CN101180167B - 用于将衬底从堆分离的设备 - Google Patents

用于将衬底从堆分离的设备 Download PDF

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CN101180167B
CN101180167B CN2006800175584A CN200680017558A CN101180167B CN 101180167 B CN101180167 B CN 101180167B CN 2006800175584 A CN2006800175584 A CN 2006800175584A CN 200680017558 A CN200680017558 A CN 200680017558A CN 101180167 B CN101180167 B CN 101180167B
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费利克斯·耶格
沃尔夫冈·施穆茨
迈克尔·基宁格
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G59/00—De-stacking of articles
    • B65G59/06—De-stacking from the bottom of the stack
    • B65G59/067—De-stacking from the bottom of the stack articles being separated substantially perpendicularly to the axis of the stack
    • B65G59/068—De-stacking from the bottom of the stack articles being separated substantially perpendicularly to the axis of the stack by means of endless elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/20—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
    • H01L31/206—Particular processes or apparatus for continuous treatment of the devices, e.g. roll-to roll processes, multi-chamber deposition
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    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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Abstract

本发明涉及一种将湿硅晶片(2)从晶片堆(1)分离的设备，其中所述湿晶片(2)可单个地从所述堆(1)中取出并且可被转移到随后的输送装置(7)上，能够可靠且快速地将保持在堆中的薄的易断裂的湿晶片彼此分离和分开，即使是大规格的晶片。为了实现上述目的，所述设备具有分离辊(4)，在所述分离辊上可放置有晶片堆(1)，通过转动所述分离辊(4)，最下面的晶片(2.1)在刮板(5)下方被移动穿过在辊平面(I)与刮板(5)之间的晶片厚度的缝隙，并且所述晶片(2.1)通过上下叠置的以相同转速驱动的牵引辊(6.1和6.2)的弹性压力从晶片堆(1)中被拉出。

Description

用于将衬底从堆分离的设备
技术领域
本发明涉及一种用于将衬底从堆分离的设备、尤其是用于将湿硅晶片从晶片堆分离的设备。
背景技术
由硅构成的用于制造光电单元的晶片，如在微电子设备中借助于线状锯从块中切割出来。这样的块事先与玻璃板粘合在一起，以便获得用于完全分离所需的保持力。因此，各个单元仅仅还粘附于粘合层，因为线状锯也嵌入玻璃底中。在持续的特殊介质冲洗的情况下进行锯切过程，该介质与锯切微粒混合。通过这种糊状的混合物使晶片簇状地彼此牢固粘合并且很难被分离以用于进一步处理。困难的是必须保持晶片始终湿润直到处理过程。到目前为止，以公知的方式用手将晶片簇状地从粘合层分离并且在拇指与中指之间通过取下最上面的晶片来分离。然而，光电单元的制造过程中同时出现的批量生产要求自动化的方法。另外，晶片规格越来越大。目前，晶片大小达到了156×156mm并且有趋势达到210×210mm。因此，最后由于人类工程学的原因将不再能用手分离晶片。
在前面所述类型的由DE 199 04 834 A1公开的设备中，晶片堆浸入液体保持在升降机构的支承臂上，其中各个的硅晶片水平设置地并粘合在支承体玻璃板上。借助于工具从玻璃板上脱离每个最上面的硅晶片并且借助于用作输送装置的液体流输送到盒子。每个单个的硅晶片与支承体玻璃板的所需要的分离需要时间并且带来损伤相关硅晶片边缘的危险。此外，脱离的硅晶片由液体流的捕获产生一些问题，因为各个硅晶片从其水平位置绕与支承体玻璃板的粘合连接倾斜，使得其外边缘侧会粘合在下一个下面的硅晶片上。硅晶片规格越大，该问题就越大。
发明内容
因此，本发明的任务是提供一种设备，该设备可靠且快速分离并且分开保持在堆中的薄的易断裂的湿晶片，甚至大规格的晶片。
为了完成该任务，在一种所述类型的用于将衬底从堆分离、尤其是将湿硅晶片从晶片堆分离的设备中设置有如下所说明的特征。
本发明提供一种将湿硅晶片从晶片堆分离的设备，其中所述湿晶片能单个地从所述堆中取出并且能被转移到随后的输送装置上，其中，所述设备具有分离辊，在所述分离辊上放置有晶片堆，通过转动所述分离辊，最下面的晶片在刮板下方被移动穿过在辊平面与刮板之间的晶片厚度的缝隙，并且所述晶片通过上下叠置的以相同转速驱动的牵引辊的弹性压力从晶片堆中被拉出，其特征在于，所述输送装置通过一个或者多个输送元件构成，并且在所述分离辊后面的所述输送元件具有比所述分离辊更高的输送速度，所述辊在优选为矩形的凸起片之间设置有优选为矩形的槽，所述辊的槽和凸起片相对于辊分别相互移动一节距，并且所述相邻辊的槽和凸起片彼此配合。
通过根据本发明的措施实现了，各个已从支承体玻璃板脱离的并且层状相叠在晶片堆上的湿硅晶片可以以更为简单且更为快速的方式分别从堆的下侧从堆中拉出。由此可避免对晶片边缘的损伤。这种硅晶片从晶片堆取出的方法与晶片规格无关。
利用上述的特征实现了，保证了更可靠的进一步输送并且形成对进一步处理所要求的被分离晶片之间的间距。
利用上述的特征实现了，在分离辊的槽区域中保持所需的液体膜并且可以流走多余的湿气。
利用上述的特征实现了，能保持辊间距更窄以便还能够支承薄的易断裂的晶片。
利用上述的特征实现了，通过尽管晶片堆减小仍保持对弹性分离辊的支承力恒定，也能保持刮板与柔性的辊平面之间的间隙恒定，即保持为晶片厚度。
附图说明
本发明的其他细节可从以下说明中得到，在以下说明中参照附图中示出的实施例更为详细地说明和阐述本发明。其中：
图1以示意性正视图示出了静止在分离辊上的晶片堆，该晶片堆被压头压紧，具有刮板、其中具有正好半个被牵引出的晶片的牵引辊对、和随后的输送元件，以及
图2以示意性俯视图示出了与晶片堆的位置彼此配合的分段的辊、在分离之前和之后可侧向调节的导向板，以及刮板和上牵引辊。
具体实施方式
在图1中可以看到由硅晶片2构成的晶片堆1，晶片堆通过如下的方式来形成，硅块通过线状锯被切割成多个硅晶片2，其中所述硅块通过粘合连接粘合在支承体玻璃板上，并且硅晶片2在线状锯切之后在连接层或粘合层上从支承体玻璃板的底部分离或脱离。由层状叠置的湿硅晶片2构成的晶片堆1放置在分离辊4上，分离辊在卸垛时不断地转动。晶片2通过洒水设备10始终保持湿润以使卸垛和随后的处理变得容易。具有可调节压紧力的压头(Stempel)3以与晶片堆高度无关的方式保持分离辊的支承力恒定，其中分离辊在外圆周侧是弹性的并且因此是柔性的。由此实现了，将分离辊平面I与刮板(Abstreifleiste)5之间的间隙恒定地保持为略微大于晶片厚度，使得只能够移动或者拉出一个薄的晶片2并且保留堆1的剩余晶片。
一旦由于摩擦配合分离辊4将最下面的晶片2.1移动出一块，成对上下叠置的牵引辊6.1和6.2就辅助分离过程。牵引辊6.1、6.2以相同的转速被驱动并且将弹性压力施加到相关的硅晶片2.1，其中在牵引辊6.1、6.2与硅晶片2.1之间同样形成摩擦配合连接。弹性压力例如通过上牵引辊6.1的弹性预张紧的安装来实现。因此，牵引辊6.1、6.2将晶片2.1转移给随后的输送元件7，该输送元件不仅能构造为辊轨道或者小轮轨道而且能构造为输送皮带或者输送带或者构造为其他合适的方式。
在图2中尤其示出了由彼此成列的优选矩形槽和凸起片(Steg)构成的分段的辊4、6.1和6.2的彼此配合以及必要时辊7与晶片堆1的位置的彼此配合。该设备通过导向板8.1、8.2和9.1、9.2来补充并且利用它们与晶片规格有关地从侧向定位晶片堆1并且引导被分离的硅晶片2。

Claims (3)

1.一种用于将湿硅晶片(2)从晶片堆(1)分离的设备，其中所述湿硅晶片(2)能单个地从所述晶片堆(1)中取出并且能被转移到随后的输送装置(7)上，其中，所述设备具有分离辊(4)，在所述分离辊上放置有所述晶片堆(1)，通过转动所述分离辊(4)，最下面的晶片(2.1)在刮板(5)下方被移动穿过在辊平面(I)与刮板(5)之间的晶片厚度的缝隙，并且所述晶片(2.1)通过上下叠置的以相同转速驱动的牵引辊(6.1，6.2)的弹性压力从晶片堆(1)中被拉出，其特征在于，所述输送装置通过一个或者多个输送元件(7)构成，并且在所述分离辊(4)后面的所述输送元件(7)具有比所述分离辊(4)更高的输送速度，所述分离辊(4)、所述牵引辊(6.1，6.2)和构成为所述输送元件(7)的辊在矩形的凸起片之间设置有矩形的槽，并且相邻的所述分离辊(4)的槽和凸起片彼此配合。
2.根据权利要求1所述的设备，其特征在于，所述晶片堆(1)通过压头(3)压靠于所述分离辊(4)。
3.根据权利要求2所述的设备，其特征在于，所述压头(3)的压紧力调节为使得所述晶片堆(1)的重量与压紧力之和随着所述晶片堆(1)的高度减小而保持恒定。
CN2006800175584A 2005-05-21 2006-05-18 用于将衬底从堆分离的设备 Expired - Fee Related CN101180167B (zh)

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DE102005023618A DE102005023618B3 (de) 2005-05-21 2005-05-21 Einrichtung zum Vereinzeln von Silizium-Wafern von einem Stapel
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PCT/EP2006/004699 WO2006125559A1 (de) 2005-05-21 2006-05-18 Einrichtung zum vereinzeln von substraten vom stapel

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CN110371673A (zh) * 2019-07-18 2019-10-25 天津鑫凯达精密机械有限公司 一种分离平稳高效的撤板机构
CN111232655B (zh) * 2020-03-02 2021-10-12 何海瑞 一种铝合金均质用具有整理机构的码垛装置的工作方法
CN111689240B (zh) * 2020-04-29 2021-11-16 鲁帅东 一种自动化佛香分离装置
CN111646168B (zh) * 2020-05-28 2021-10-22 豪德机械（上海）有限公司 一种翻板机

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EP1883515A1 (de) 2008-02-06
US20080135186A1 (en) 2008-06-12
EP1883515B1 (de) 2012-08-29
DE102005023618B3 (de) 2006-12-07
CN101180167A (zh) 2008-05-14
HK1115096A1 (en) 2008-11-21
US8047761B2 (en) 2011-11-01
WO2006125559A1 (de) 2006-11-30
NO20075792L (no) 2007-12-20
NO333989B1 (no) 2013-11-11

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