CN101378622B - 一种用于柔性线路板的覆盖膜及其制备方法 - Google Patents
一种用于柔性线路板的覆盖膜及其制备方法 Download PDFInfo
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- CN101378622B CN101378622B CN200710147641XA CN200710147641A CN101378622B CN 101378622 B CN101378622 B CN 101378622B CN 200710147641X A CN200710147641X A CN 200710147641XA CN 200710147641 A CN200710147641 A CN 200710147641A CN 101378622 B CN101378622 B CN 101378622B
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- coverlay
- soluble polyimide
- weight
- warpage
- circuit board
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Abstract
Description
编号 | 附着力(N/cm) |
实施例5 | 6.1 |
对比例2 | 2.7 |
实施例6 | 5.9 |
编号 | 产品合格率(%) | 附着力(N/cm) |
实施例12 | 100 | 6.3 |
实施例13 | 100 | 6.6 |
实施例14 | 100 | 6.2 |
实施例15 | 100 | 6.5 |
实施例16 | 85 | 6.2 |
编号 | 印刷连续性测试 |
实施例17 | 通过 |
对比例3 | 第10次图案有变形 |
实施例18 | 通过 |
实施例19 | 通过 |
实施例20 | 通过 |
Claims (12)
Priority Applications (1)
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CN200710147641XA CN101378622B (zh) | 2007-08-31 | 2007-08-31 | 一种用于柔性线路板的覆盖膜及其制备方法 |
Applications Claiming Priority (1)
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CN200710147641XA CN101378622B (zh) | 2007-08-31 | 2007-08-31 | 一种用于柔性线路板的覆盖膜及其制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN101378622A CN101378622A (zh) | 2009-03-04 |
CN101378622B true CN101378622B (zh) | 2011-10-12 |
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CN200710147641XA Active CN101378622B (zh) | 2007-08-31 | 2007-08-31 | 一种用于柔性线路板的覆盖膜及其制备方法 |
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CN (1) | CN101378622B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102271466B (zh) * | 2011-07-08 | 2013-04-24 | 深圳市精诚达电路科技股份有限公司 | 一种柔性印刷线路板的表面保护方法 |
CN102347397B (zh) * | 2011-07-14 | 2013-04-03 | 宁波尤利卡太阳能科技发展有限公司 | 解决网布堵塞的方法 |
CN106410063B (zh) * | 2016-11-21 | 2018-08-14 | 信利半导体有限公司 | 一种柔性基板的制造方法和柔性电子器件的制造方法 |
CN107216678A (zh) * | 2017-06-28 | 2017-09-29 | 盐城艾肯科技有限公司 | 一种具有阻燃性能的覆盖膜的生产方法 |
CN113913149A (zh) * | 2021-11-18 | 2022-01-11 | 广州联茂电子科技有限公司 | 一种改良聚酰亚胺粘着剂和软性金属箔基板及制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1592540A (zh) * | 2003-08-27 | 2005-03-09 | 三井化学株式会社 | 聚酰亚胺金属层压体 |
CN1793231A (zh) * | 2006-01-10 | 2006-06-28 | 上海电器科学研究所(集团)有限公司 | 一种耐电晕聚酰亚胺薄膜及其制备方法 |
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- 2007-08-31 CN CN200710147641XA patent/CN101378622B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1592540A (zh) * | 2003-08-27 | 2005-03-09 | 三井化学株式会社 | 聚酰亚胺金属层压体 |
CN1793231A (zh) * | 2006-01-10 | 2006-06-28 | 上海电器科学研究所(集团)有限公司 | 一种耐电晕聚酰亚胺薄膜及其制备方法 |
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CN101378622A (zh) | 2009-03-04 |
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EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen BYD Electronic Component Co., Ltd. Assignor: Biyadi Co., Ltd. Contract fulfillment period: 2008.4.25 to 2015.11.14 Contract record no.: 2008440000067 Denomination of invention: Covering film for flexible circuit board and preparation method thereof License type: Exclusive license Record date: 20080504 |
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LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.4.25 TO 2015.11.14; CHANGE OF CONTRACT Name of requester: BIYADI ELECTRON MEMBER CO., LTD., SHENZHEN CITY Effective date: 20080504 |
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Effective date of registration: 20201204 Address after: No.3-6 xiajiadai, Guangfu village, Xieqiao Town, Jingjiang City, Taizhou City, Jiangsu Province Patentee after: Jingjiang Ruineng Information Technology Co., Ltd Address before: 518119 BYD Industrial Park, Yanan Road, Kwai Chung Town, Longgang District, Guangdong, Shenzhen Patentee before: BYD Co.,Ltd. |
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Effective date of registration: 20220623 Address after: No.12 Dajue North Road, Xieqiao Town, Jingjiang City, Taizhou City, Jiangsu Province Patentee after: JIANGSU KAIYUAN TECHNOLOGY Co.,Ltd. Address before: No. 3-6, xiajiadai, Guangfu village, Xieqiao Town, Jingjiang City, Taizhou City, Jiangsu Province, 214500 Patentee before: Jingjiang Ruineng Information Technology Co.,Ltd. |
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