CN101281876A - 半导体器件的制造方法以及半导体器件 - Google Patents

半导体器件的制造方法以及半导体器件 Download PDF

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Publication number
CN101281876A
CN101281876A CNA2008100921241A CN200810092124A CN101281876A CN 101281876 A CN101281876 A CN 101281876A CN A2008100921241 A CNA2008100921241 A CN A2008100921241A CN 200810092124 A CN200810092124 A CN 200810092124A CN 101281876 A CN101281876 A CN 101281876A
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China
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lead
wire
semiconductor device
semiconductor chip
electrode
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CNA2008100921241A
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Chinese (zh)
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小贺彰
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
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    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
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    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
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    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
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    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
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    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
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    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07553—Controlling the environment, e.g. atmosphere composition or temperature changes in shapes
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    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
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    • H10W72/541—Dispositions of bond wires
    • H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires
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    • H10W72/541—Dispositions of bond wires
    • H10W72/5438—Dispositions of bond wires the bond wires having multiple connections on the same bond pad
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    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
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    • H10W72/547—Dispositions of multiple bond wires
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    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
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    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
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    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
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    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
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    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
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    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
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    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips
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    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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CNA2008100921241A 2007-04-04 2008-04-03 半导体器件的制造方法以及半导体器件 Pending CN101281876A (zh)

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JP2007097904 2007-04-04
JP2007-097904 2007-04-04
JP2008-029858 2008-02-12

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102339766A (zh) * 2010-07-22 2012-02-01 上海华虹Nec电子有限公司 线路修复中的超长距离连线方法
CN102804372A (zh) * 2009-12-22 2012-11-28 泰塞拉公司 具有降低电感的结合键合元件的微电子组件
CN102820236A (zh) * 2011-06-08 2012-12-12 无锡华润安盛科技有限公司 一种预塑封引线框的引线键合方法
CN111670489A (zh) * 2018-02-07 2020-09-15 三菱电机株式会社 楔形工具、键合装置以及键合检查方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010098500A1 (ja) 2009-02-27 2010-09-02 三洋電機株式会社 半導体装置及びその製造方法
JP5411553B2 (ja) * 2009-03-31 2014-02-12 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 半導体装置の製造方法
JP2012044034A (ja) * 2010-08-20 2012-03-01 Stanley Electric Co Ltd 半導体発光装置および半導体発光装置の製造方法
JP2014170801A (ja) * 2013-03-01 2014-09-18 Sumitomo Electric Ind Ltd 半導体装置
JP2015146393A (ja) * 2014-02-03 2015-08-13 カルソニックカンセイ株式会社 超音波ウェッジボンディング構造
CN115763284A (zh) * 2022-12-24 2023-03-07 西安微电子技术研究所 一种提升芯片单焊盘可通过电流的引线键合方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102804372A (zh) * 2009-12-22 2012-11-28 泰塞拉公司 具有降低电感的结合键合元件的微电子组件
CN102339766A (zh) * 2010-07-22 2012-02-01 上海华虹Nec电子有限公司 线路修复中的超长距离连线方法
CN102820236A (zh) * 2011-06-08 2012-12-12 无锡华润安盛科技有限公司 一种预塑封引线框的引线键合方法
CN102820236B (zh) * 2011-06-08 2015-08-26 无锡华润安盛科技有限公司 一种预塑封引线框的引线键合方法
CN111670489A (zh) * 2018-02-07 2020-09-15 三菱电机株式会社 楔形工具、键合装置以及键合检查方法
CN111670489B (zh) * 2018-02-07 2024-04-19 三菱电机株式会社 楔形工具、键合装置以及键合检查方法

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Open date: 20081008