CN101354533B - 感光性糊剂组合物和图案形成方法 - Google Patents

感光性糊剂组合物和图案形成方法 Download PDF

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Publication number
CN101354533B
CN101354533B CN2008101611420A CN200810161142A CN101354533B CN 101354533 B CN101354533 B CN 101354533B CN 2008101611420 A CN2008101611420 A CN 2008101611420A CN 200810161142 A CN200810161142 A CN 200810161142A CN 101354533 B CN101354533 B CN 101354533B
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China
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methyl
acid
pattern
weight
photosensitive paste
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Expired - Fee Related
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CN2008101611420A
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English (en)
Chinese (zh)
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CN101354533A (zh
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工藤和生
板野考史
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JSR Corp
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JSR Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
CN2008101611420A 2007-07-09 2008-07-09 感光性糊剂组合物和图案形成方法 Expired - Fee Related CN101354533B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-179179 2007-07-09
JP2007179179 2007-07-09
JP2007179179 2007-07-09

Publications (2)

Publication Number Publication Date
CN101354533A CN101354533A (zh) 2009-01-28
CN101354533B true CN101354533B (zh) 2012-10-10

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CN2008101611420A Expired - Fee Related CN101354533B (zh) 2007-07-09 2008-07-09 感光性糊剂组合物和图案形成方法

Country Status (3)

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JP (2) JP4640460B2 (enExample)
KR (1) KR101106921B1 (enExample)
CN (1) CN101354533B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5120119B2 (ja) * 2008-07-10 2013-01-16 Ｊｓｒ株式会社 感光性ペースト組成物およびパターン形成方法
JP5120120B2 (ja) * 2008-07-15 2013-01-16 Ｊｓｒ株式会社 感光性ペースト組成物およびパターン形成方法
JP2010102200A (ja) * 2008-10-24 2010-05-06 Jsr Corp 感光性ペースト組成物およびパターン形成方法
KR101138795B1 (ko) * 2008-12-23 2012-04-24 제일모직주식회사 감광성 페이스트 조성물 이를 이용하여 제조한 플라즈마 디스플레이 전극
JP5287397B2 (ja) * 2009-03-18 2013-09-11 Ｊｓｒ株式会社 アルミニウム含有感光性樹脂組成物およびパターン形成方法
JP5347665B2 (ja) * 2009-04-07 2013-11-20 Ｊｓｒ株式会社 アルミニウム含有感光性組成物および電極の製造方法
JP2011007864A (ja) * 2009-06-23 2011-01-13 Jsr Corp 感光性ペースト組成物およびパターン形成方法
CN103295659B (zh) * 2012-02-24 2016-03-30 比亚迪股份有限公司 太阳能电池用导电浆料及其制备方法
JP5884556B2 (ja) * 2012-03-02 2016-03-15 東レ株式会社 感光性導電ペースト
WO2013165223A1 (ko) * 2012-05-03 2013-11-07 주식회사 엘지화학 태양전지 제조에서 이용 가능한 잉크 조성물 및 이를 이용한 패턴형성방법
US9302466B2 (en) 2012-05-03 2016-04-05 Lg Chem, Ltd. Ink composition usable in solar battery manufacturing process, and method of forming pattern using the same
CN104620325B (zh) * 2012-06-15 2016-09-21 株式会社村田制作所 导电性糊膏、及层叠陶瓷电子零件与其制造方法
KR20210068417A (ko) * 2018-10-03 2021-06-09 에이치디 마이크로시스템즈 가부시키가이샤 감광성 수지 조성물, 패턴 경화물의 제조 방법, 경화물, 층간 절연막, 커버 코트층, 표면 보호막 및 전자 부품
JP7238316B2 (ja) * 2018-10-03 2023-03-14 Ｈｄマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1828413A (zh) * 2005-03-01 2006-09-06 太阳油墨股份有限公司 感光性糊剂、以及使用其形成的烧成物图案

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3510761B2 (ja) * 1997-03-26 2004-03-29 太陽インキ製造株式会社 アルカリ現像型光硬化性導電性ペースト組成物及びそれを用いて電極形成したプラズマディスプレイパネル
KR100669725B1 (ko) * 2004-09-09 2007-01-16 삼성에스디아이 주식회사 감광성 페이스트 조성물
JP2006126354A (ja) * 2004-10-27 2006-05-18 Sumitomo Bakelite Co Ltd 感光性樹脂組成物及びパターン形成樹脂層の製造方法、並びに該感光性樹脂組成物を含む半導体装置及び表示素子
JP2006219660A (ja) * 2005-01-11 2006-08-24 Jsr Corp 無機粉体含有樹脂組成物、転写フィルムおよびプラズマディスプレイパネルの製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1828413A (zh) * 2005-03-01 2006-09-06 太阳油墨股份有限公司 感光性糊剂、以及使用其形成的烧成物图案

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP特开2000-204130A 2000.07.25
JP特开2006-86123A 2006.03.30

Also Published As

Publication number Publication date
KR101106921B1 (ko) 2012-01-25
JP2011065166A (ja) 2011-03-31
JP4640460B2 (ja) 2011-03-02
JP4645774B1 (ja) 2011-03-09
KR20090005990A (ko) 2009-01-14
CN101354533A (zh) 2009-01-28
JP2009037232A (ja) 2009-02-19

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