CN101180167A - 用于将衬底从堆分离的设备 - Google Patents

用于将衬底从堆分离的设备 Download PDF

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CN101180167A
CN101180167A CNA2006800175584A CN200680017558A CN101180167A CN 101180167 A CN101180167 A CN 101180167A CN A2006800175584 A CNA2006800175584 A CN A2006800175584A CN 200680017558 A CN200680017558 A CN 200680017558A CN 101180167 A CN101180167 A CN 101180167A
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费利克斯·耶格
沃尔夫冈·施穆茨
迈克尔·基宁格
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ACI ECOTEC GmbH and Co KG
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G59/00—De-stacking of articles
    • B65G59/06—De-stacking from the bottom of the stack
    • B65G59/067—De-stacking from the bottom of the stack articles being separated substantially perpendicularly to the axis of the stack
    • B65G59/068—De-stacking from the bottom of the stack articles being separated substantially perpendicularly to the axis of the stack by means of endless elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/20—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
    • H01L31/206—Particular processes or apparatus for continuous treatment of the devices, e.g. roll-to roll processes, multi-chamber deposition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means

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  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

本发明涉及一种将湿硅晶片(2)从晶片堆(1)分离的设备，其中所述湿晶片(2)可单个地从所述堆(1)中取出并且可被转移到随后的输送装置(7)上，能够可靠且快速地将保持在堆中的薄的易断裂的湿晶片彼此分离和分开，即使是大规格的晶片。为了实现上述目的，所述设备具有分离辊(4)，在所述分离辊上可放置有晶片堆(1)，通过转动所述分离辊(4)，最下面的晶片(2.1)在刮板(5)下方被移动穿过在辊平面(I)与刮板(5)之间的晶片厚度的缝隙，并且所述晶片(2.1)通过上下叠置的以相同转速驱动的牵引辊(6.1和6.2)的弹性压力从晶片堆(1)中被拉出。

Description

用于将衬底从堆分离的设备
技术领域
本发明涉及一种根据权利要求1的前序部分的用于将衬底从堆分离的设备、尤其是用于将湿硅晶片从晶片堆分离的设备。
背景技术
由硅构成的用于制造光电单元的晶片，如在微电子设备中借助于线状锯从块中切割出来。这样的块事先与玻璃板粘合在一起，以便获得用于完全分离所需的保持力。因此，各个单元仅仅还粘附于粘合层，因为线状锯也嵌入玻璃底中。在持续的特殊介质冲洗的情况下进行锯切过程，该介质与锯切微粒混合。通过这种糊状的混合物使晶片簇状地彼此牢固粘合并且很难被分离以用于进一步处理。困难的是必须保持晶片始终湿润直到处理过程。到目前为止，以公知的方式用手将晶片簇状地从粘合层分离并且在拇指与中指之间通过取下最上面的晶片来分离。然而，光电单元的制造过程中同时出现的批量生产要求自动化的方法。另外，晶片规格越来越大。目前，晶片大小达到了156×156mm并且有趋势达到210×210mm。因此，最后由于人类工程学的原因将不再能用手分离晶片。
在前面所述类型的由DE 199 04 834 A1公开的设备中，晶片堆浸入液体保持在升降机构的支承臂上，其中各个的硅晶片水平设置地并粘合在支承体玻璃板上。借助于工具从玻璃板上脱离每个最上面的硅晶片并且借助于用作输送装置的液体流输送到盒子。每个单个的硅晶片与支承体玻璃板的所需要的分离需要时间并且带来损伤相关硅晶片边缘的危险。此外，脱离的硅晶片由液体流的捕获产生一些问题，因为各个硅晶片从其水平位置绕与支承体玻璃板的粘合连接倾斜，使得其外边缘侧会粘合在下一个下面的硅晶片上。硅晶片规格越大，该问题就越大。
发明内容
因此，本发明的任务是提供一种设备，该设备可靠且快速分离并且分开保持在堆中的薄的易断裂的湿晶片，甚至大规格的晶片。
为了完成该任务，在一种所述类型的用于将衬底从堆分离、尤其是将湿硅晶片从晶片堆分离的设备中设置有权利要求1所说明的特征。
通过根据本发明的措施实现了，各个已从支承体玻璃板脱离的并且层状相叠在晶片堆上的湿硅晶片可以以更为简单且更为快速的方式分别从堆的下侧从堆中拉出。由此可避免对晶片边缘的损伤。这种硅晶片从晶片堆取出的方法与晶片规格无关。
利用权利要求2或3所述的特征实现了，保证了更可靠的进一步输送并且形成对进一步处理所要求的被分离晶片之间的间距。
利用权利要求4所述的特征实现了，在分离辊的槽区域中保持所需的液体膜并且可以流走多余的湿气。
利用权利要求5和/或6所述的特征实现了，能保持辊间距更窄以便还能够支承薄的易断裂的晶片。
利用权利要求7和/或8所述的特征实现了，通过尽管晶片堆减小仍保持对弹性分离辊的支承力恒定，也能保持刮板与柔性的辊平面之间的间隙恒定，即保持为晶片厚度。
附图说明
本发明的其他细节可从以下说明中得到，在以下说明中参照附图中示出的实施例更为详细地说明和阐述本发明。其中：
图1以示意性正视图示出了静止在分离辊上的晶片堆，该晶片堆被压头压紧，具有刮板、其中具有正好半个被牵引出的晶片的牵引辊对、和随后的输送元件，以及
图2以示意性俯视图示出了与晶片堆的位置彼此配合的分段的辊、在分离之前和之后可侧向调节的导向板，以及刮板和上牵引辊。
具体实施方式
在图1中可以看到由硅晶片2构成的晶片堆1，晶片堆通过如下的方式来形成，硅块通过线状锯被切割成多个硅晶片2，其中所述硅块通过粘合连接粘合在支承体玻璃板上，并且硅晶片2在线状锯切之后在连接层或粘合层上从支承体玻璃板的底部分离或脱离。由层状叠置的湿硅晶片2构成的晶片堆1放置在分离辊4上，分离辊在卸垛时不断地转动。晶片2通过洒水设备10始终保持湿润以使卸垛和随后的处理变得容易。具有可调节压紧力的压头(Stempel)3以与晶片堆高度无关的方式保持分离辊的支承力恒定，其中分离辊在外圆周侧是弹性的并且因此是柔性的。由此实现了，将分离辊平面I与刮板(Abstreifleiste)5之间的间隙恒定地保持为略微大于晶片厚度，使得只能够移动或者拉出一个薄的晶片2并且保留堆1的剩余晶片。
一旦由于摩擦配合分离辊4将最下面的晶片2.1移动出一块，成对上下叠置的牵引辊6.1和6.2就辅助分离过程。牵引辊6.1、6.2以相同的转速被驱动并且将弹性压力施加到相关的硅晶片2.1，其中在牵引辊6.1、6.2与硅晶片2.1之间同样形成摩擦配合连接。弹性压力例如通过上牵引辊6.1的弹性预张紧的安装来实现。因此，牵引辊6.1、6.2将晶片2.1转移给随后的输送元件7，该输送元件不仅能构造为辊轨道或者小轮轨道而且能构造为输送皮带或者输送带或者构造为其他合适的方式。
在图2中尤其示出了由彼此成列的优选矩形槽和凸起片(Steg)构成的分段的辊4、6.1和6.2的彼此配合以及必要时辊7与晶片堆1的位置的彼此配合。该设备通过导向板8.1、8.2和9.1、9.2来补充并且利用它们与晶片规格有关地从侧向定位晶片堆1并且引导被分离的硅晶片2。

Claims (8)

1.一种用于将衬底从堆分离的设备，尤其是一种将湿硅晶片(2)从晶片堆(1)分离的设备，其中所述湿晶片(2)能单个地从所述堆(1)中取出并且能被转移到随后的输送装置(7)上，其特征在于，所述设备具有分离辊(4)，在所述分离辊上放置有晶片堆(1)，通过转动所述分离辊(4)，最下面的晶片(2.1)在刮板(5)下方被移动穿过在辊平面(I)与刮板(5)之间的晶片厚度的缝隙，并且所述晶片(2.1)通过上下叠置的以相同转速驱动的牵引辊(6.1和6.2)的弹性压力从晶片堆(1)中被拉出。
2.根据权利要求1所述的设备，其特征在于，所述输送装置通过一个或者多个输送元件(7)构成。
3.根据权利要求1或者2所述的设备，其特征在于，在所述分离辊(4)后面的所述输送元件(7)具有比所述分离辊(4)更高的输送速度。
4.根据上述权利要求中至少一项所述的设备，其特征在于，所述辊(4；6.1，6.2；7)在优选为矩形的凸起片之间设置有优选为矩形的槽。
5.根据权利要求4所述的设备，其特征在于，所述辊(4；6.1，6.2；7)的槽和凸起片相对于辊(4；6.1；6.2；7)分别相互移动一节距。
6.根据权利要求4或者5所述的设备，其特征在于，所述相邻辊(4；6.1；6.2；7)的槽和凸起片彼此配合。
7.根据上述权利要求中至少一项所述的设备，其特征在于，所述晶片堆(1)通过压头(3)压靠于所述分离辊(4)。
8.根据权利要求7所述的设备，其特征在于，所述压头(3)的压紧力调节为使得所述堆(1)的重量与压紧力之和随着所述堆(1)的高度减小而保持恒定。
CN2006800175584A 2005-05-21 2006-05-18 用于将衬底从堆分离的设备 Expired - Fee Related CN101180167B (zh)

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102844253A (zh) * 2010-04-22 2012-12-26 西门子工业公司 用于板载容器的自动卸载机和自动卸载方法
CN103112611A (zh) * 2013-02-25 2013-05-22 广州达意隆包装机械股份有限公司 托盘码垛包装装置及包装方法
CN104894832A (zh) * 2014-03-07 2015-09-09 黄运新 布料裁片自动打号机
CN106429475A (zh) * 2016-11-30 2017-02-22 合肥亿福自动化科技有限公司 一种用于空调生产的自动化输送系统
CN109018953A (zh) * 2018-08-20 2018-12-18 王国永 一种翻转上料机
CN111232655A (zh) * 2020-03-02 2020-06-05 何海瑞 一种铝合金均质用具有整理机构的堆码装置的工作方法
CN111646168A (zh) * 2020-05-28 2020-09-11 豪德机械（上海）有限公司 一种翻板机
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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008096426A1 (ja) * 2007-02-08 2008-08-14 Glory Ltd. 紙幣繰出装置
GB2465591B (en) * 2008-11-21 2011-12-07 Coreflow Ltd Method and device for separating sliced wafers
CN102556681B (zh) * 2012-01-19 2014-03-26 镇江中福马机械有限公司 人造板毛板的卸板系统及卸板方法
DE202012003912U1 (de) 2012-04-19 2012-06-14 Schott Solar Ag Vorrichtung zum Befördern und Vereinzeln von Substraten, insbesondere Siliziumwafern
DE102012221452A1 (de) 2012-07-20 2014-01-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung zum Separieren von Wafern
CN110371673B (zh) * 2019-07-18 2024-07-05 天津鑫凯达精密机械有限公司 一种分离平稳高效的撤板机构

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1976788A (en) * 1933-03-21 1934-10-16 Kurth Herman Machine for delivering sheets from a stack
US3625384A (en) * 1968-09-26 1971-12-07 Ibm Article-handling apparatus
US3707752A (en) * 1970-10-28 1973-01-02 Beloit Corp Roll covering
US3988017A (en) * 1975-03-20 1976-10-26 Lockheed Electronics Co., Inc. Workpiece feeding device
US4524558A (en) * 1983-08-05 1985-06-25 Bernard Miles Sheet holder for food dispenser
KR890000910B1 (ko) * 1984-06-29 1989-04-13 가부시기가이샤 히다찌세이사꾸쇼 지엽류의 분리 반송장치
US4961566A (en) * 1986-11-14 1990-10-09 International Paper Box Machine Co., Inc. Apparatus for feeding sheets from a stack of sheets
GB8901055D0 (en) * 1989-01-18 1989-03-15 Simon Container Mach Ltd Apparatus for feeding boards or sheets from a stack
US5050852A (en) * 1989-08-23 1991-09-24 Rengo Co. Ltd. Blank feeder and method for controlling the same
US5172898A (en) * 1990-07-05 1992-12-22 Mitsubishi Jukogyo Kabushiki Kaisha Paperboard feeding apparatus
JPH04354746A (ja) * 1991-05-29 1992-12-09 Omron Corp 紙葉類の繰出し隙間調整装置
US5297785A (en) * 1992-08-28 1994-03-29 Bell & Howell Phillipsburg Company Pre-feed shingling device for flat-article feeder
GB9303093D0 (en) * 1993-02-16 1993-03-31 Rue Inter Innovation De Ab Sheet stacking and processing apparatus
FR2701938B1 (fr) * 1993-02-23 1995-05-24 Cuir Jean Pierre Dispositif de distribution de feuilles semi-rigides, notamment de carton, à partir d'un empilement.
US5950643A (en) * 1995-09-06 1999-09-14 Miyazaki; Takeshiro Wafer processing system
CH691169A5 (fr) * 1996-04-16 2001-05-15 Hct Shaping Systems Sa Dispositif pour la mise en élément de stockage de tranches obtenues par découpage d'un bloc.
DE19900671C2 (de) * 1999-01-11 2002-04-25 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Vereinzeln von scheibenförmigen Substraten, insbesondere zur Waferherstellung
DE19904834A1 (de) * 1999-02-07 2000-08-10 Acr Automation In Cleanroom Vorrichtung zum Ablösen, Vereinzeln und Einlagern von dünnen, bruchempfindlichen scheibenförmigen Substraten
WO2000058190A1 (en) * 1999-03-31 2000-10-05 John Anthony Sullivan Apparatus for feeding sheet material
DE19950068B4 (de) * 1999-10-16 2006-03-02 Schmid Technology Systems Gmbh Verfahren und Vorrichtung zum Vereinzeln und Ablösen von Substratscheiben
SE0002818L (sv) * 2000-08-03 2001-08-20 Emba Machinery Ab Förfarande och anordning för att mata ett ark i sänder från en arkstapel
US7036815B2 (en) * 2002-07-17 2006-05-02 Canon Kabushiki Kaisha Sheet material conveying apparatus, recording apparatus and recording system

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CN102844253A (zh) * 2010-04-22 2012-12-26 西门子工业公司 用于板载容器的自动卸载机和自动卸载方法
CN102844253B (zh) * 2010-04-22 2016-01-06 西门子工业公司 自动卸载装置、包括其的自动卸载系统和从容器卸载物品的方法
CN103112611A (zh) * 2013-02-25 2013-05-22 广州达意隆包装机械股份有限公司 托盘码垛包装装置及包装方法
CN103112611B (zh) * 2013-02-25 2015-12-23 广州达意隆包装机械股份有限公司 托盘码垛包装装置及包装方法
CN104894832A (zh) * 2014-03-07 2015-09-09 黄运新 布料裁片自动打号机
CN106429475A (zh) * 2016-11-30 2017-02-22 合肥亿福自动化科技有限公司 一种用于空调生产的自动化输送系统
CN109018953A (zh) * 2018-08-20 2018-12-18 王国永 一种翻转上料机
CN111232655A (zh) * 2020-03-02 2020-06-05 何海瑞 一种铝合金均质用具有整理机构的堆码装置的工作方法
CN111232655B (zh) * 2020-03-02 2021-10-12 何海瑞 一种铝合金均质用具有整理机构的码垛装置的工作方法
CN111689240A (zh) * 2020-04-29 2020-09-22 鲁帅东 一种自动化佛香分离装置
CN111646168A (zh) * 2020-05-28 2020-09-11 豪德机械（上海）有限公司 一种翻板机
CN111646168B (zh) * 2020-05-28 2021-10-22 豪德机械（上海）有限公司 一种翻板机

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US8047761B2 (en) 2011-11-01
US20080135186A1 (en) 2008-06-12
HK1115096A1 (en) 2008-11-21
NO20075792L (no) 2007-12-20
EP1883515A1 (de) 2008-02-06
CN101180167B (zh) 2012-11-07
DE102005023618B3 (de) 2006-12-07
EP1883515B1 (de) 2012-08-29
WO2006125559A1 (de) 2006-11-30

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