CN101158649A - 外观检查装置及外观检查方法 - Google Patents

外观检查装置及外观检查方法 Download PDF

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Publication number
CN101158649A
CN101158649A CNA2007101616576A CN200710161657A CN101158649A CN 101158649 A CN101158649 A CN 101158649A CN A2007101616576 A CNA2007101616576 A CN A2007101616576A CN 200710161657 A CN200710161657 A CN 200710161657A CN 101158649 A CN101158649 A CN 101158649A
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CN
China
Prior art keywords
inspection
menu
wafer
mentioned
condition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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CNA2007101616576A
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English (en)
Chinese (zh)
Inventor
横田敦俊
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Olympus Corp
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Olympus Corp
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Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of CN101158649A publication Critical patent/CN101158649A/zh
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • G01N21/9503Wafer edge inspection

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
CNA2007101616576A 2006-09-29 2007-09-27 外观检查装置及外观检查方法 Pending CN101158649A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006268478 2006-09-29
JP2006268478A JP2008089351A (ja) 2006-09-29 2006-09-29 外観検査装置及び外観検査方法

Publications (1)

Publication Number Publication Date
CN101158649A true CN101158649A (zh) 2008-04-09

Family

ID=39260790

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007101616576A Pending CN101158649A (zh) 2006-09-29 2007-09-27 外观检查装置及外观检查方法

Country Status (4)

Country Link
US (1) US20080079932A1 (enExample)
JP (1) JP2008089351A (enExample)
CN (1) CN101158649A (enExample)
TW (1) TW200822260A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108204982A (zh) * 2016-12-16 2018-06-26 由田新技股份有限公司 多视角影像撷取装置及多视角影像检测设备
CN108508031A (zh) * 2017-02-28 2018-09-07 上海微电子装备(集团)股份有限公司 一种双面检测装置及检测方法
CN114088724A (zh) * 2021-11-20 2022-02-25 深圳市北科检测科技有限公司 一种显示屏边缘缺陷检测装置
CN114113140A (zh) * 2021-11-26 2022-03-01 深圳市北科检测科技有限公司 一种多工位led灯板检测装置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007024525B4 (de) * 2007-03-19 2009-05-28 Vistec Semiconductor Systems Gmbh Vorrichtung und Verfahren zur Bewertung von Defekten am Randbereich eines Wafers
JP2010002216A (ja) * 2008-06-18 2010-01-07 Kobelco Kaken:Kk 端面観察装置
US20110199480A1 (en) * 2009-07-09 2011-08-18 Camtek Ltd. Optical inspection system using multi-facet imaging
US8786850B2 (en) * 2012-10-29 2014-07-22 Kla-Tencor Corporation Illumination energy management in surface inspection
CN110490458A (zh) 2013-03-20 2019-11-22 生活时间品牌公司 一种移动质量管理检查系统
CN105472252B (zh) * 2015-12-31 2018-12-21 天津远度科技有限公司 一种无人机获取图像的系统及方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100416791B1 (ko) * 2001-03-19 2004-01-31 삼성전자주식회사 반도체 웨이퍼 검사용 현미경장치 및 그 검사방법
JP3629244B2 (ja) * 2002-02-19 2005-03-16 本多エレクトロン株式会社 ウエーハ用検査装置
JP2004227671A (ja) * 2003-01-23 2004-08-12 Tdk Corp 光記録媒体製造装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108204982A (zh) * 2016-12-16 2018-06-26 由田新技股份有限公司 多视角影像撷取装置及多视角影像检测设备
CN108508031A (zh) * 2017-02-28 2018-09-07 上海微电子装备(集团)股份有限公司 一种双面检测装置及检测方法
CN114088724A (zh) * 2021-11-20 2022-02-25 深圳市北科检测科技有限公司 一种显示屏边缘缺陷检测装置
CN114088724B (zh) * 2021-11-20 2023-08-18 深圳市北科检测科技有限公司 一种显示屏边缘缺陷检测装置
CN114113140A (zh) * 2021-11-26 2022-03-01 深圳市北科检测科技有限公司 一种多工位led灯板检测装置
CN114113140B (zh) * 2021-11-26 2023-07-07 深圳市北科检测科技有限公司 一种多工位led灯板检测装置

Also Published As

Publication number Publication date
TW200822260A (en) 2008-05-16
JP2008089351A (ja) 2008-04-17
US20080079932A1 (en) 2008-04-03

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Application publication date: 20080409