa Denko Kk 発光ダイオード及びその製造方法、並びに発光ダイオードランプ
DE102009032486A1 (de) * 2009-07-09 2011-01-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
JP2012004476A (ja) * 2010-06-21 2012-01-05 Toshiba Corp 発光装置
DE102010031237A1 (de) 2010-07-12 2012-01-12 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
DE102010027679A1 (de) 2010-07-20 2012-01-26 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
DE102010038405A1 (de) 2010-07-26 2012-01-26 Osram Opto Semiconductors Gmbh Elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements
DE102010039382A1 (de) 2010-08-17 2012-02-23 Osram Opto Semiconductors Gmbh Elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements
KR101274651B1 (ko) 2010-11-30 2013-06-12 엘지디스플레이 주식회사 발광 다이오드 및 이의 제조 방법
US8802461B2 (en) * 2011-03-22 2014-08-12 Micron Technology, Inc. Vertical light emitting devices with nickel silicide bonding and methods of manufacturing
JP6056150B2 (ja) * 2011-04-08 2017-01-11 日亜化学工業株式会社 半導体発光素子
DE102011080458A1 (de) 2011-08-04 2013-02-07 Osram Opto Semiconductors Gmbh Optoelektronische anordnung und verfahren zur herstellung einer optoelektronischen anordnung
DE102011087543A1 (de) 2011-12-01 2013-06-06 Osram Opto Semiconductors Gmbh Optoelektronische anordnung
DE102012200416B4 (de) 2012-01-12 2018-03-01 Osram Opto Semiconductors Gmbh Optoelektronisches modul und verfahren zur herstellung eines optoelektronischen moduls
GB201202222D0 (en) * 2012-02-09 2012-03-28 Mled Ltd Enhanced light extraction
DE102012202102A1 (de) * 2012-02-13 2013-08-14 Osram Gmbh Leuchtvorrichtung mit Volumenstrahler-LED-Chips auf einem gemeinsamen Substrat
JP2015509669A (ja) * 2012-03-06 2015-03-30 ソラア インコーポレーテッドSoraa Inc. 導波光効果を低減させる低屈折率材料層を有する発光ダイオード
US9053279B2 (en) 2013-03-14 2015-06-09 Taiwan Semiconductor Manufacturing Company, Ltd. Pattern modification with a preferred position function
JP2015162631A (ja) * 2014-02-28 2015-09-07 サンケン電気株式会社 発光素子
DE102014107555A1 (de) * 2014-05-28 2015-12-03 Osram Opto Semiconductors Gmbh Elektrische Kontaktstruktur für ein Halbleiterbauelement und Halbleiterbauelement
DE102015103840A1 (de) * 2015-03-16 2016-09-22 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung emittierende Baugruppe
DE102016100563B4 (de) 2016-01-14 2021-08-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen einer optoelektronischen Leuchtvorrichtung und optoelektronische Leuchtvorrichtung
DE102018113573B4 (de) * 2018-06-07 2022-11-03 Semikron Elektronik Gmbh & Co. Kg Patentabteilung Diode mit einem Halbleiterkörper
DE102018115225A1 (de) * 2018-06-25 2020-01-02 Otto-Von-Guericke-Universität Magdeburg Lichtemmitierendes Halbleiterbauelement oder Halbleiterbauelementmodul

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20022541U1 (de) * 2000-02-15 2002-02-28 OSRAM Opto Semiconductors GmbH & Co. oHG, 93049 Regensburg Lichtemittierendes Bauelement mit verbesserter Lichtauskopplung

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5132577A (en) * 1991-04-11 1992-07-21 National Semiconductor Corporation High speed passgate, latch and flip-flop circuits
US5892784A (en) * 1994-10-27 1999-04-06 Hewlett-Packard Company N-drive p-common surface emitting laser fabricated on n+ substrate
JP3165374B2 (ja) 1995-08-31 2001-05-14 株式会社東芝 化合物半導体の電極の形成方法
US5789265A (en) 1995-08-31 1998-08-04 Kabushiki Kaisha Toshiba Method of manufacturing blue light-emitting device by using BCL3 and CL2
US6803243B2 (en) * 2001-03-15 2004-10-12 Cree, Inc. Low temperature formation of backside ohmic contacts for vertical devices
JP3469484B2 (ja) 1998-12-24 2003-11-25 株式会社東芝 半導体発光素子およびその製造方法
US7205578B2 (en) 2000-02-15 2007-04-17 Osram Gmbh Semiconductor component which emits radiation, and method for producing the same
DE10006738C2 (de) 2000-02-15 2002-01-17 Osram Opto Semiconductors Gmbh Lichtemittierendes Bauelement mit verbesserter Lichtauskopplung und Verfahren zu seiner Herstellung
JP3506175B2 (ja) 2000-10-05 2004-03-15 日本電気株式会社 メモリ制御回路とメモリ制御方法
US6791119B2 (en) 2001-02-01 2004-09-14 Cree, Inc. Light emitting diodes including modifications for light extraction
US6747298B2 (en) 2001-07-23 2004-06-08 Cree, Inc. Collets for bonding of light emitting diodes having shaped substrates
DE10155442A1 (de) 2001-11-12 2003-05-28 Osram Opto Semiconductors Gmbh Ohmsche Kontaktstruktur und Verfahren zu deren Herstellung
JP2003168845A (ja) * 2001-12-03 2003-06-13 Hitachi Ltd 半導体レーザ素子及びこれを用いた光モジュール、及び光システム
US6878975B2 (en) * 2002-02-08 2005-04-12 Agilent Technologies, Inc. Polarization field enhanced tunnel structures
TWI228323B (en) 2002-09-06 2005-02-21 Sony Corp Semiconductor light emitting device and its manufacturing method, integrated semiconductor light emitting device and manufacturing method thereof, image display device and its manufacturing method, illumination device and manufacturing method thereof
JP4143732B2 (ja) * 2002-10-16 2008-09-03 スタンレー電気株式会社 車載用波長変換素子
US20050173724A1 (en) 2004-02-11 2005-08-11 Heng Liu Group III-nitride based LED having a transparent current spreading layer
TWI240439B (en) 2003-09-24 2005-09-21 Sanken Electric Co Ltd Nitride semiconductor device and manufacturing method thereof
KR100647279B1 (ko) * 2003-11-14 2006-11-17 삼성전자주식회사 질화물계 발광소자 및 그 제조방법
JP2005268601A (ja) 2004-03-19 2005-09-29 Sumitomo Chemical Co Ltd 化合物半導体発光素子
US7022550B2 (en) * 2004-04-07 2006-04-04 Gelcore Llc Methods for forming aluminum-containing p-contacts for group III-nitride light emitting diodes
DE102004040277B4 (de) * 2004-06-30 2015-07-30 Osram Opto Semiconductors Gmbh Reflektierendes Schichtsystem mit einer Mehrzahl von Schichten zur Aufbringung auf ein III/V-Verbindungshalbleitermaterial
DE102004050891B4 (de) * 2004-10-19 2019-01-10 Lumileds Holding B.V. Lichtmittierende III-Nitrid-Halbleitervorrichtung
JP2007208047A (ja) * 2006-02-02 2007-08-16 Fujikura Ltd 半導体発光素子
DE102008030818B4 (de) * 2008-06-30 2022-03-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Oberflächenemittierender Halbleiterlaser mit mehreren aktiven Zonen

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20022541U1 (de) * 2000-02-15 2002-02-28 OSRAM Opto Semiconductors GmbH & Co. oHG, 93049 Regensburg Lichtemittierendes Bauelement mit verbesserter Lichtauskopplung

Also Published As

Publication number Publication date
KR20080091249A (ko) 2008-10-09
JP2009524918A (ja) 2009-07-02
CN101395725A (zh) 2009-03-25
WO2007085218A1 (de) 2007-08-02
TWI350597B (en) 2011-10-11
US8581280B2 (en) 2013-11-12
US20090315048A1 (en) 2009-12-24
EP1977457A1 (de) 2008-10-08
CN101976718B (zh) 2014-06-11
DE102006015788A1 (de) 2007-09-13
CN101976718A (zh) 2011-02-16
EP1977457B1 (de) 2018-05-09
TW200737553A (en) 2007-10-01

Similar Documents

Publication Publication Date Title
CN101976718B (zh) 光电子半导体芯片
CN101681958B (zh) 光电子半导体本体及其制造方法
CN101427392B (zh) 光电子半导体芯片
KR101290629B1 (ko) 광전 소자 및 그 제조방법
CN101026213B (zh) 发光器件及其制造方法
CN103069568B (zh) 光电子半导体芯片和用于制造光电子半导体芯片的方法
CN103765616B (zh) 发光二极管芯片
US8067783B2 (en) Radiation-emitting chip comprising at least one semiconductor body
CN102569589B (zh) 半导体发光元件
KR101007139B1 (ko) 발광소자 및 그 제조방법
KR20120027318A (ko) 반사 구조를 갖는 반도체 발광 다이오드 및 그 제조 방법
CN1897316A (zh) 具有反射层的高亮度发光二极管结构
JP2008085337A (ja) 半導体ボディおよび半導体チップ
US10629780B2 (en) Light emitting diode chip with a reflective layer sequence
US8710486B2 (en) Optoelectronic semiconductor chip and method for manufacturing a contact structure for such a chip
CN1860621A (zh) 半导体发光元件
JP2003179255A (ja) 光の抽出を改善すべくフリップチップ発光ダイオードに量子井戸を選択的に設ける方法
US8841685B2 (en) Optoelectronic semiconductor chip
US10910538B2 (en) Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component
US20090121245A1 (en) Optoelectronic Semiconductor Chip
CN103219415B (zh) 光电半导体装置及其制造方法
CN107851691B (zh) 光电子半导体芯片
KR101550951B1 (ko) 발광소자
CN101471388A (zh) 光电半导体装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant