CN101261971B - 半导体装置及其制造方法 - Google Patents

半导体装置及其制造方法 Download PDF

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Publication number
CN101261971B
CN101261971B CN200810082197.2A CN200810082197A CN101261971B CN 101261971 B CN101261971 B CN 101261971B CN 200810082197 A CN200810082197 A CN 200810082197A CN 101261971 B CN101261971 B CN 101261971B
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CN
China
Prior art keywords
sealing material
semiconductor chip
sheet
conductive member
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN200810082197.2A
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English (en)
Chinese (zh)
Other versions
CN101261971A (zh
Inventor
东条启
木谷智之
井口知洋
平原昌子
西内秀夫
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Toshiba Corp
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Toshiba Corp
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Publication date
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Publication of CN101261971A publication Critical patent/CN101261971A/zh
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Publication of CN101261971B publication Critical patent/CN101261971B/zh
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN200810082197.2A 2007-03-08 2008-03-07 半导体装置及其制造方法 Expired - Fee Related CN101261971B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP058564/2007 2007-03-08
JP2007058564 2007-03-08
JP245852/2007 2007-09-21
JP2007245852A JP2008252058A (ja) 2007-03-08 2007-09-21 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
CN101261971A CN101261971A (zh) 2008-09-10
CN101261971B true CN101261971B (zh) 2010-04-14

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ID=39962312

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200810082197.2A Expired - Fee Related CN101261971B (zh) 2007-03-08 2008-03-07 半导体装置及其制造方法

Country Status (2)

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JP (1) JP2008252058A (enExample)
CN (1) CN101261971B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4970388B2 (ja) * 2008-09-03 2012-07-04 株式会社東芝 半導体装置及び半導体装置の製造方法
JP2011155082A (ja) * 2010-01-26 2011-08-11 Toshiba Corp 半導体装置の製造方法
US9373609B2 (en) * 2012-10-18 2016-06-21 Infineon Technologies Ag Bump package and methods of formation thereof
CN105789918B (zh) * 2016-04-25 2018-03-06 深圳市熙龙玩具有限公司 一种分离电路的元器件堆积式连接实现方法及电路

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5438222A (en) * 1989-08-28 1995-08-01 Semiconductor Energy Laboratory Co., Ltd. Electronic device with plural pad connection of semiconductor chip to leads
CN1433070A (zh) * 2001-12-27 2003-07-30 三星电机株式会社 芯片封装及其制造方法
CN1445844A (zh) * 2002-03-18 2003-10-01 三星电机株式会社 芯片比例封装及其制造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5438222A (en) * 1989-08-28 1995-08-01 Semiconductor Energy Laboratory Co., Ltd. Electronic device with plural pad connection of semiconductor chip to leads
CN1433070A (zh) * 2001-12-27 2003-07-30 三星电机株式会社 芯片封装及其制造方法
CN1445844A (zh) * 2002-03-18 2003-10-01 三星电机株式会社 芯片比例封装及其制造方法

Also Published As

Publication number Publication date
JP2008252058A (ja) 2008-10-16
CN101261971A (zh) 2008-09-10

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100414

Termination date: 20110307