CN101107079B - 液体排出装置 - Google Patents

液体排出装置 Download PDF

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Publication number
CN101107079B
CN101107079B CN2006800025676A CN200680002567A CN101107079B CN 101107079 B CN101107079 B CN 101107079B CN 2006800025676 A CN2006800025676 A CN 2006800025676A CN 200680002567 A CN200680002567 A CN 200680002567A CN 101107079 B CN101107079 B CN 101107079B
Authority
CN
China
Prior art keywords
pressure
stream
valve
manifold
reducing valve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2006800025676A
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English (en)
Chinese (zh)
Other versions
CN101107079A (zh
Inventor
生岛和正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Musashi Engineering Inc
Original Assignee
Musashi Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Engineering Inc filed Critical Musashi Engineering Inc
Publication of CN101107079A publication Critical patent/CN101107079A/zh
Application granted granted Critical
Publication of CN101107079B publication Critical patent/CN101107079B/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/877—With flow control means for branched passages
    • Y10T137/87885—Sectional block structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Jet Pumps And Other Pumps (AREA)
  • Loading And Unloading Of Fuel Tanks Or Ships (AREA)
  • Devices For Dispensing Beverages (AREA)
  • Fluid-Pressure Circuits (AREA)
  • Control Of Fluid Pressure (AREA)
CN2006800025676A 2005-01-18 2006-01-18 液体排出装置 Expired - Lifetime CN101107079B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP010968/2005 2005-01-18
JP2005010968A JP4789233B2 (ja) 2005-01-18 2005-01-18 液体吐出装置
PCT/JP2006/300627 WO2006077875A1 (ja) 2005-01-18 2006-01-18 液体吐出装置

Publications (2)

Publication Number Publication Date
CN101107079A CN101107079A (zh) 2008-01-16
CN101107079B true CN101107079B (zh) 2012-07-25

Family

ID=36692264

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006800025676A Expired - Lifetime CN101107079B (zh) 2005-01-18 2006-01-18 液体排出装置

Country Status (9)

Country Link
US (1) US8251261B2 (https=)
EP (1) EP1839763B1 (https=)
JP (1) JP4789233B2 (https=)
KR (1) KR100969340B1 (https=)
CN (1) CN101107079B (https=)
MY (1) MY147693A (https=)
SG (1) SG158854A1 (https=)
TW (1) TWI381117B (https=)
WO (1) WO2006077875A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI681879B (zh) 2015-04-03 2020-01-11 日商武藏工業股份有限公司 液滴吐出裝置及塗佈裝置

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009104421A1 (ja) * 2008-02-21 2009-08-27 武蔵エンジニアリング株式会社 液体材料の吐出装置および方法
JP2010131493A (ja) * 2008-12-03 2010-06-17 Juki Corp 液体吐出装置
KR101906193B1 (ko) 2010-04-14 2018-12-05 파커-한니핀 코포레이션 셔틀 밸브
KR101075074B1 (ko) * 2011-06-09 2011-10-19 최경택 리크 테스터용 공압제어모듈
KR101095191B1 (ko) * 2011-07-10 2011-12-16 이강준 이동식 재난구조용 공압하트머신
ITPI20120092A1 (it) * 2012-08-08 2014-02-09 David Gagliardi Dispositivo di erogazione di una sostanza fluida
CN106086625B (zh) * 2012-11-22 2018-03-06 Posco公司 用于埋弧焊接或气体金属电弧焊接的焊接材料
KR101397900B1 (ko) 2012-12-14 2014-05-20 오스템임플란트 주식회사 치과 유니트 체어용 유체 조절 장치
CN104633208A (zh) * 2013-11-07 2015-05-20 丹阳智盛合金有限公司 一种压阀
JP6452147B2 (ja) * 2015-01-19 2019-01-16 武蔵エンジニアリング株式会社 液体材料吐出装置
JP6541489B2 (ja) * 2015-07-24 2019-07-10 武蔵エンジニアリング株式会社 液体材料吐出装置
CN105214897A (zh) * 2015-10-20 2016-01-06 深圳市奋达科技股份有限公司 一种涂接点油装置
EP3431191B1 (en) * 2016-03-18 2021-03-03 Fuji Corporation Viscous fluid supply device
JP7401345B2 (ja) 2020-02-28 2023-12-19 株式会社神戸製鋼所 Ｎｉ基合金フラックス入りワイヤ
USD1074771S1 (en) * 2021-01-19 2025-05-13 Musashi Engineering, Inc. Liquid precision discharge control machine
KR102330271B1 (ko) 2021-05-31 2021-11-23 허수영 공압 디스펜서의 액체 토출량 보정 시스템
KR102466306B1 (ko) 2021-06-08 2022-11-14 허수영 공압 디스펜서의 액체 토출량 조절 시스템 및 방법
USD1077877S1 (en) * 2022-03-24 2025-06-03 Musashi Engineering, Inc. Liquid precision discharge control machine
JP2023159558A (ja) * 2022-04-20 2023-11-01 株式会社リコー 塗工ノズル及び塗工装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0306200A1 (en) * 1987-09-03 1989-03-08 Dymax Corporation Radiation supply and adhesive dispensing system
CN1155638A (zh) * 1995-10-02 1997-07-30 速睦喜股份有限公司 集成块式电磁阀

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Publication number Priority date Publication date Assignee Title
JPS5237475A (en) * 1975-09-17 1977-03-23 Electron Fusion Devices Distributing apparatus for measuring viscous material
JPS6438304A (en) * 1987-08-05 1989-02-08 Hitachi Ltd Driving device for rotary rack
JPS6438304U (https=) 1987-09-01 1989-03-07
JP2511117B2 (ja) 1988-08-23 1996-06-26 武蔵エンジニアリング株式会社 液体定量吐出装置
FR2636547B1 (fr) * 1988-09-21 1991-12-20 Gaudion Henri Distributeur mini doseur pneumatique de produits visqueux
JPH0364U (https=) * 1989-05-18 1991-01-07
JPH0638832B2 (ja) * 1989-05-26 1994-05-25 株式会社ニッショー 医療用バッグのポート取付方法および装置
US5199607A (en) * 1990-12-03 1993-04-06 Musashi Engineering, Inc. Liquid dispensing apparatus
JP2517181B2 (ja) * 1991-03-30 1996-07-24 武蔵エンジニアリング株式会社 液体定量吐出装置
JPH04327001A (ja) * 1991-04-25 1992-11-16 Matsushita Electric Ind Co Ltd エアユニット
JP3000064U (ja) * 1994-01-08 1994-07-26 康克 井野内 エアー圧送式吐出装置
US5482553A (en) * 1994-06-02 1996-01-09 Illinois Tool Works Inc. System for pin-point application of a removable conformal coating
JP3081536B2 (ja) * 1996-08-06 2000-08-28 シーケーディ株式会社 マニホールド
JP3862331B2 (ja) * 1996-11-05 2006-12-27 Ｊｕｋｉ株式会社 液体定量塗布装置
JPH1122699A (ja) * 1997-07-04 1999-01-26 Smc Corp エゼクタ装置
JPH11166652A (ja) * 1997-12-02 1999-06-22 Sanyo Electric Co Ltd 電磁弁付きレギュレータ
JP3597695B2 (ja) * 1998-03-06 2004-12-08 武蔵エンジニアリング株式会社 液体吐出装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0306200A1 (en) * 1987-09-03 1989-03-08 Dymax Corporation Radiation supply and adhesive dispensing system
CN1155638A (zh) * 1995-10-02 1997-07-30 速睦喜股份有限公司 集成块式电磁阀

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开平11-244757A 1999.09.14

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI681879B (zh) 2015-04-03 2020-01-11 日商武藏工業股份有限公司 液滴吐出裝置及塗佈裝置

Also Published As

Publication number Publication date
EP1839763B1 (en) 2015-03-11
TW200630556A (en) 2006-09-01
EP1839763A1 (en) 2007-10-03
MY147693A (en) 2012-12-31
JP2006198488A (ja) 2006-08-03
HK1108137A1 (en) 2008-05-02
CN101107079A (zh) 2008-01-16
US20090120357A1 (en) 2009-05-14
JP4789233B2 (ja) 2011-10-12
KR20070110491A (ko) 2007-11-19
KR100969340B1 (ko) 2010-07-09
US8251261B2 (en) 2012-08-28
EP1839763A4 (en) 2008-07-16
SG158854A1 (en) 2010-02-26
TWI381117B (zh) 2013-01-01
WO2006077875A1 (ja) 2006-07-27

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