CN101088140B - 从卷筒到卷筒制造的发光纸和密封的半导体电路装置 - Google Patents
从卷筒到卷筒制造的发光纸和密封的半导体电路装置 Download PDFInfo
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/1025—Semiconducting materials
- H01L2924/1026—Compound semiconductors
- H01L2924/1032—III-V
- H01L2924/10336—Aluminium gallium arsenide [AlGaAs]
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H—ELECTRICITY
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- H01—ELECTRIC ELEMENTS
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
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- H—ELECTRICITY
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- H01L2924/30—Technical effects
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
Description
Claims (34)
Applications Claiming Priority (13)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US55695904P | 2004-03-29 | 2004-03-29 | |
US60/556,959 | 2004-03-29 | ||
US10/920,010 | 2004-08-17 | ||
US10/919,830 US7052924B2 (en) | 2004-03-29 | 2004-08-17 | Light active sheet and methods for making the same |
US10/919,915 | 2004-08-17 | ||
US10/920,010 US7217956B2 (en) | 2004-03-29 | 2004-08-17 | Light active sheet material |
US10/919,915 US7294961B2 (en) | 2004-03-29 | 2004-08-17 | Photo-radiation source provided with emissive particles dispersed in a charge-transport matrix |
US10/919,830 | 2004-08-17 | ||
US11/029,129 | 2005-01-04 | ||
US11/029,137 US7427782B2 (en) | 2004-03-29 | 2005-01-04 | Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices |
US11/029,137 | 2005-01-04 | ||
US11/029,129 US7259030B2 (en) | 2004-03-29 | 2005-01-04 | Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices |
PCT/US2005/010051 WO2005099310A2 (en) | 2004-03-29 | 2005-03-26 | Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices |
Publications (2)
Publication Number | Publication Date |
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CN101088140A CN101088140A (zh) | 2007-12-12 |
CN101088140B true CN101088140B (zh) | 2010-11-03 |
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Application Number | Title | Priority Date | Filing Date |
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CN2005800147912A Expired - Fee Related CN101088140B (zh) | 2004-03-29 | 2005-03-26 | 从卷筒到卷筒制造的发光纸和密封的半导体电路装置 |
Country Status (2)
Country | Link |
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US (2) | US7259030B2 (zh) |
CN (1) | CN101088140B (zh) |
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CN101088140A (zh) | 2007-12-12 |
US20050214963A1 (en) | 2005-09-29 |
US20080191220A1 (en) | 2008-08-14 |
US7259030B2 (en) | 2007-08-21 |
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