CN101106865B - 两面柔性电路基板 - Google Patents
两面柔性电路基板 Download PDFInfo
- Publication number
- CN101106865B CN101106865B CN200710142160XA CN200710142160A CN101106865B CN 101106865 B CN101106865 B CN 101106865B CN 200710142160X A CN200710142160X A CN 200710142160XA CN 200710142160 A CN200710142160 A CN 200710142160A CN 101106865 B CN101106865 B CN 101106865B
- Authority
- CN
- China
- Prior art keywords
- mentioned
- elasticity
- circuit board
- conductor
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004020 conductor Substances 0.000 claims abstract description 102
- 239000010410 layer Substances 0.000 claims abstract description 99
- 239000011347 resin Substances 0.000 claims abstract description 72
- 229920005989 resin Polymers 0.000 claims abstract description 72
- 239000000463 material Substances 0.000 claims abstract description 50
- 239000012790 adhesive layer Substances 0.000 claims abstract description 19
- 238000003475 lamination Methods 0.000 claims description 32
- 239000011230 binding agent Substances 0.000 claims description 29
- 238000009413 insulation Methods 0.000 claims description 23
- 239000011120 plywood Substances 0.000 claims description 16
- 238000005253 cladding Methods 0.000 claims description 10
- 238000005452 bending Methods 0.000 abstract description 14
- 239000000853 adhesive Substances 0.000 abstract description 13
- 230000001070 adhesive effect Effects 0.000 abstract description 13
- 230000000052 comparative effect Effects 0.000 description 18
- 238000011156 evaluation Methods 0.000 description 13
- 238000012360 testing method Methods 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 239000010408 film Substances 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000010998 test method Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 230000008719 thickening Effects 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000009931 harmful effect Effects 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- TZFWDZFKRBELIQ-UHFFFAOYSA-N chlorzoxazone Chemical compound ClC1=CC=C2OC(O)=NC2=C1 TZFWDZFKRBELIQ-UHFFFAOYSA-N 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 235000014347 soups Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Landscapes
- Structure Of Printed Boards (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006135539A JP4642693B2 (ja) | 2006-05-15 | 2006-05-15 | 両面可撓性回路基板 |
| JP2006135539 | 2006-05-15 | ||
| JP2006-135539 | 2006-05-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101106865A CN101106865A (zh) | 2008-01-16 |
| CN101106865B true CN101106865B (zh) | 2012-08-08 |
Family
ID=38839581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710142160XA Expired - Fee Related CN101106865B (zh) | 2006-05-15 | 2007-05-15 | 两面柔性电路基板 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4642693B2 (https=) |
| CN (1) | CN101106865B (https=) |
| TW (1) | TWI384924B (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2009096067A1 (ja) * | 2008-02-01 | 2011-05-26 | 日立化成工業株式会社 | 光電気混載基板及び電子機器 |
| JPWO2010058476A1 (ja) * | 2008-11-21 | 2012-04-12 | 日立化成工業株式会社 | 光電気混載基板及び電子機器 |
| JP2011230308A (ja) * | 2010-04-23 | 2011-11-17 | Panasonic Electric Works Co Ltd | フレキシブル銅張積層板及びフレキシブルプリント配線板 |
| US8628173B2 (en) * | 2010-06-07 | 2014-01-14 | Xerox Corporation | Electrical interconnect using embossed contacts on a flex circuit |
| CN107230429B (zh) * | 2017-06-08 | 2019-06-25 | 武汉天马微电子有限公司 | 柔性模组和柔性显示面板 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0673391B2 (ja) * | 1987-08-12 | 1994-09-14 | 住友電気工業株式会社 | フレキシブル両面回路基板の製造方法 |
| JP2753740B2 (ja) * | 1989-08-31 | 1998-05-20 | 日本メクトロン株式会社 | 可撓性回路基板の製造法 |
| JP4860185B2 (ja) * | 2005-05-31 | 2012-01-25 | 日本メクトロン株式会社 | 可撓性回路基板 |
-
2006
- 2006-05-15 JP JP2006135539A patent/JP4642693B2/ja not_active Expired - Fee Related
-
2007
- 2007-05-09 TW TW96116522A patent/TWI384924B/zh not_active IP Right Cessation
- 2007-05-15 CN CN200710142160XA patent/CN101106865B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TW200814895A (en) | 2008-03-16 |
| JP4642693B2 (ja) | 2011-03-02 |
| TWI384924B (zh) | 2013-02-01 |
| JP2007305936A (ja) | 2007-11-22 |
| CN101106865A (zh) | 2008-01-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120808 Termination date: 20200515 |