CN101204836A - 锯切工件的方法和装置 - Google Patents

锯切工件的方法和装置 Download PDF

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CN101204836A
CN101204836A CNA200710192765XA CN200710192765A CN101204836A CN 101204836 A CN101204836 A CN 101204836A CN A200710192765X A CNA200710192765X A CN A200710192765XA CN 200710192765 A CN200710192765 A CN 200710192765A CN 101204836 A CN101204836 A CN 101204836A
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sawing
sawline
workpiece
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suspension
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F·斯科夫高-泽伦森
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Siltronic AG
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007Use, recovery or regeneration of abrasive mediums
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

本发明涉及一种适合于锯切工件的装置,该装置包括由锯线形成的锯线群组、保持待锯切工件并沿锯线群组的方向进给工件的向前进给装置、以及充填有锯切悬浮液的贮液器,该贮液器被布置并充填为使得,至少是锯线的在锯切过程中接合的部分被相应地浸入贮液器的锯切悬浮液中。本发明还涉及一种锯切工件的方法,在该方法中,将工件进给通过由锯线形成的锯线群组,其特征在于,工件的各锯缝在锯切过程中充填有锯切悬浮液。

Description

锯切工件的方法和装置
本发明涉及锯切工件的方法和装置。
为了锯切工件,即从工件上切割出多个晶圆,可以例如使用线锯。
线锯特别适用于在一个加工步骤中从工件上切割出多个半导体晶圆、太阳能晶圆和其它晶圆。
在US 5,771,876中描述了一种这样的线锯的工作原理。
线锯具有锯线群组,这些锯线群组由围绕两个或更多个锯线进给或引导辊缠绕的锯线形成。
锯线可以覆盖有切割层。
当使用锯线不带有牢固结合的切割磨料的线锯时,在切割过程中供应悬浮液(浆料)形式的切割磨料。
在切割过程中,使固定在工作台上的工件经过锯线群组,在锯线群组中锯线以彼此平行设置的锯线段的形式布置。借助于工作台与锯线群组之间的相对运动实现工件经过锯线群组的操作,该相对运动由向前进给装置产生,该向前进给装置相对于锯线群组进给工件(工作台向前进给)或者相对于工件进给锯线群组。
传统上,工件与锯带相连,锯线在切透工件之后切入锯带中。
锯带可以为例如石墨带,该石墨带粘接性地结合或者粘结到工件的圆周表面上。最后,带有锯带的工件粘结到工作台上。
在切割之后,切割的晶圆像梳齿一样保持固定在锯带上并因此可以从线锯中取出来。随后,从晶圆上取走留下的锯带。
已经发现,在进行线锯的情况下,在锯线离开的区域中在切割的晶圆上会出现锯槽(锯痕)。
在现有技术中还没有方法能够避免这种锯槽,本发明的目的是提供这样一种方法。
通过一种锯切工件的方法来达到本发明的目的,在该方法中,将工件进给通过由锯线形成的锯线群组,其特征在于,工件的各锯缝在锯切过程中充填有锯切悬浮液。
工件优选地浸入充填有锯切悬浮液的贮液器中,使得工件的锯缝充填有锯切悬浮液。
锯切悬浮液优选地含有磨料和载液。
本发明还涉及一种适合于锯切工件的装置,该装置包括由锯线形成的锯线群组、保持待锯切工件并沿锯线群组的方向进给工件的向前进给装置、以及充填有锯切悬浮液的贮液器,该贮液器被布置并充填为使得,至少是锯线的在锯切过程中接合的部分被相应地浸入贮液器的锯切悬浮液中。
本发明人已经发现,在根据现有技术将锯切悬浮液施加到锯线上之后,在锯缝中会发生锯切悬浮液的分离(分层)。锯切悬浮液的分离是指锯切悬浮液分离为构成磨料(例如碳化硅,Sic)和载液(例如乙二醇)。
本发明人还确定,观察到的锯槽是由锯缝中的这种锯切悬浮液的分离造成的。
采用根据本发明的方法可以避免锯切悬浮液的分离。
根据本发明可以实现上述目的,原因在于,优选地通过正浸入充填有锯切悬浮液的贮液器中的待锯切工件,使得在切割过程中锯缝中充填有锯切悬浮液,其中从下方充填贮液器。
在该情况下,优选地经由装配在贮液器底部的一个或多个喷嘴供应锯切悬浮液。这避免磨料沉积。
与锯线移动方向平行的贮液器端侧优选地构造成突伸超出贮液器侧表面的上边缘。这确保锯切悬浮液平行于锯线移动方向流出贮液器,即流出的锯切悬浮液的流动路线平行于锯线移动方向延伸。
贮液器和位于贮液器底部的一个或多个喷嘴的形状构造成使得最大程度地在贮液器中形成锯切悬浮液的层流。优选地通过各种穿孔板来实现这一点,穿孔板在贮液器底部的锯切悬浮液中产生均匀的压力分布。
由于整个锯缝都充填有锯切悬浮液,可以避免锯切悬浮液的分离。这是基于如下事实:在锯缝与周围区域之间锯切悬浮液的液体的浓度梯度更小。载液留在锯缝中并且通过锯线运输。
由于上述原因,在锯线离开处不会发生磨料耗尽。因此可以避免如现有技术中那样形成锯槽(锯痕)。
本发明的另一优点是,在上述方法的整个过程中,可以确保整个工件的均匀的热调节。因此容易避免负面温度影响。
与现有技术相比,还可以消除锯切悬浮液或浆料管路。
DE 19841492 A1公开了一种使用锯切悬浮液的线锯(不供应锯切悬浮液),该锯切悬浮液带有牢固结合的磨料,并且提供充填有冷却剂例如水的容器,在锯切过程中将棒浸入该容器中。如此期望实现对锯缝的最佳冷却。上述装置意图达到的目的与本发明的目的显著不同。
下面将借助于附图描述本发明。
图1示意性示出根据本发明的这种的优选实施例。
图1示出了缠绕有锯线的四个锯线进给辊。如此形成锯线群组。将工件固定在支承板上,并且从下方沿向前进给方向将工件进给通过锯线群组。图中还示出了充填有锯切悬浮液的贮液器。在贮液器的底部装配有喷嘴,通过喷嘴将锯切悬浮液供应到贮液器中。使工件逐渐地浸入锯切悬浮液中。这确保锯缝在整个过程中都充填有锯切悬浮液。

Claims (8)

1.一种锯切工件的方法,其中,将工件进给通过由锯线形成的锯线群组,其特征在于,工件的各锯缝在锯切过程中充填有锯切悬浮液。
2.根据权利要求1所述的方法,其特征在于,工件浸入充填有锯切悬浮液的贮液器中。
3.根据权利要求2所述的方法,其特征在于,锯切悬浮液含有磨料和载液。
4.根据权利要求1所述的方法,其特征在于,锯切悬浮液平行于锯线移动方向流出贮液器。
5.根据权利要求2所述的方法,其特征在于,贮液器被布置并充填为使得,至少是锯线的在锯切过程中接合的部分被相应地浸入贮液器的锯切悬浮液中,从而使得工件的锯缝充填有锯切悬浮液。
6.根据权利要求2所述的方法,其特征在于,经由装配在贮液器底部的一个或多个喷嘴供应锯切悬浮液。
7.根据权利要求2所述的方法,其特征在于,与锯线移动方向平行的贮液器端侧突伸超出贮液器侧表面的上边缘。
8.一种用于锯切工件的装置,其包括由锯线形成的锯线群组、保持待锯切工件并沿锯线群组的方向进给工件的向前进给装置、以及充填有锯切悬浮液的贮液器,该贮液器被布置并充填为使得,至少是锯线的在锯切过程中接合的部分被相应地浸入贮液器的锯切悬浮液中。
CNA200710192765XA 2006-12-20 2007-11-20 锯切工件的方法和装置 Pending CN101204836A (zh)

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CN102729347A (zh) * 2011-04-05 2012-10-17 硅电子股份公司 利用线锯切削工件的方法
CN104511975A (zh) * 2013-09-26 2015-04-15 硅电子股份公司 用于从工件同时切割多个晶圆的方法
CN108724495A (zh) * 2017-04-24 2018-11-02 上海新昇半导体科技有限公司 硅片切割装置

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CN102458768A (zh) * 2009-06-05 2012-05-16 应用材料公司 用于制造磨料线的设备和方法
CN102729347A (zh) * 2011-04-05 2012-10-17 硅电子股份公司 利用线锯切削工件的方法
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CN102729347B (zh) * 2011-04-05 2015-08-12 硅电子股份公司 利用线锯切削工件的方法
CN104511975A (zh) * 2013-09-26 2015-04-15 硅电子股份公司 用于从工件同时切割多个晶圆的方法
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CN108724495A (zh) * 2017-04-24 2018-11-02 上海新昇半导体科技有限公司 硅片切割装置
CN108724495B (zh) * 2017-04-24 2020-04-10 上海新昇半导体科技有限公司 硅片切割装置

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JP2008160124A (ja) 2008-07-10
DE102006060358A1 (de) 2008-06-26
US20080149085A1 (en) 2008-06-26
TW200827068A (en) 2008-07-01
KR100902626B1 (ko) 2009-06-15

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