CN101175597A - 基本上不去除材料的标度制造的方法和设备 - Google Patents

基本上不去除材料的标度制造的方法和设备 Download PDF

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CN101175597A
CN101175597A CNA2006800165309A CN200680016530A CN101175597A CN 101175597 A CN101175597 A CN 101175597A CN A2006800165309 A CNA2006800165309 A CN A2006800165309A CN 200680016530 A CN200680016530 A CN 200680016530A CN 101175597 A CN101175597 A CN 101175597A
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亚历山大·戴维·斯科特·埃琳
詹姆斯·雷诺兹·亨肖
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Abstract

一种制造标度读取设备的度量标度的方法,该方法包括将激光束引导至标度基底(12)上。激光参数为使得使激光束入射在其上的标度基底(12)的局部区域转移,从而形成标度标记(16,20,22)。

Description

基本上不去除材料的标度制造的方法和设备
技术领域
本发明涉及用于制造标度读取设备的度量标度的方法和设备。尤其,本发明涉及利用激光制造度量标度的方法和设备。
背景技术
用于测量两个构件的相对位移的标度读取设备的已知形式包括在具有限定图案的标度标记的一个构件上的标度和设置在另一个构件上的读取头。光学标度读取设备具有照亮标度的装置和响应于所得的光图案对标度和读取头的相对位移进行测量的读取头中的检测装置。具有采用周期图案的标记的标度已知为增量标度,并且提供来回计数的输出。标度可具有参考标记,当读取头检测到参考标记时确定读取头的精确位置。标度可具有绝对码标记,该绝对码标记能够在标度上的任何位置确定读取头的绝对位置。
标度和读取头系统不局限于光学系统。还已知磁性、电容和电感的读取系统。
度量标度例如可以是线性的、旋转的或者两维的。旋转标度可具有径向地设置在表面上或者轴向地设置在旋转部分的圆周上的标度标记。
标度可以是幅度标度或相位标度。在幅度标度中,标度图案由两种不同类型的部分组成。第一种类型的部分将入射光反射至读取头,第二种类型的部分不将入射光反射至读取头。例如,增量幅度标度可包括交替的反射刻线和非反射刻线,诸如玻璃标度上的铬。
相位标度具有的形式为,当在读取头检测光线时以不同的相位从不同部分反射光线。
国际专利申请No.WO03/041905公开了一种制造度量标度的方法,其中,使用激光以通过激光烧蚀在标度上制造标度标记。因此,通过沸腾、蒸发或排出固体颗粒去除在标度标记的位置处的材料。该方法在标度基底上形成非反射性的标度标记。这适合于幅度标度,但不适合于相位标度。
发明内容
本发明提供一种制造标度读取设备的度量标度的方法,该方法包括如下步骤:
提供标度基底;
将激光束引导至标度基底上;
其中,激光参数为使得使激光束入射在其上的标度基底的局部区域转移,从而形成标度标记。
基底材料的转移包括使基底软化然后利用激光能量转移它的初始步骤。
优选地,在基本上不去除材料的情况下使标度基底的局部区域转移。
优选地,该激光束是脉冲的。
激光参数可包括波长和脉冲宽度之一或两个都包括。最优波长取决于标度基底的反射率,而脉冲宽度影响施加于标度基底的峰值激光功率。
标度基底可以是金属材料,诸如纯金属或合金。该标度基底可包括均质的金属材料,或者可包括在诸如玻璃的另一种材料上的金属覆层。
标度基底可以是非金属材料,例如玻璃或诸如热塑性材料的聚合物。该标度基底可包括均质的非金属材料或者在另一种材料上的非金属覆层。
该标度可包括相位标度,其中所述标度包括具有不同参数的不同部分。
激光在标度基底上的作用基本上不改变基底的光学性质;标度上的每个点仍然是反射性的。与之不同,通过标度基底上的不同高度的部分提供标度标记。
该方法可包括将反射覆层施加于标度的额外步骤。
该方法可包括一旦标度标记被制成后清洁该标度的额外步骤。
附图说明
现在将参考附图以示例的方式描述本发明的优选实施例,其中:
图1表示标度基底上的激光束入射;
图2表示标度基底上的单个标度标记;
图3表示标度基底上的多个标度标记;
图4表示足够紧密地放置在一起以形成正弦轮廓的标度基底上的多个标度标记;
图5是标度标记的深度相对激光脉冲数目的图表;和
图6表示形成在玻璃基底上的金属覆层上的标度标记。
具体实施方式
现在将参考图1和2描述本发明的第一实施例。来自诸如Nd:YAG激光器的激光器11的束10聚焦在诸如不锈钢或不胀钢的金属基底12上。金属基底可包括纯金属或合金。在选择材料中的主要因素是该材料优选是反射性的而且合适作为标度基底。选择激光器的参数以便在激光器焦点处的金属材料基本上被熔化和转移。这形成如图2所示的轮廓14。
如图2所示,激光束使金属材料被从激光器焦点移走,从而形成沟槽16和周围的峰脊18。
使用激光束以形成如图3所示的邻近标记16,20,22。具有这种轮廓的标度将展现很强的次谐波。然而,如果将刻线足够紧密地放置在一起使邻近的峰脊合并,如图4所示,可以使这些次谐波最小化。
通过激光器转移材料可使特征叠加以形成具有适当的标度特性的形状。例如,选择从沟槽至峰脊的顶点的标度标记的总高度h,以便它适合于用于读取头的光源的波长。
图5表示沟槽深度和激光器的连续脉冲数目之间的关系。随着连续脉冲的数目增加,沟槽深度将增加至线24的水平部分所示的限制。在达到该限制之后,连续脉冲的数目的增加不会导致沟槽深度的任何增加。对于上述情况的可能的原因是随着连续脉冲的数目增加超过某个限制,在沟槽中形成材料的熔池,当转移它时其流回至沟槽内。
通过利用在其间具有中止的脉冲群以便沟槽中的熔融材料可以在脉冲群之间凝固,可以增加沟槽深度超过该限制。图5中的虚线26表示当在脉冲群之间存在中止时在深度和脉冲数目之间的关系。该方法将更好地控制标度标记的形成。
形成标度标记的这种方法适合于连续处理。随着标度基底和激光器彼此相对运动,使用第一脉冲或脉冲组形成浅的标度标记,从而形成一系列的标度标记。然后,重复该处理,利用随后的脉冲加深该标度标记直到实现预定深度。因此,例如,第一激光脉冲可施加于在标度的部分上的每个刻线,然后第二激光脉冲施加于这些刻线中的每个刻线等。
在标度制造处理期间,当标度基底材料在激光脉冲的作用下熔化时,可能发生少许飞溅,从而在表面上留下珠滴。通过清洁该标度以及因此清除这些外部材料珠滴,可改善标度的表面抛光。超声波清洗是用于清除这种外部材料的合适方法。
虽然上述说明描述了在金属基底上形成标度标记,但是这种方法还适合于在其它基底上形成标度标记。
图6表示包括具有铬覆层30的玻璃板28的标度基底。标度标记32可如前所述地形成在铬覆层30上。重要的是,铬层30的深度d2基本上厚于激光穿透深度d1,以便激光不破坏金属/玻璃结合,存在铬层脱离玻璃的危险。例如,铬深度d2可为大约6-10μm,而标度标记的深度d1在大约0.2μm的范围内。
可使用其它的金属材料代替铬。玻璃基底也可由另一种材料代替。
非金属材料可用作标度基底,例如玻璃或聚合物。例如,合适的标度材料是在基底上的聚合物覆层。与金属在玻璃上的实施例一样,标度轮廓形成在例如热塑塑料的聚合体中。由于聚合物不是反射性的,则需要另外的步骤为聚合物覆上反射性材料(例如金属材料)。其它的非反射性标度基底也需要这个步骤。利用聚合体而不是金属的优点是可使用低功率激光器形成标度标记。
选择激光能量以匹配聚合物并在表面上形成所需的熔融和流动。
另一种合适的标度材料是厚的非金属基底,例如,该非金属基底可包括前述的聚合物。
必须选择激光器以匹配标度基底。激光功率必须足以熔化标度基底的局部区域但是不能太大而使得材料产生沸腾或升华。
所需的激光波长取决于标度基底的材料的反射率。此外,由于波长影响激光器的聚集,故选择波长以便该波长足够短以在标度基底上形成小的特征。
激光可例如利用透镜聚焦在标度基底上。可选择透镜以便激光聚焦成直线,从而产生标度刻线。例如,可使用圆柱形透镜。
替代地,可使用掩模投影形成标度特征。可使用诸如准分子激光器的激光器,该激光器产生平面均匀光束并具有足以形成小的特征的处于深UV的短波长。
上述示例描述了转移材料的机理,包括熔化该材料的初始步骤。替代地,基底可被软化,然后通过激光能量转移。该机理可包括加热和由热冲击或气体膨胀冲击产生的塑性流动。
虽然上述实施例描述了线性标度,但是这种标度制造的方法也适合于旋转标度和二维标度。
在标度中可提供诸如参考标记的特征,这些特征可以是相位标度参考标记,或者替代地,是非反射性标度的区域。

Claims (25)

1.一种制造标度读取设备的度量标度的方法,所述方法包括如下步骤:
提供标度基底;
将激光束引导至所述标度基底上;
其中,激光参数为使得使所述激光束入射在其上的所述标度基底的局部区域转移,从而形成标度标记。
2.如权利要求1所述的方法,其中,所述激光束是脉冲的。
3.如前述权利要求的任意项所述的方法,其中,在基本上不去除材料的情况下使所述标度基底的所述局部区域转移。
4.如前述权利要求的任一项所述的方法,其中,所述激光参数为使得使所述激光束引导在其上的所述标度基底的所述局部区域熔化。
5.如前述权利要求的任一项所述的方法,其中,基底材料的所述转移包括使所述基底软化然后利用激光能量转移它的初始步骤。
6.如前述权利要求的任一项所述的方法,其中,通过转移所述标度基底形成的所述标度标记包括交替的沟槽和峰脊。
7.如权利要求6所述的方法,其中,通过利用多个激光脉冲增加所述沟槽的深度,控制所述脉冲之间的间隔以影响所述标度标记的深度。
8.如权利要求6或7所述的方法,其中,所述标度标记足够靠近以使邻近的峰脊合并。
9.如前述权利要求的任一项所述的方法,其中,所述激光参数包括波长或脉冲宽度中的至少一个。
10.如前述权利要求的任一项所述的方法,其中,所述激光功率足以熔化所述标度基底的局部区域但是不能太大而使得所述材料产生沸腾或升华。
11.如前述权利要求的任一项所述的方法,其中,所述激光束聚焦在所述标度基底上。
12.如权利要求11所述的方法,其中,所述激光束利用透镜聚焦在所述标度基底上。
13.如权利要求12所述的方法,其中,所述透镜为使得来自所述激光器的光聚焦成直线。
14.如权利要求1-10的任一项所述的方法,其中,使用掩模投影以形成所述标度特征。
15.如权利要求14所述的方法,其中,所述激光器是准分子激光器。
16.如前述权利要求的任一项所述的方法,其中,所述标度基底是金属材料。
17.如权利要求16所述的标度基底,其中,所述标度基底包括均质的金属材料。
18.如权利要求16所述的标度基底,其中,所述标度基底是在非金属材料上的金属覆层。
19.如权利要求1-15所述的方法,其中,所述标度基底是非金属材料。
20.如权利要求19所述的标度基底,其中,所述标度基底包括均质的非金属材料。
21.如权利要求19所述的标度基底,其中,所述标度基底包括在另一种材料上的非金属覆层。
22.如权利要求19-21的任一项所述的标度基底,其中,所述标度基底包括聚合物或玻璃。
23.如前述权利要求的任一项所述的方法,其中,所述标度包括相位标度,其中所述标度具有不同的部分,所述不同的部分具有不同的参数。
24.如前述权利要求的任一项所述的方法,其中,所述方法包括将反射覆层施加于所述标度的额外步骤。
25.如前述权利要求的任一项所述的方法,其中,所述方法包括一旦所述标度标记被制成后清洁所述标度的额外步骤。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107112203A (zh) * 2015-02-23 2017-08-29 日本电气硝子株式会社 玻璃基板及使用其的层叠体

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7903336B2 (en) * 2005-10-11 2011-03-08 Gsi Group Corporation Optical metrological scale and laser-based manufacturing method therefor
GB2452730A (en) 2007-09-12 2009-03-18 Bamford Excavators Ltd Method of providing a machine readable marking
GB0906257D0 (en) 2009-04-08 2009-05-20 Renishaw Plc Position encoder apparatus
GB0906258D0 (en) 2009-04-08 2009-05-20 Renishaw Plc Position encoder apparatus
JP2011117766A (ja) * 2009-12-01 2011-06-16 Canon Inc 干渉計測方法
DE102010026773A1 (de) 2010-07-10 2012-01-12 Gm Global Technology Operations Llc (N.D.Ges.D. Staates Delaware) Skalenelement für ein Anzeigeinstrument, Kombiinstrument und Fahrzeug mit einem Skalenelement
GB201016046D0 (en) 2010-09-24 2010-11-10 Renishaw Plc A method of forming an optical device
KR101327889B1 (ko) * 2011-12-01 2013-11-11 서울대학교산학협력단 금속성 미세구조물 및 그의 가공 방법
JP6425875B2 (ja) * 2013-06-14 2018-11-21 株式会社ミツトヨ 光電式測定器用スケール、エンコーダ及びスケールの形成方法
US20220388093A1 (en) * 2021-06-07 2022-12-08 Assa Abloy Ab Warm-up target for a laser engraver

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4270130A (en) * 1979-01-08 1981-05-26 Eastman Kodak Company Thermal deformation record device with bleachable dye
DE3048733C2 (de) * 1980-12-23 1983-06-16 GAO Gesellschaft für Automation und Organisation mbH, 8000 München "Ausweiskarte und Verfahren zur Herstellung derselben"
DE3416864C2 (de) * 1984-05-08 1986-04-10 Dr. Johannes Heidenhain Gmbh, 8225 Traunreut Photoelektrische Meßeinrichtung
GB8616240D0 (en) 1986-07-03 1986-08-13 Renishaw Plc Opto-electronic scale reading apparatus
US4771010A (en) * 1986-11-21 1988-09-13 Xerox Corporation Energy beam induced layer disordering (EBILD)
WO1988006713A1 (en) * 1987-03-06 1988-09-07 Renishaw Plc Position determination apparatus
US5143894A (en) * 1987-10-14 1992-09-01 Mordechai Rothschild Formation and high resolution patterning of superconductors
US4972061A (en) * 1987-12-17 1990-11-20 Duley Walter W Laser surface treatment
US5101260A (en) * 1989-05-01 1992-03-31 Energy Conversion Devices, Inc. Multilayer light scattering photovoltaic back reflector and method of making same
JPH0433784A (ja) 1990-05-26 1992-02-05 Hasegawa Seisakusho:Kk 金属尺の目盛付加法
JP2901744B2 (ja) * 1990-11-09 1999-06-07 株式会社リコー レーザトリマーにおけるダスト除去方法
EP0500110B1 (en) * 1991-02-21 1996-05-22 Hewlett-Packard Company Process of photo-ablating at least one stepped opening extending through a polymer material, and a nozzle plate having stepped openings
JPH05169286A (ja) * 1991-12-25 1993-07-09 Fuji Electric Co Ltd レーザ目盛付け装置
AT404637B (de) * 1993-01-21 1999-01-25 Rsf Elektronik Gmbh Photoelektrische positionsmesseinrichtung
DE4303975A1 (de) * 1993-02-11 1994-08-18 Heidenhain Gmbh Dr Johannes Teilungsträger
JPH0825043B2 (ja) 1993-03-24 1996-03-13 シンワ測定株式会社 定規板の目盛形成方法
GB9310820D0 (en) * 1993-05-26 1993-07-14 Welding Inst Surface modification
US5473138A (en) * 1993-07-13 1995-12-05 Singh; Rajiv K. Method for increasing the surface area of ceramics, metals and composites
US5712191A (en) * 1994-09-16 1998-01-27 Semiconductor Energy Laboratory Co., Ltd. Method for producing semiconductor device
DE19608937C2 (de) 1995-03-10 1998-01-15 Heidenhain Gmbh Dr Johannes Verfahren zum Herstellen eines Markierungsträgers
US6229140B1 (en) * 1995-10-27 2001-05-08 Canon Kabushiki Kaisha Displacement information detection apparatus
US6220058B1 (en) * 1996-03-25 2001-04-24 Nippon Sheet Glass Co., Ltd Method of changing the surface of a glass substrate containing silver, by using a laser beam
DE19611983C1 (de) * 1996-03-26 1997-07-31 Zeiss Carl Jena Gmbh Bandförmiges, elastisch biegbares Maßband für Längen- oder Winkelmeßeinrichtungen
US5948288A (en) * 1996-05-28 1999-09-07 Komag, Incorporated Laser disk texturing apparatus
JP2960013B2 (ja) 1996-07-29 1999-10-06 慧 清野 移動物体の検出用目盛及びこれを用いた移動物体の検出装置
US5907144A (en) * 1997-02-05 1999-05-25 International Business Machines Corporation Microscopic bar code for component identification and method for making same
KR100537771B1 (ko) * 1997-03-21 2005-12-19 가부시키가이샤 야스카와덴키 마킹방법 및 마킹재
EP0984844B1 (en) * 1997-05-27 2002-11-13 SDL, Inc. Laser marking system and method of energy control
JP3202941B2 (ja) 1997-06-13 2001-08-27 株式会社ミツトヨ マイクロメータ
JPH1195196A (ja) * 1997-09-17 1999-04-09 Fujitsu Ltd 液晶パネル表示装置
US6392683B1 (en) * 1997-09-26 2002-05-21 Sumitomo Heavy Industries, Ltd. Method for making marks in a transparent material by using a laser
US6105501A (en) * 1998-06-10 2000-08-22 Flex Products, Inc. High resolution lithographic printing plate suitable for imaging with laser-discharge article and method
US6518540B1 (en) * 1998-06-16 2003-02-11 Data Storage Institute Method and apparatus for providing ablation-free laser marking on hard disk media
US6285002B1 (en) * 1999-05-10 2001-09-04 Bryan Kok Ann Ngoi Three dimensional micro machining with a modulated ultra-short laser pulse
JP2002090114A (ja) * 2000-07-10 2002-03-27 Mitsutoyo Corp 光スポット位置センサ及び変位測定装置
DE10058239B4 (de) * 2000-11-17 2012-01-26 Dr. Johannes Heidenhain Gmbh Positionsmeßeinrichtung
US6794638B2 (en) * 2001-09-13 2004-09-21 Mitutoyo Corporation Photoelectric encoder having improved light-emitting and photoreceptive sections
GB0127410D0 (en) 2001-11-15 2002-01-09 Renishaw Plc Laser substrate treatment
JP2003172639A (ja) 2001-12-05 2003-06-20 Mitsutoyo Corp 正弦波形状光学格子の製造方法
US7214573B2 (en) * 2001-12-11 2007-05-08 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device that includes patterning sub-islands
GB0201101D0 (en) * 2002-01-18 2002-03-06 Renishaw Plc Laser marking
CN1381332A (zh) * 2002-05-28 2002-11-27 张伟华 机床刻度盘光刻方法
SG108299A1 (en) * 2002-06-11 2005-01-28 Inst Data Storage Method and apparatus for forming periodic structures
US6906315B2 (en) * 2002-07-16 2005-06-14 Mitutoyo Corporation High accuracy miniature grating encoder readhead using fiber optic receiver channels
JP2004055771A (ja) * 2002-07-18 2004-02-19 Nec Lcd Technologies Ltd 半導体薄膜の製造方法及びレーザ照射装置
US6893986B2 (en) * 2002-07-22 2005-05-17 Wright State University Method of reducing internal stress in materials
US20050211680A1 (en) * 2003-05-23 2005-09-29 Mingwei Li Systems and methods for laser texturing of surfaces of a substrate
US7085057B2 (en) * 2003-10-15 2006-08-01 Invenios Direct-write system and method for roll-to-roll manufacturing of reflective gratings
US20060000814A1 (en) * 2004-06-30 2006-01-05 Bo Gu Laser-based method and system for processing targeted surface material and article produced thereby
US7903336B2 (en) * 2005-10-11 2011-03-08 Gsi Group Corporation Optical metrological scale and laser-based manufacturing method therefor
US7502122B2 (en) 2006-07-31 2009-03-10 Mitutoyo Corporation Fiber-optic miniature encoder for fine pitch scales
GB0807242D0 (en) 2008-04-21 2008-05-28 Renishaw Plc Metrological scale

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107112203A (zh) * 2015-02-23 2017-08-29 日本电气硝子株式会社 玻璃基板及使用其的层叠体
CN107112203B (zh) * 2015-02-23 2021-08-24 日本电气硝子株式会社 玻璃基板及使用其的层叠体

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