CN101300289B - 倍半硅氧烷-二氧化钛杂化聚合物 - Google Patents

倍半硅氧烷-二氧化钛杂化聚合物 Download PDF

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Publication number
CN101300289B
CN101300289B CN200680040434.8A CN200680040434A CN101300289B CN 101300289 B CN101300289 B CN 101300289B CN 200680040434 A CN200680040434 A CN 200680040434A CN 101300289 B CN101300289 B CN 101300289B
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CN
China
Prior art keywords
silsesquioxane
titania
hybrid polymer
polymer
titania hybrid
Prior art date
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Expired - Fee Related
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CN200680040434.8A
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English (en)
Chinese (zh)
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CN101300289A (zh
Inventor
P·J·波帕
L·K·米尔斯
K·E·霍华德
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Dow Global Technologies LLC
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Dow Global Technologies LLC
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Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/58—Metal-containing linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Silicon Polymers (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Formation Of Insulating Films (AREA)
  • Paints Or Removers (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CN200680040434.8A 2005-10-28 2006-10-25 倍半硅氧烷-二氧化钛杂化聚合物 Expired - Fee Related CN101300289B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US73153605P 2005-10-28 2005-10-28
US60/731,536 2005-10-28
PCT/US2006/041662 WO2007053396A2 (en) 2005-10-28 2006-10-25 Silsesquioxane-titania hybrid polymers

Publications (2)

Publication Number Publication Date
CN101300289A CN101300289A (zh) 2008-11-05
CN101300289B true CN101300289B (zh) 2012-07-25

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN200680040434.8A Expired - Fee Related CN101300289B (zh) 2005-10-28 2006-10-25 倍半硅氧烷-二氧化钛杂化聚合物

Country Status (7)

Country Link
US (1) US8865845B2 (enExample)
EP (1) EP1943294B1 (enExample)
JP (1) JP5464855B2 (enExample)
KR (1) KR101322045B1 (enExample)
CN (1) CN101300289B (enExample)
TW (1) TWI443128B (enExample)
WO (1) WO2007053396A2 (enExample)

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CN101970540B (zh) * 2008-03-05 2014-07-23 陶氏康宁公司 倍半硅氧烷树脂
JP2010209288A (ja) * 2009-03-12 2010-09-24 Kagoshima Univ 酸化チタンを含有する水溶性複合材料及びその製造方法
JP5615620B2 (ja) * 2010-08-09 2014-10-29 日東電工株式会社 金属酸化物粒子の製造方法
CN101974028B (zh) * 2010-09-28 2012-07-18 哈尔滨工业大学 含钛苯基半笼型倍半硅氧烷的制备方法
CN102061111B (zh) * 2010-10-27 2013-12-25 中山市旌旗纳米材料科技有限公司 自清洁陶瓷化纳米玻璃减反射涂料制造方法及其减反射膜制造方法
US8258636B1 (en) * 2011-05-17 2012-09-04 Rohm And Haas Electronic Materials Llc High refractive index curable liquid light emitting diode encapsulant formulation
US8257988B1 (en) * 2011-05-17 2012-09-04 Rohm And Haas Electronic Materials Llc Method of making light emitting diodes
US8450445B2 (en) 2011-08-17 2013-05-28 Rohm And Haas Electronic Materials Llc Light emitting diode manufacturing method
US8455607B2 (en) * 2011-08-17 2013-06-04 Rohm And Haas Electronic Materials Llc Curable liquid composite light emitting diode encapsulant
US9070548B2 (en) 2012-03-06 2015-06-30 Rohm And Haas Electronic Materials Llc Metal hardmask compositions
CN103013112A (zh) * 2012-11-21 2013-04-03 无锡南理工科技发展有限公司 一种改性纳米二氧化钛/热固性树脂复合材料及其制备方法
US9201305B2 (en) * 2013-06-28 2015-12-01 Az Electronic Materials (Luxembourg) S.A.R.L. Spin-on compositions of soluble metal oxide carboxylates and methods of their use
WO2015037398A1 (ja) * 2013-09-11 2015-03-19 Jsr株式会社 多層レジストプロセス用無機膜形成組成物及びパターン形成方法
US9006355B1 (en) 2013-10-04 2015-04-14 Burning Bush Group, Llc High performance silicon-based compositions
EP4303283A3 (en) * 2017-07-28 2024-02-28 Avery Dennison Corporation Pressure sensitive adhesives and articles with hyperbranched silsesquioxane core and methods of making the same
CN109265696B (zh) * 2018-09-27 2021-08-20 佛山一宇卫士陶瓷材料有限公司 一种陶瓷减水剂的制备方法
CN109867788A (zh) * 2019-03-18 2019-06-11 台州学院 一种有机硅-二氧化钛复合材料的制备方法
CN111004506B (zh) * 2019-12-23 2023-03-10 哈尔滨工业大学 一种具有抗紫外辐照特性的改性氰酸酯树脂制备方法
JP7605421B2 (ja) * 2020-12-07 2024-12-24 株式会社ダイセル チタン含有複合材料
CN113445303A (zh) * 2021-07-09 2021-09-28 广西五行材料科技有限公司 一种用于皮革、纺织品除甲醛杀菌的纳米材料及其制备方法
CN115678494B (zh) * 2022-09-09 2024-02-09 宁波聚力新材料科技有限公司 一种耐高温硅酮胶及其制备方法

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US5100503A (en) * 1990-09-14 1992-03-31 Ncr Corporation Silica-based anti-reflective planarizing layer

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US3615272A (en) 1968-11-04 1971-10-26 Dow Corning Condensed soluble hydrogensilsesquioxane resin
US5484867A (en) * 1993-08-12 1996-01-16 The University Of Dayton Process for preparation of polyhedral oligomeric silsesquioxanes and systhesis of polymers containing polyhedral oligomeric silsesqioxane group segments
JPH07331173A (ja) * 1995-02-21 1995-12-19 Toray Ind Inc 光学材料形成用塗液組成物および光学材料
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JP2005173552A (ja) 2003-11-20 2005-06-30 Tokyo Ohka Kogyo Co Ltd リソグラフィー用下層膜形成材料およびこれを用いた配線形成方法

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Non-Patent Citations (2)

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Kenji Wada etc..Synthesis of cooligomers of titanium-bridged silsesquioxanes and octakis (Hydridosilsesquioxane).《Chemistry Letters 2000》.2000,(第11期),第1332-1333页. *
W.C. Chen etc.."synthesis and characterization of oligomeric phenylsilsesquloxane-titania hybrid optical films".《MATERIALS CHEMISTRY AND PHYSICS》.2004,第83卷第71-77页.

Also Published As

Publication number Publication date
KR20080058503A (ko) 2008-06-25
US20100221666A1 (en) 2010-09-02
WO2007053396A2 (en) 2007-05-10
WO2007053396A3 (en) 2007-07-12
JP5464855B2 (ja) 2014-04-09
EP1943294B1 (en) 2013-09-18
TWI443128B (zh) 2014-07-01
KR101322045B1 (ko) 2013-10-25
EP1943294A2 (en) 2008-07-16
CN101300289A (zh) 2008-11-05
JP2009513788A (ja) 2009-04-02
US8865845B2 (en) 2014-10-21
TW200722457A (en) 2007-06-16

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Granted publication date: 20120725

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