CN101150122A - 具有电磁屏蔽功能的半导体封装结构 - Google Patents

具有电磁屏蔽功能的半导体封装结构 Download PDF

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CN101150122A
CN101150122A CN 200710167237 CN200710167237A CN101150122A CN 101150122 A CN101150122 A CN 101150122A CN 200710167237 CN200710167237 CN 200710167237 CN 200710167237 A CN200710167237 A CN 200710167237A CN 101150122 A CN101150122 A CN 101150122A
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吴家福
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Abstract

一种具有电磁屏蔽功能的半导体封装结构，包括一基板、若干个半导体芯片、若干个屏蔽金属球、若干个接地金属球以及若干个导通金属球。该若干个半导体芯片沿水平方向相邻设置在该基板的一上表面。该若干个屏蔽金属球设置在该基板的上表面，使各半导体芯片的周围均设有该屏蔽金属球，以屏蔽该若干个半导体芯片来自于水平方向的电磁干扰信号。该屏蔽金属球的一部分设置在该半导体芯片之间，以屏蔽该半导体芯片之间的相互电磁干扰；该屏蔽金属球的另一部分设置在该半导体芯片的外周侧，以屏蔽来自于外部的电磁干扰信号。

Description

具有电磁屏蔽功能的半导体封装结构
技术领域
本发明涉及一种半导体封装结构，特别是关于一种具有电磁屏蔽功能的半导体封装结构。
背景技术
电磁干扰是人们早就发现的一种电磁现象。一些电器、电子设备工作时所产生的电磁波，容易对周围的其它电气、电子设备形成电磁干扰，引发故障或者影响信号的传输。另外，过度的电磁干扰会形成电磁污染，危害人们的身体健康，破坏生态平衡。随着设备与结构的改进，要实现能够正常工作而不会相互发生电磁干扰造成性能改变和设备损坏的这种相互兼容的状态越来越难以获得。为了使系统实现电磁兼容，必须以系统的电磁环境为依据，要求每个用电设备不产生超过一定限度的电磁发射，同时又要求它本身要具备一定的抗干扰能力。只有对每一设备都作出这两个方面的约束和改进，才能保证系统实现完全兼容。
在高密度封装技术中，可采用并排(Side by side)式，将多颗芯片排在一起封装起来；或者采用另一种堆叠(Stack)式，将多颗芯片堆叠起来，组合成一个完整的系统(System In Package)。然而，同一系统的芯片之间存在着彼此会产生电磁干扰的问题，而该系统的芯片也可能受到来自于外部的电磁信号的干扰，从而造成芯片的损坏，并连带使该芯片所在的设备引发故障。
有鉴于此，本发明提出一种更加有效的电磁屏蔽方式，利用其特殊的电磁屏蔽结构，不仅可提供电磁屏蔽的效果，防止其芯片组之间互相干扰，并且该电磁屏蔽结构并不会增加封装的堆叠垂直高度。
发明内容
本发明的目的在于提供一种半导体封装结构，其通过在芯片之间设置屏蔽金属球，可实现电磁屏蔽的功能。
为实现上述目的，本发明具有电磁屏蔽功能的半导体封装结构包括一基板、若干个半导体芯片、若干个屏蔽金属球、若干个接地金属球以及若干个导通金属球。该若干个半导体芯片沿水平方向相邻设置在该基板的一上表面。该半导体芯片的底面与该基板的上表面形成一接合区，该半导体芯片利用若干个凸块与该基板实现接合。该若干个屏蔽金属球设置在该基板的上表面，使各半导体芯片的周围均设有该屏蔽金属球，以屏蔽该若干个半导体芯片来自于水平方向的电磁干扰信号。该屏蔽金属球的一部份设置在该半导体芯片之间，以屏蔽该半导体芯片之间的相互电磁干扰；该屏蔽金属球的另一部份则设置在该半导体芯片的外周侧，以屏蔽来自于外部的电磁干扰信号。该屏蔽金属球的高度实质等于或小于该接合区与该半导体芯片的高度总和。
另外，本发明进一步可在该若干个半导体芯片的上方设置一散热片，以提高该半导体封装结构的散热效率。
此外，本发明进一步可在该散热片与该基板之间填入一封胶材料，以增加该散热片与该基板之间的结合强度。
与现有技术相比较，本发明具有电磁屏蔽功能的半导体封装结构利用设置在各芯片周围的屏蔽金属球可实现电磁屏蔽的功能，不但可防止芯片组之间的互相干扰，并且该电磁屏蔽结构并不会增加芯片封装的垂直高度。此外，该半导体封装结构也可结合散热片与封胶材料，以提高散热效率与增加结构强度。
以下结合附图与实施例对本发明作进一步的说明。
附图说明
图1为本发明第一实施例的结构示意图。
图2为本发明第二实施例的结构示意图。
图3为本发明第三实施例的结构示意图。
具体实施方式
有关本发明的详细说明及技术内容，现就结合附图说明如下：
图1为依据本发明第一实施例具有电磁屏蔽功能的半导体封装结构的结构示意图。该第一实施例的半导体封装结构包括一基板101、若干个半导体芯片102、若干个屏蔽金属球103、若干个接地金属球104以及若干个导通金属球110。
该基板101具有一上表面105与一下表面106。该基板101上形成有贯穿该基板101的若干个导通孔107。该若干个半导体芯片102沿水平方向相邻设置在该基板101的上表面105，也即该若干个半导体芯片102实质呈并排(Side by side)的相对关系。每个半导体芯片102的底面(未标号)设有若干个凸块109，用以电性连接该基板101的相应电路(未图示)。该半导体芯片102的底面与该基板101的上表面105形成一接合区118。在接合区118中，该半导体芯片102利用该若干个凸块109与该基板101实现接合，必要时也可选择填入适当的底胶(underfil1)。该若干个屏蔽金属球103设置在该基板101的上表面105，使各半导体芯片102的周围均设有该屏蔽金属球103，以屏蔽该若干个半导体芯片102来自于水平方向的电磁干扰信号。详细而言，该屏蔽金属球103的一部份设置在该半导体芯片102之间，以屏蔽该半导体芯片102之间的相互电磁干扰；该屏蔽金属球103的另一部份则设置在该半导体芯片102的外周侧，以屏蔽来自于外部的电磁干扰信号。每个屏蔽金属球103分别与相应的导通孔107的上端形成电性连接。该屏蔽金属球103的高度实质等于或小于该接合区118与该半导体芯片102的高度总和。
该若干个接地金属球104设置在该基板101的下表面106，并与该导通孔107的下端形成电性连接。该若干个接地金属球104与接地电路(未图示)形成电性连接，用以使该屏蔽金属球103实现接地。该若干个导通金属球110设置在该基板101的下表面106，用以连接该基板101的相应电路(未图示)，并且该若干个导通金属球110是该基板101的外部输入/输出端，以输入/输出电信号。值得注意的是，本发明的屏蔽金属球103及接地金属球104仅用以屏蔽电磁干扰信号及形成接地(或形成导热通道)，该两者并不用以输入/输出电信号，也即完全不同于该导通金属球110的作用。
图2为依据本发明第二实施例具有电磁屏蔽功能的半导体封装结构的结构示意图。该第二实施例与上述第一实施例不同之处在于：该第二实施例进一步在该若干个半导体芯片102的上方设置了一散热片111，并且该散热片111与该基板101上表面105的屏蔽金属球103的上缘相接。该散热片111与该屏蔽金属球103电性连接，以通过该屏蔽金属球103实现接地。该散热片111可提高本发明半导体封装结构的散热效率。此外，该散热片111的材料可选择铜、铝、银、金等高导热性金属，并且该散热片111与该半导体芯片102之间也可选择填充一导热膏，例如导热银胶等。
图3为依据本发明第三实施例具有电磁屏蔽功能的半导体封装结构的结构示意图。该第三实施例与上述第二实施例不同之处在于：该第三实施例进一步在该散热片111与该基板101之间填入了一封胶材料112。该封胶材料112可增强该散热片111与该基板101之间的结合强度。此外，该基板101与该散热片111上可进一步选择性地分别设置至少一注模锁孔113。该注模锁孔113填注有该封胶材料112，用以增强该基板101、该散热片111与该封胶材料112三者之间的结合强度。该注模锁孔113可以是具有倒角的盲孔或是具有倒角的通孔。
根据上述实施例，与现有技术相比较，本发明具有电磁屏蔽功能的半导体封装结构利用设置在各芯片周围的屏蔽金属球可实现电磁屏蔽的功能，不但可防止芯片组之间的互相干扰，并且该电磁屏蔽结构并不会增加芯片封装的垂直高度。此外，该半导体封装结构也可选择结合散热片与封胶材料，以提高散热效率与增加结构强度。

Claims (12)

1.一种具有电磁屏蔽功能的半导体封装结构，包括：
一基板，具有一上表面与一下表面，所述基板上形成有若干个贯穿所述基板的导通孔；
若干个半导体芯片，沿水平方向相邻设置在所述基板的上表面；以及
若干个接地金属球，设置在所述基板的下表面，并与所述导通孔的下端形成电性连接；
其特征在于：所述半导体封装结构进一步包括若干个屏蔽金属球，所述屏蔽金属球设置在所述基板的上表面，并与所述导通孔的上端形成电性连接。
2.如权利要求1所述的半导体封装结构，其特征在于：所述若干个半导体芯片的下表面与所述基板的上表面之间形成一接合区，并且所述若干个半导体芯片在所述接合区内进一步包括若干个凸块。
3.如权利要求1所述的半导体封装结构，其特征在于：所述若干个屏蔽金属球的一部份设置在相邻的所述半导体芯片之间。
4.如权利要求1所述的半导体封装结构，其特征在于：所述若干个屏蔽金属球的一部份设置在所述半导体芯片的外周侧。
5.如权利要求1所述的半导体封装结构，其特征在于：所述基板的下表面进一步包括若干个导通金属球。
6.如权利要求2所述的半导体封装结构，其特征在于：所述屏蔽金属球的高度小于或等于所述接合区与所述半导体芯片的高度总和。
7.如权利要求1所述的半导体封装结构，其特征在于：进一步包括一散热片，所述散热片设置在所述若干个半导体芯片的上方。
8.如权利要求7所述的半导体封装结构，其特征在于：所述散热片与所述基板上表面的屏蔽金属球的上缘相接。
9.如权利要求7所述的半导体封装结构，其特征在于：所述散热片与所述半导体芯片之间填充一导热胶。
10.如权利要求7所述的半导体封装结构，其特征在于：进一步包括一封胶材料，设置在所述散热片与所述基板之间。
11.如权利要求10所述的半导体封装结构，其特征在于：所述散热片进一步包括至少一注模锁孔，所述散热片的注模锁孔为具有倒角的盲孔或具有倒角的通孔，所述散热片的注模锁孔填注有所述封胶材料。
12.如权利要求10所述的半导体封装结构，其特征在于：所述基板进一步包括至少一注模锁孔，所述基板的注模锁孔为具有倒角的盲孔或具有倒角的通孔，所述基板的注模锁孔填注有所述封胶材料。
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