TW200822260A - Visual inspection apparatus and visual inspection method - Google Patents

Visual inspection apparatus and visual inspection method Download PDF

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Publication number
TW200822260A
TW200822260A TW096136196A TW96136196A TW200822260A TW 200822260 A TW200822260 A TW 200822260A TW 096136196 A TW096136196 A TW 096136196A TW 96136196 A TW96136196 A TW 96136196A TW 200822260 A TW200822260 A TW 200822260A
Authority
TW
Taiwan
Prior art keywords
inspection
wafer
unit
parameter
condition
Prior art date
Application number
TW096136196A
Other languages
English (en)
Chinese (zh)
Inventor
Atsutoshi Yokota
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of TW200822260A publication Critical patent/TW200822260A/zh

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • G01N21/9503Wafer edge inspection

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW096136196A 2006-09-29 2007-09-28 Visual inspection apparatus and visual inspection method TW200822260A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006268478A JP2008089351A (ja) 2006-09-29 2006-09-29 外観検査装置及び外観検査方法

Publications (1)

Publication Number Publication Date
TW200822260A true TW200822260A (en) 2008-05-16

Family

ID=39260790

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096136196A TW200822260A (en) 2006-09-29 2007-09-28 Visual inspection apparatus and visual inspection method

Country Status (4)

Country Link
US (1) US20080079932A1 (enExample)
JP (1) JP2008089351A (enExample)
CN (1) CN101158649A (enExample)
TW (1) TW200822260A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007024525B4 (de) * 2007-03-19 2009-05-28 Vistec Semiconductor Systems Gmbh Vorrichtung und Verfahren zur Bewertung von Defekten am Randbereich eines Wafers
JP2010002216A (ja) * 2008-06-18 2010-01-07 Kobelco Kaken:Kk 端面観察装置
US20110199480A1 (en) * 2009-07-09 2011-08-18 Camtek Ltd. Optical inspection system using multi-facet imaging
US8786850B2 (en) * 2012-10-29 2014-07-22 Kla-Tencor Corporation Illumination energy management in surface inspection
US10127523B2 (en) 2013-03-20 2018-11-13 Lifetime Brands, Inc. Method and apparatus for mobile quality management inspections
CN105472252B (zh) * 2015-12-31 2018-12-21 天津远度科技有限公司 一种无人机获取图像的系统及方法
TWI628428B (zh) * 2016-12-16 2018-07-01 由田新技股份有限公司 多視角影像擷取裝置、及其多視角影像檢測設備
CN108508031A (zh) * 2017-02-28 2018-09-07 上海微电子装备(集团)股份有限公司 一种双面检测装置及检测方法
CN114088724B (zh) * 2021-11-20 2023-08-18 深圳市北科检测科技有限公司 一种显示屏边缘缺陷检测装置
CN114113140B (zh) * 2021-11-26 2023-07-07 深圳市北科检测科技有限公司 一种多工位led灯板检测装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100416791B1 (ko) * 2001-03-19 2004-01-31 삼성전자주식회사 반도체 웨이퍼 검사용 현미경장치 및 그 검사방법
JP3629244B2 (ja) * 2002-02-19 2005-03-16 本多エレクトロン株式会社 ウエーハ用検査装置
JP2004227671A (ja) * 2003-01-23 2004-08-12 Tdk Corp 光記録媒体製造装置

Also Published As

Publication number Publication date
CN101158649A (zh) 2008-04-09
US20080079932A1 (en) 2008-04-03
JP2008089351A (ja) 2008-04-17

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