CN101113229B - 固化剂中间体组合物及采用该组合物的固化剂 - Google Patents
固化剂中间体组合物及采用该组合物的固化剂 Download PDFInfo
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- CN101113229B CN101113229B CN2007100763544A CN200710076354A CN101113229B CN 101113229 B CN101113229 B CN 101113229B CN 2007100763544 A CN2007100763544 A CN 2007100763544A CN 200710076354 A CN200710076354 A CN 200710076354A CN 101113229 B CN101113229 B CN 101113229B
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- Prior art keywords
- masterbatch
- reaction
- solidifying agent
- epoxy resin
- bisphenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000203 mixture Substances 0.000 title claims description 27
- 239000004594 Masterbatch (MB) Substances 0.000 claims abstract description 190
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 73
- 238000006243 chemical reaction Methods 0.000 claims abstract description 37
- 239000002131 composite material Substances 0.000 claims abstract description 28
- 238000002360 preparation method Methods 0.000 claims abstract description 24
- 239000003822 epoxy resin Substances 0.000 claims abstract description 21
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 36
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 36
- 239000002904 solvent Substances 0.000 claims description 26
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 claims description 18
- 239000004593 Epoxy Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 238000010790 dilution Methods 0.000 claims description 15
- 239000012895 dilution Substances 0.000 claims description 15
- 238000010792 warming Methods 0.000 claims description 15
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 claims description 13
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 12
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 11
- 150000005619 secondary aliphatic amines Chemical class 0.000 claims description 11
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims description 11
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 claims description 10
- 239000000243 solution Substances 0.000 claims description 10
- 229940015043 glyoxal Drugs 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 9
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 8
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims description 8
- 239000012046 mixed solvent Substances 0.000 claims description 8
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 8
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 claims description 7
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 claims description 6
- 238000007259 addition reaction Methods 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 238000010410 dusting Methods 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 claims description 5
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- 239000008096 xylene Substances 0.000 claims description 5
- MNAHQWDCXOHBHK-UHFFFAOYSA-N 1-phenylpropane-1,1-diol Chemical compound CCC(O)(O)C1=CC=CC=C1 MNAHQWDCXOHBHK-UHFFFAOYSA-N 0.000 claims description 4
- LRWZZZWJMFNZIK-UHFFFAOYSA-N 2-chloro-3-methyloxirane Chemical compound CC1OC1Cl LRWZZZWJMFNZIK-UHFFFAOYSA-N 0.000 claims description 4
- 238000005576 amination reaction Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000012141 concentrate Substances 0.000 claims description 4
- 239000012153 distilled water Substances 0.000 claims description 4
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 claims description 4
- 238000004821 distillation Methods 0.000 claims description 2
- 239000000376 reactant Substances 0.000 claims description 2
- 238000003860 storage Methods 0.000 abstract description 7
- 238000004377 microelectronic Methods 0.000 abstract description 5
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 abstract 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 abstract 1
- 240000007582 Corylus avellana Species 0.000 description 9
- 235000007466 Corylus avellana Nutrition 0.000 description 9
- 239000000084 colloidal system Substances 0.000 description 9
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 6
- 239000000047 product Substances 0.000 description 5
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 229910021529 ammonia Inorganic materials 0.000 description 3
- 230000032050 esterification Effects 0.000 description 3
- 238000005886 esterification reaction Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910021617 Indium monochloride Inorganic materials 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 150000004696 coordination complex Chemical class 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 150000004693 imidazolium salts Chemical class 0.000 description 2
- APHGZSBLRQFRCA-UHFFFAOYSA-M indium(1+);chloride Chemical compound [In]Cl APHGZSBLRQFRCA-UHFFFAOYSA-M 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical class CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 241001222774 Salmonella enterica subsp. enterica serovar Minnesota Species 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007385 chemical modification Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000006253 efflorescence Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 206010037844 rash Diseases 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
Abstract
Description
实施例1 | 实施例2 | 实施例3 | 实施例4 | 实施例5 | 实施例6 | 实施例7 | 实施例8 | 实施例9 | |
外观: | 淡褐色胶体 | 淡褐色胶体 | 淡褐色胶体 | 淡褐色胶体 | 淡褐色胶体 | 淡褐色胶体 | 淡褐色胶体 | 淡褐色胶体 | 淡褐色胶体 |
挥发性: | 3.1% | 3.5% | 4.6% | 4.5% | 3.6% | 3.8% | 4.7% | 4.9% | 4% |
粘度(CPS/25℃) | 4010 | 4053 | 5046 | 5638 | 5824 | 4863 | 4753 | 5872 | 5264 |
凝胶时间: | ≤100℃10’30”≤120℃9′10”≤80℃10’30” | ≤100℃10′30”≤120℃9′10″≤80℃10′30 | ≤100℃10′30”≤120℃9′10″≤80℃10′30 | ≤100℃10′30”≤120℃9′10″≤80℃10′30 | ≤100℃5′20”≤120℃4′30″≤80℃7′30″ | ≤100℃6′40”≤120℃5′10″≤80℃7′30″ | ≤100℃4′50”≤120℃3′30″≤80℃6′10″ | ≤100℃6′40”≤120℃5′10″≤80℃7′30″ | ≤100℃4′50”≤120℃3′30″≤80℃6′10″ |
贮存时间(天) | 196 | 205 | 261 | 238 | 187 | 211 | 249 | 183 | 242 |
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007100763544A CN101113229B (zh) | 2007-07-04 | 2007-07-04 | 固化剂中间体组合物及采用该组合物的固化剂 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007100763544A CN101113229B (zh) | 2007-07-04 | 2007-07-04 | 固化剂中间体组合物及采用该组合物的固化剂 |
Publications (2)
Publication Number | Publication Date |
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CN101113229A CN101113229A (zh) | 2008-01-30 |
CN101113229B true CN101113229B (zh) | 2010-10-06 |
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CN2007100763544A Expired - Fee Related CN101113229B (zh) | 2007-07-04 | 2007-07-04 | 固化剂中间体组合物及采用该组合物的固化剂 |
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CN (1) | CN101113229B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101240154B (zh) * | 2008-03-04 | 2012-05-23 | 上海回天化工新材料有限公司 | 单组分高剥离强度环氧树脂胶粘剂及其制备方法 |
CN104531024A (zh) * | 2014-12-22 | 2015-04-22 | 阳新宏洋电子有限公司 | 环氧树脂胶粘剂及该胶粘剂制备的柔性覆铜板及制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1537878A (zh) * | 2003-10-22 | 2004-10-20 | 萍 刘 | 一种潜伏性固化剂的制造方法 |
US6887737B1 (en) * | 2001-12-13 | 2005-05-03 | Henkel Corporation | Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom |
JP2006008755A (ja) * | 2004-06-23 | 2006-01-12 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及びそれを用いた半導体装置並びにその組み立て方法 |
WO2007049385A1 (ja) * | 2005-10-24 | 2007-05-03 | Three Bond Co., Ltd. | 有機el素子封止用熱硬化型組成物 |
-
2007
- 2007-07-04 CN CN2007100763544A patent/CN101113229B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6887737B1 (en) * | 2001-12-13 | 2005-05-03 | Henkel Corporation | Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom |
CN1537878A (zh) * | 2003-10-22 | 2004-10-20 | 萍 刘 | 一种潜伏性固化剂的制造方法 |
JP2006008755A (ja) * | 2004-06-23 | 2006-01-12 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及びそれを用いた半導体装置並びにその組み立て方法 |
WO2007049385A1 (ja) * | 2005-10-24 | 2007-05-03 | Three Bond Co., Ltd. | 有機el素子封止用熱硬化型組成物 |
Non-Patent Citations (1)
Title |
---|
JP昭59-027914A 1984.02.14 |
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CN101113229A (zh) | 2008-01-30 |
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