CN101308865B - 有机电致发光显示装置 - Google Patents
有机电致发光显示装置 Download PDFInfo
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- CN101308865B CN101308865B CN2008100991668A CN200810099166A CN101308865B CN 101308865 B CN101308865 B CN 101308865B CN 2008100991668 A CN2008100991668 A CN 2008100991668A CN 200810099166 A CN200810099166 A CN 200810099166A CN 101308865 B CN101308865 B CN 101308865B
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Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/5329—Insulating materials
- H01L23/53295—Stacked insulating layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/14—Carrier transporting layers
- H10K50/16—Electron transporting layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/17—Carrier injection layers
- H10K50/171—Electron injection layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP127805/07 | 2007-05-14 | ||
JP2007127805 | 2007-05-14 | ||
JP2008037190A JP2008311212A (ja) | 2007-05-14 | 2008-02-19 | 有機エレクトロルミネッセンス表示装置 |
JP037190/08 | 2008-02-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101308865A CN101308865A (zh) | 2008-11-19 |
CN101308865B true CN101308865B (zh) | 2010-09-29 |
Family
ID=40125184
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008100991668A Active CN101308865B (zh) | 2007-05-14 | 2008-05-14 | 有机电致发光显示装置 |
Country Status (3)
Country | Link |
---|---|
JP (2) | JP2008311212A (zh) |
KR (1) | KR101480973B1 (zh) |
CN (1) | CN101308865B (zh) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010153070A (ja) * | 2008-12-24 | 2010-07-08 | Seiko Epson Corp | El装置、el装置の製造方法、及び電子機器 |
US8367516B2 (en) * | 2009-01-14 | 2013-02-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Laser bonding for stacking semiconductor substrates |
JP5435260B2 (ja) * | 2009-04-03 | 2014-03-05 | ソニー株式会社 | 表示装置およびその製造方法 |
CN105810753A (zh) * | 2009-09-04 | 2016-07-27 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
JP2012114073A (ja) * | 2010-11-04 | 2012-06-14 | Sony Corp | 表示装置、表示装置の製造方法および電子機器 |
WO2013031162A1 (ja) | 2011-08-26 | 2013-03-07 | パナソニック株式会社 | El表示装置およびその製造方法 |
WO2013069234A1 (ja) | 2011-11-07 | 2013-05-16 | パナソニック株式会社 | 有機el表示パネル及び有機el表示装置 |
JPWO2013069233A1 (ja) | 2011-11-07 | 2015-04-02 | パナソニック株式会社 | 有機el表示パネル及び有機el表示装置 |
JP6082907B2 (ja) * | 2012-02-17 | 2017-02-22 | 株式会社Joled | 表示装置及び表示装置の製造方法 |
JP6136578B2 (ja) * | 2013-05-29 | 2017-05-31 | ソニー株式会社 | 表示装置および表示装置の製造方法ならびに電子機器 |
US9362345B2 (en) * | 2013-05-31 | 2016-06-07 | Samsung Display Co., Ltd. | Organic light emitting display apparatus and method of manufacturing the same |
JP6136890B2 (ja) * | 2013-11-26 | 2017-05-31 | ソニー株式会社 | 表示装置、表示装置の製造方法および電子機器 |
KR102609229B1 (ko) * | 2014-09-11 | 2023-12-05 | 엘지디스플레이 주식회사 | 유기발광 표시장치 및 그의 제조방법 |
TWI538197B (zh) * | 2014-10-06 | 2016-06-11 | 友達光電股份有限公司 | 有機發光二極體顯示裝置 |
JP6546387B2 (ja) * | 2014-10-28 | 2019-07-17 | 株式会社ジャパンディスプレイ | 表示装置 |
KR102464613B1 (ko) * | 2015-04-30 | 2022-11-08 | 엘지디스플레이 주식회사 | 유기 발광 표시장치 및 이의 제조 방법 |
JP6685675B2 (ja) * | 2015-09-07 | 2020-04-22 | 株式会社Joled | 有機el素子、それを用いた有機el表示パネル、及び有機el表示パネルの製造方法 |
CN110047893B (zh) * | 2019-04-23 | 2021-08-03 | 深圳市华星光电半导体显示技术有限公司 | 一种有机发光二极管显示器及其制作方法 |
CN110828693A (zh) * | 2019-10-30 | 2020-02-21 | 深圳市华星光电半导体显示技术有限公司 | 有机发光二极体器件和其制作方法 |
WO2021259082A1 (zh) * | 2020-06-22 | 2021-12-30 | 京东方科技集团股份有限公司 | 有机发光显示面板及其制备方法、显示装置 |
CN111863918B (zh) * | 2020-07-29 | 2023-05-02 | 京东方科技集团股份有限公司 | 显示背板及其制作方法、显示面板和显示装置 |
CN111863929B (zh) * | 2020-08-28 | 2024-02-20 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示装置 |
JP2022123434A (ja) * | 2021-02-12 | 2022-08-24 | 株式会社ジャパンディスプレイ | 表示装置 |
Citations (3)
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CN1379615A (zh) * | 2001-04-03 | 2002-11-13 | 松下电器产业株式会社 | 电致发光器件和使用该电致发光器件的照明装置 |
US6768257B1 (en) * | 1999-10-28 | 2004-07-27 | Sony Corporation | Display apparatus with ribs having conductive material |
CN1535085A (zh) * | 2002-12-11 | 2004-10-06 | ���ṫ˾ | 显示装置及其制造方法 |
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JP4519532B2 (ja) | 2003-06-16 | 2010-08-04 | 株式会社半導体エネルギー研究所 | 発光装置及び発光装置を用いた電子機器 |
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JP2006156267A (ja) | 2004-12-01 | 2006-06-15 | Sony Corp | 表示装置の製造方法および表示装置 |
JP2007073323A (ja) * | 2005-09-07 | 2007-03-22 | Seiko Epson Corp | 有機el装置及びその製造方法 |
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US6768257B1 (en) * | 1999-10-28 | 2004-07-27 | Sony Corporation | Display apparatus with ribs having conductive material |
CN1379615A (zh) * | 2001-04-03 | 2002-11-13 | 松下电器产业株式会社 | 电致发光器件和使用该电致发光器件的照明装置 |
CN1535085A (zh) * | 2002-12-11 | 2004-10-06 | ���ṫ˾ | 显示装置及其制造方法 |
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CN101308865A (zh) | 2008-11-19 |
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KR101480973B1 (ko) | 2015-01-09 |
JP2008311212A (ja) | 2008-12-25 |
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