CN101159227A - 基板处理装置 - Google Patents
基板处理装置 Download PDFInfo
- Publication number
- CN101159227A CN101159227A CNA2007101531879A CN200710153187A CN101159227A CN 101159227 A CN101159227 A CN 101159227A CN A2007101531879 A CNA2007101531879 A CN A2007101531879A CN 200710153187 A CN200710153187 A CN 200710153187A CN 101159227 A CN101159227 A CN 101159227A
- Authority
- CN
- China
- Prior art keywords
- guide portion
- treatment fluid
- substrate
- wafer
- accumulator tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Abstract
Description
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006272147 | 2006-10-03 | ||
JP2006272147A JP4763567B2 (ja) | 2006-10-03 | 2006-10-03 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101159227A true CN101159227A (zh) | 2008-04-09 |
CN100521085C CN100521085C (zh) | 2009-07-29 |
Family
ID=39259936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2007101531879A Active CN100521085C (zh) | 2006-10-03 | 2007-09-28 | 基板处理装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7958898B2 (zh) |
JP (1) | JP4763567B2 (zh) |
KR (1) | KR100921601B1 (zh) |
CN (1) | CN100521085C (zh) |
TW (1) | TWI383443B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102057464B (zh) * | 2008-06-30 | 2013-03-27 | 芝浦机械电子株式会社 | 自旋处理装置及自旋处理方法 |
CN105161442A (zh) * | 2015-07-21 | 2015-12-16 | 北京七星华创电子股份有限公司 | 一种清洗液体收集装置 |
CN105225987A (zh) * | 2014-06-30 | 2016-01-06 | 细美事有限公司 | 用于处理基板的设备 |
CN109791884A (zh) * | 2016-09-26 | 2019-05-21 | 株式会社斯库林集团 | 衬底处理装置 |
CN111701929A (zh) * | 2020-06-24 | 2020-09-25 | 杭州如剑电子设备有限公司 | 一种便于清洗的电子摄像机镜片清洗设备及其使用方法 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100752246B1 (ko) * | 2005-03-31 | 2007-08-29 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리장치 및 기판처리방법 |
JP5312856B2 (ja) * | 2008-06-27 | 2013-10-09 | 大日本スクリーン製造株式会社 | 基板処理装置 |
EP2372749B1 (de) * | 2010-03-31 | 2021-09-29 | Levitronix GmbH | Behandlungsvorrichtung zur Behandlung einer Oberfläche eines Körpers |
JP5890108B2 (ja) | 2011-04-27 | 2016-03-22 | 株式会社Screenホールディングス | 洗浄処理方法 |
JP5844681B2 (ja) * | 2011-07-06 | 2016-01-20 | 東京エレクトロン株式会社 | 基板液処理装置及び基板液処理方法 |
US9378988B2 (en) | 2011-07-20 | 2016-06-28 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus and substrate processing method using processing solution |
US8899246B2 (en) | 2011-11-23 | 2014-12-02 | Lam Research Ag | Device and method for processing wafer shaped articles |
US20130255724A1 (en) * | 2012-03-30 | 2013-10-03 | Semes Co., Ltd. | Apparatus for treating substrate |
JP6053528B2 (ja) * | 2013-01-11 | 2016-12-27 | 株式会社荏原製作所 | 基板把持装置 |
JP6148475B2 (ja) | 2013-01-25 | 2017-06-14 | 株式会社東芝 | 半導体製造装置および半導体装置の製造方法 |
US10707099B2 (en) | 2013-08-12 | 2020-07-07 | Veeco Instruments Inc. | Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle |
US9768041B2 (en) | 2013-08-12 | 2017-09-19 | Veeco Precision Surface Processing Llc | Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle |
TWM505052U (zh) * | 2015-01-22 | 2015-07-11 | Scientech Corp | 流體製程處理裝置 |
WO2018200398A1 (en) | 2017-04-25 | 2018-11-01 | Veeco Precision Surface Processing Llc | Semiconductor wafer processing chamber |
CN111211066B (zh) * | 2018-11-22 | 2022-09-02 | 辛耘企业股份有限公司 | 流体收集装置 |
CN112053970A (zh) * | 2019-06-05 | 2020-12-08 | 东京毅力科创株式会社 | 基板处理装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3641707B2 (ja) * | 1999-07-22 | 2005-04-27 | 東京エレクトロン株式会社 | 現像処理装置および現像処理方法 |
TW504776B (en) * | 1999-09-09 | 2002-10-01 | Mimasu Semiconductor Ind Co | Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism |
JP4018958B2 (ja) * | 2001-10-30 | 2007-12-05 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP2004031400A (ja) * | 2002-06-21 | 2004-01-29 | Sipec Corp | 基板処理装置及びその処理方法 |
JP4078163B2 (ja) * | 2002-09-13 | 2008-04-23 | 大日本スクリーン製造株式会社 | 基板処理装置 |
US7584760B2 (en) | 2002-09-13 | 2009-09-08 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus |
JP2004265910A (ja) * | 2003-02-03 | 2004-09-24 | Personal Creation Ltd | 基板の処理液の分別回収装置及び該装置を備えた基板の処理装置、並びに基板の処理液の分別回収方法 |
JP2005079219A (ja) * | 2003-08-29 | 2005-03-24 | Tokyo Electron Ltd | 基板処理装置 |
JP3966848B2 (ja) * | 2003-11-07 | 2007-08-29 | 大日本スクリーン製造株式会社 | 基板処理装置 |
WO2005088691A1 (ja) * | 2004-03-12 | 2005-09-22 | Sipec Corporation | 基板処理装置 |
KR100752246B1 (ko) | 2005-03-31 | 2007-08-29 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리장치 및 기판처리방법 |
-
2006
- 2006-10-03 JP JP2006272147A patent/JP4763567B2/ja active Active
-
2007
- 2007-09-27 KR KR1020070097290A patent/KR100921601B1/ko active IP Right Grant
- 2007-09-28 US US11/864,081 patent/US7958898B2/en active Active
- 2007-09-28 CN CNB2007101531879A patent/CN100521085C/zh active Active
- 2007-10-03 TW TW096137002A patent/TWI383443B/zh active
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102057464B (zh) * | 2008-06-30 | 2013-03-27 | 芝浦机械电子株式会社 | 自旋处理装置及自旋处理方法 |
CN105225987A (zh) * | 2014-06-30 | 2016-01-06 | 细美事有限公司 | 用于处理基板的设备 |
CN105225987B (zh) * | 2014-06-30 | 2018-03-09 | 细美事有限公司 | 用于处理基板的设备 |
US9922850B2 (en) | 2014-06-30 | 2018-03-20 | Semes Co., Ltd. | Apparatus for treating substrate |
CN105161442A (zh) * | 2015-07-21 | 2015-12-16 | 北京七星华创电子股份有限公司 | 一种清洗液体收集装置 |
CN105161442B (zh) * | 2015-07-21 | 2018-02-23 | 北京七星华创电子股份有限公司 | 一种清洗液体收集装置 |
CN109791884A (zh) * | 2016-09-26 | 2019-05-21 | 株式会社斯库林集团 | 衬底处理装置 |
CN109791884B (zh) * | 2016-09-26 | 2023-05-30 | 株式会社斯库林集团 | 衬底处理装置 |
CN111701929A (zh) * | 2020-06-24 | 2020-09-25 | 杭州如剑电子设备有限公司 | 一种便于清洗的电子摄像机镜片清洗设备及其使用方法 |
Also Published As
Publication number | Publication date |
---|---|
KR100921601B1 (ko) | 2009-10-14 |
US7958898B2 (en) | 2011-06-14 |
CN100521085C (zh) | 2009-07-29 |
US20080078428A1 (en) | 2008-04-03 |
JP2008091717A (ja) | 2008-04-17 |
JP4763567B2 (ja) | 2011-08-31 |
TW200826182A (en) | 2008-06-16 |
TWI383443B (zh) | 2013-01-21 |
KR20080031110A (ko) | 2008-04-08 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SCREEN GROUP CO., LTD. Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD. Owner name: DAINIPPON SCREEN MFG. CO., LTD. Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Kyoto City, Kyoto, Japan Patentee after: Skilling Group Address before: Kyoto City, Kyoto, Japan Patentee before: DAINIPPON SCREEN MFG Co.,Ltd. Address after: Kyoto City, Kyoto, Japan Patentee after: DAINIPPON SCREEN MFG Co.,Ltd. Address before: Kyoto City, Kyoto, Japan Patentee before: Dainippon Screen Mfg. Co.,Ltd. |