CN101166840B - 铜合金 - Google Patents
铜合金 Download PDFInfo
- Publication number
- CN101166840B CN101166840B CN200680006379.0A CN200680006379A CN101166840B CN 101166840 B CN101166840 B CN 101166840B CN 200680006379 A CN200680006379 A CN 200680006379A CN 101166840 B CN101166840 B CN 101166840B
- Authority
- CN
- China
- Prior art keywords
- precipitate
- copper alloy
- quality
- described copper
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP055147/2005 | 2005-02-28 | ||
JP2005055147 | 2005-02-28 | ||
JP055144/2005 | 2005-02-28 | ||
JP2005055144 | 2005-02-28 | ||
PCT/JP2006/303738 WO2006093140A1 (ja) | 2005-02-28 | 2006-02-28 | 銅合金 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101166840A CN101166840A (zh) | 2008-04-23 |
CN101166840B true CN101166840B (zh) | 2012-07-18 |
Family
ID=36941169
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200680006379.0A Expired - Fee Related CN101166840B (zh) | 2005-02-28 | 2006-02-28 | 铜合金 |
Country Status (4)
Country | Link |
---|---|
US (2) | US20080047634A1 (de) |
EP (1) | EP1873266B1 (de) |
CN (1) | CN101166840B (de) |
WO (1) | WO2006093140A1 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4357536B2 (ja) * | 2007-02-16 | 2009-11-04 | 株式会社神戸製鋼所 | 強度と成形性に優れる電気電子部品用銅合金板 |
JP4418028B2 (ja) * | 2007-03-30 | 2010-02-17 | 日鉱金属株式会社 | 電子材料用Cu−Ni−Si系合金 |
US8287669B2 (en) | 2007-05-31 | 2012-10-16 | The Furukawa Electric Co., Ltd. | Copper alloy for electric and electronic equipments |
JP4785092B2 (ja) * | 2007-11-05 | 2011-10-05 | 古河電気工業株式会社 | 銅合金板材 |
CN101946014A (zh) * | 2008-02-18 | 2011-01-12 | 古河电气工业株式会社 | 铜合金材料 |
EP2330231B1 (de) * | 2008-09-30 | 2017-02-22 | JX Nippon Mining & Metals Corporation | Verfahren zur herstellung einer zerstäubungsquelle für hochreines kupfer oder für eine hochreine kupferlegierung |
WO2010038641A1 (ja) | 2008-09-30 | 2010-04-08 | 日鉱金属株式会社 | 高純度銅及び電解による高純度銅の製造方法 |
JP5261161B2 (ja) * | 2008-12-12 | 2013-08-14 | Jx日鉱日石金属株式会社 | Ni−Si−Co系銅合金及びその製造方法 |
JP4672804B1 (ja) | 2010-05-31 | 2011-04-20 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Co−Si系銅合金及びその製造方法 |
JP4834781B1 (ja) | 2010-08-24 | 2011-12-14 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Co−Si系合金 |
US9476474B2 (en) * | 2010-12-13 | 2016-10-25 | Nippon Seisen Co., Ltd. | Copper alloy wire and copper alloy spring |
EP2653574B1 (de) * | 2010-12-13 | 2017-05-31 | Nippon Seisen Co., Ltd. | Kupferlegierung und herstellungsverfahren für die kupferlegierung |
CN102140594B (zh) * | 2011-03-11 | 2012-10-03 | 无锡日月合金材料有限公司 | 一种高强高导高韧铜合金及其制备方法 |
CN102560192B (zh) * | 2011-12-31 | 2016-11-23 | 无锡日月合金材料有限公司 | 一种高强高塑性铜合金及其制备方法 |
JP5802150B2 (ja) * | 2012-02-24 | 2015-10-28 | 株式会社神戸製鋼所 | 銅合金 |
KR101472348B1 (ko) * | 2012-11-09 | 2014-12-15 | 주식회사 풍산 | 전기전자 부품용 동합금재 및 그의 제조 방법 |
CN104561645B (zh) * | 2014-11-10 | 2017-01-18 | 华玉叶 | 一种锡铜合金棒材的制备方法 |
RU2566097C1 (ru) * | 2014-12-22 | 2015-10-20 | Юлия Алексеевна Щепочкина | Сплав на основе меди |
CN104911390A (zh) * | 2015-06-13 | 2015-09-16 | 陈新棠 | 一种抗菌耐腐蚀的热交换器铜管 |
CN105568047B (zh) * | 2015-12-29 | 2017-10-10 | 宁波博威合金材料股份有限公司 | 高强高弹高导铜合金 |
DE102017001846A1 (de) * | 2017-02-25 | 2018-08-30 | Wieland-Werke Ag | Gleitelement aus einer Kupferlegierung |
RU2677902C1 (ru) * | 2017-12-27 | 2019-01-22 | Федеральное государственное автономное образовательное учреждение высшего образования "Белгородский государственный национальный исследовательский университет" (НИУ "БелГУ") | Высокопрочный медный сплав |
CN109355529A (zh) * | 2018-12-08 | 2019-02-19 | 雷纳德流体智能科技江苏股份有限公司 | 一种铜合金 |
CN115198135B (zh) * | 2022-07-07 | 2023-06-16 | 浙江鸿越铜业有限公司 | 一种合金铜棒及其加工工艺 |
CN116732384B (zh) * | 2023-08-08 | 2023-11-21 | 宁波兴业盛泰集团有限公司 | 铜镍硅合金铸锭及其制备方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6376839A (ja) * | 1986-09-18 | 1988-04-07 | Furukawa Electric Co Ltd:The | 電子機器用銅合金とその製造法 |
EP0271991B1 (de) * | 1986-11-13 | 1991-10-02 | Ngk Insulators, Ltd. | Herstellung von Kupfer-Berylliumlegierungen |
JPH0830234B2 (ja) * | 1987-07-24 | 1996-03-27 | 古河電気工業株式会社 | 高力高導電性銅合金 |
JPH04180531A (ja) * | 1990-11-14 | 1992-06-26 | Nikko Kyodo Co Ltd | 通電材料 |
KR0157257B1 (ko) * | 1995-12-08 | 1998-11-16 | 정훈보 | 석출물 성장 억제형 고강도, 고전도성 동합금 및 그 제조방법 |
JP3739214B2 (ja) * | 1998-03-26 | 2006-01-25 | 株式会社神戸製鋼所 | 電子部品用銅合金板 |
JP3520046B2 (ja) * | 2000-12-15 | 2004-04-19 | 古河電気工業株式会社 | 高強度銅合金 |
JP4177266B2 (ja) * | 2002-03-12 | 2008-11-05 | 古河電気工業株式会社 | 耐応力緩和特性に優れた高強度高導電性銅合金線材 |
US7182823B2 (en) * | 2002-07-05 | 2007-02-27 | Olin Corporation | Copper alloy containing cobalt, nickel and silicon |
JP2004307905A (ja) * | 2003-04-03 | 2004-11-04 | Sumitomo Metal Ind Ltd | Cu合金およびその製造方法 |
JP4255330B2 (ja) * | 2003-07-31 | 2009-04-15 | 日鉱金属株式会社 | 疲労特性に優れたCu−Ni−Si系合金部材 |
KR100861152B1 (ko) * | 2004-02-27 | 2008-09-30 | 후루카와 덴키 고교 가부시키가이샤 | 구리합금 |
JP4646192B2 (ja) * | 2004-06-02 | 2011-03-09 | 古河電気工業株式会社 | 電気電子機器用銅合金材料およびその製造方法 |
-
2006
- 2006-02-28 WO PCT/JP2006/303738 patent/WO2006093140A1/ja active Application Filing
- 2006-02-28 CN CN200680006379.0A patent/CN101166840B/zh not_active Expired - Fee Related
- 2006-02-28 EP EP06728554A patent/EP1873266B1/de not_active Expired - Fee Related
-
2007
- 2007-08-28 US US11/846,074 patent/US20080047634A1/en not_active Abandoned
-
2011
- 2011-04-11 US US13/083,874 patent/US20110186187A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20110186187A1 (en) | 2011-08-04 |
CN101166840A (zh) | 2008-04-23 |
WO2006093140A1 (ja) | 2006-09-08 |
EP1873266A4 (de) | 2010-07-28 |
EP1873266B1 (de) | 2012-04-25 |
EP1873266A1 (de) | 2008-01-02 |
US20080047634A1 (en) | 2008-02-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120718 Termination date: 20190228 |