JP2008089351A - 外観検査装置及び外観検査方法 - Google Patents

外観検査装置及び外観検査方法 Download PDF

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Publication number
JP2008089351A
JP2008089351A JP2006268478A JP2006268478A JP2008089351A JP 2008089351 A JP2008089351 A JP 2008089351A JP 2006268478 A JP2006268478 A JP 2006268478A JP 2006268478 A JP2006268478 A JP 2006268478A JP 2008089351 A JP2008089351 A JP 2008089351A
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JP
Japan
Prior art keywords
inspection
recipe
wafer
unit
appearance
Prior art date
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Withdrawn
Application number
JP2006268478A
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English (en)
Japanese (ja)
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JP2008089351A5 (enExample
Inventor
Atsutoshi Yokota
敦俊 横田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
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Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Priority to JP2006268478A priority Critical patent/JP2008089351A/ja
Priority to CNA2007101616576A priority patent/CN101158649A/zh
Priority to TW096136196A priority patent/TW200822260A/zh
Priority to US11/906,072 priority patent/US20080079932A1/en
Publication of JP2008089351A publication Critical patent/JP2008089351A/ja
Publication of JP2008089351A5 publication Critical patent/JP2008089351A5/ja
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2006268478A 2006-09-29 2006-09-29 外観検査装置及び外観検査方法 Withdrawn JP2008089351A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006268478A JP2008089351A (ja) 2006-09-29 2006-09-29 外観検査装置及び外観検査方法
CNA2007101616576A CN101158649A (zh) 2006-09-29 2007-09-27 外观检查装置及外观检查方法
TW096136196A TW200822260A (en) 2006-09-29 2007-09-28 Visual inspection apparatus and visual inspection method
US11/906,072 US20080079932A1 (en) 2006-09-29 2007-09-28 Visual inspection apparatus and visual inspection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006268478A JP2008089351A (ja) 2006-09-29 2006-09-29 外観検査装置及び外観検査方法

Publications (2)

Publication Number Publication Date
JP2008089351A true JP2008089351A (ja) 2008-04-17
JP2008089351A5 JP2008089351A5 (enExample) 2009-01-15

Family

ID=39260790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006268478A Withdrawn JP2008089351A (ja) 2006-09-29 2006-09-29 外観検査装置及び外観検査方法

Country Status (4)

Country Link
US (1) US20080079932A1 (enExample)
JP (1) JP2008089351A (enExample)
CN (1) CN101158649A (enExample)
TW (1) TW200822260A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009154182A1 (ja) * 2008-06-18 2009-12-23 株式会社コベルコ科研 端面観察装置

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007024525B4 (de) * 2007-03-19 2009-05-28 Vistec Semiconductor Systems Gmbh Vorrichtung und Verfahren zur Bewertung von Defekten am Randbereich eines Wafers
US20110199480A1 (en) * 2009-07-09 2011-08-18 Camtek Ltd. Optical inspection system using multi-facet imaging
US8786850B2 (en) * 2012-10-29 2014-07-22 Kla-Tencor Corporation Illumination energy management in surface inspection
CN110490458A (zh) 2013-03-20 2019-11-22 生活时间品牌公司 一种移动质量管理检查系统
CN105472252B (zh) * 2015-12-31 2018-12-21 天津远度科技有限公司 一种无人机获取图像的系统及方法
TWI628428B (zh) * 2016-12-16 2018-07-01 由田新技股份有限公司 多視角影像擷取裝置、及其多視角影像檢測設備
CN108508031A (zh) * 2017-02-28 2018-09-07 上海微电子装备（集团）股份有限公司 一种双面检测装置及检测方法
CN114088724B (zh) * 2021-11-20 2023-08-18 深圳市北科检测科技有限公司 一种显示屏边缘缺陷检测装置
CN114113140B (zh) * 2021-11-26 2023-07-07 深圳市北科检测科技有限公司 一种多工位led灯板检测装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100416791B1 (ko) * 2001-03-19 2004-01-31 삼성전자주식회사 반도체 웨이퍼 검사용 현미경장치 및 그 검사방법
JP3629244B2 (ja) * 2002-02-19 2005-03-16 本多エレクトロン株式会社 ウエーハ用検査装置
JP2004227671A (ja) * 2003-01-23 2004-08-12 Tdk Corp 光記録媒体製造装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009154182A1 (ja) * 2008-06-18 2009-12-23 株式会社コベルコ科研 端面観察装置
JP2010002216A (ja) * 2008-06-18 2010-01-07 Kobelco Kaken:Kk 端面観察装置

Also Published As

Publication number Publication date
TW200822260A (en) 2008-05-16
US20080079932A1 (en) 2008-04-03
CN101158649A (zh) 2008-04-09

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