CN101312903A - 制造微机电元件的方法以及该微机电元件 - Google Patents
制造微机电元件的方法以及该微机电元件 Download PDFInfo
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- CN101312903A CN101312903A CNA2006800439807A CN200680043980A CN101312903A CN 101312903 A CN101312903 A CN 101312903A CN A2006800439807 A CNA2006800439807 A CN A2006800439807A CN 200680043980 A CN200680043980 A CN 200680043980A CN 101312903 A CN101312903 A CN 101312903A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0006—Interconnects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/007—Interconnections between the MEMS and external electrical signals
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
- B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
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- G—PHYSICS
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- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
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- G—PHYSICS
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- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
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- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
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- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
- B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
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- B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
- B81B2207/015—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being integrated on the same substrate
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- B81C2203/00—Forming microstructural systems
- B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
- B81C2203/0785—Transfer and j oin technology, i.e. forming the electronic processing unit and the micromechanical structure on separate substrates and joining the substrates
- B81C2203/0792—Forming interconnections between the electronic processing unit and the micromechanical structure
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- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Remote Sensing (AREA)
- Radar, Positioning & Navigation (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Micromachines (AREA)
- Pressure Sensors (AREA)
- Gyroscopes (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
Description
Claims (106)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510108718.7A CN104909332B (zh) | 2005-11-23 | 2006-11-21 | 制造微机电元件的方法以及该微机电元件 |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20055618A FI119728B (fi) | 2005-11-23 | 2005-11-23 | Menetelmä mikroelektromekaanisen komponentin valmistamiseksi ja mikroelektromekaaninen komponentti |
FI20055618 | 2005-11-23 | ||
US11/430,035 US7982291B2 (en) | 2005-11-23 | 2006-05-09 | Method for manufacturing a microelectromechanical component, and a microelectromechanical component |
US11/430,035 | 2006-05-09 | ||
PCT/FI2006/050508 WO2007060290A1 (en) | 2005-11-23 | 2006-11-21 | Method for manufacturing a microelectromechanical component, and a microelectromechanical component |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201510108718.7A Division CN104909332B (zh) | 2005-11-23 | 2006-11-21 | 制造微机电元件的方法以及该微机电元件 |
Publications (2)
Publication Number | Publication Date |
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CN101312903A true CN101312903A (zh) | 2008-11-26 |
CN101312903B CN101312903B (zh) | 2015-04-29 |
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ID=35458858
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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CN201510108718.7A Active CN104909332B (zh) | 2005-11-23 | 2006-11-21 | 制造微机电元件的方法以及该微机电元件 |
CN200680043980.7A Active CN101312903B (zh) | 2005-11-23 | 2006-11-21 | 制造微机电元件的方法以及该微机电元件 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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CN201510108718.7A Active CN104909332B (zh) | 2005-11-23 | 2006-11-21 | 制造微机电元件的方法以及该微机电元件 |
Country Status (8)
Country | Link |
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US (3) | US7982291B2 (zh) |
EP (2) | EP2993156B1 (zh) |
JP (2) | JP2009516598A (zh) |
KR (1) | KR101434321B1 (zh) |
CN (2) | CN104909332B (zh) |
FI (1) | FI119728B (zh) |
MY (1) | MY171269A (zh) |
WO (1) | WO2007060290A1 (zh) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102107846A (zh) * | 2009-12-28 | 2011-06-29 | 鑫创科技股份有限公司 | 密封微机电系统装置及其制造方法与封装结构 |
CN102431951A (zh) * | 2011-12-31 | 2012-05-02 | 天水华天科技股份有限公司 | 一种双载体双mems器件封装件及其生产方法 |
CN102538773A (zh) * | 2010-12-20 | 2012-07-04 | 罗伯特·博世有限公司 | 微机电的元件以及用于制造这样的微机电的元件的方法 |
CN102706369A (zh) * | 2012-06-27 | 2012-10-03 | 清华大学 | 三维集成悬空传感器及其制造方法 |
CN103033699A (zh) * | 2011-09-30 | 2013-04-10 | 意法半导体股份有限公司 | Mems器件、其条带测试方法及其测试条带 |
CN104236628A (zh) * | 2014-09-16 | 2014-12-24 | 武汉大学 | 一种四自由度组合传感器 |
CN104977027A (zh) * | 2015-05-29 | 2015-10-14 | 江阴苏阳电子股份有限公司 | 基于mcm-3d封装的微型智能传感器 |
CN105621348A (zh) * | 2015-12-29 | 2016-06-01 | 苏州工业园区纳米产业技术研究院有限公司 | 一种mems惯性传感器件及其制造方法 |
CN108231056A (zh) * | 2016-12-13 | 2018-06-29 | 福特全球技术公司 | 车门中使用的用来提高车门的声质车辆性能的微机电系统 |
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CN108231056B (zh) * | 2016-12-13 | 2023-09-22 | 福特全球技术公司 | 车门中使用的用来提高车门的声质车辆性能的微机电系统 |
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EP1951609A1 (en) | 2008-08-06 |
US8450816B2 (en) | 2013-05-28 |
FI119728B (fi) | 2009-02-27 |
EP2993156A1 (en) | 2016-03-09 |
CN104909332B (zh) | 2017-04-12 |
JP2009516598A (ja) | 2009-04-23 |
EP2993156B1 (en) | 2018-05-16 |
JP5834098B2 (ja) | 2015-12-16 |
MY171269A (en) | 2019-10-07 |
US7982291B2 (en) | 2011-07-19 |
US20120119312A1 (en) | 2012-05-17 |
CN104909332A (zh) | 2015-09-16 |
WO2007060290A1 (en) | 2007-05-31 |
CN101312903B (zh) | 2015-04-29 |
KR20080079283A (ko) | 2008-08-29 |
KR101434321B1 (ko) | 2014-08-27 |
JP2014131830A (ja) | 2014-07-17 |
US20070114623A1 (en) | 2007-05-24 |
FI20055618A0 (fi) | 2005-11-23 |
US20090137079A1 (en) | 2009-05-28 |
US8124435B2 (en) | 2012-02-28 |
EP1951609A4 (en) | 2014-01-22 |
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