CN101083277B - 显示装置及其制造方法 - Google Patents

显示装置及其制造方法 Download PDF

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Publication number
CN101083277B
CN101083277B CN2007101054780A CN200710105478A CN101083277B CN 101083277 B CN101083277 B CN 101083277B CN 2007101054780 A CN2007101054780 A CN 2007101054780A CN 200710105478 A CN200710105478 A CN 200710105478A CN 101083277 B CN101083277 B CN 101083277B
Authority
CN
China
Prior art keywords
sealant
display device
encapsulant
base
encapsulation film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007101054780A
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English (en)
Chinese (zh)
Other versions
CN101083277A (zh
Inventor
具沅会
金勋
崔贞美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Display Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of CN101083277A publication Critical patent/CN101083277A/zh
Application granted granted Critical
Publication of CN101083277B publication Critical patent/CN101083277B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
CN2007101054780A 2006-06-01 2007-06-01 显示装置及其制造方法 Expired - Fee Related CN101083277B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2006-0049549 2006-06-01
KR1020060049549A KR100688972B1 (ko) 2006-06-01 2006-06-01 표시장치와 이의 제조방법
KR1020060049549 2006-06-01

Publications (2)

Publication Number Publication Date
CN101083277A CN101083277A (zh) 2007-12-05
CN101083277B true CN101083277B (zh) 2010-11-10

Family

ID=38102266

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007101054780A Expired - Fee Related CN101083277B (zh) 2006-06-01 2007-06-01 显示装置及其制造方法

Country Status (4)

Country Link
US (1) US7671959B2 (enExample)
JP (1) JP4943921B2 (enExample)
KR (1) KR100688972B1 (enExample)
CN (1) CN101083277B (enExample)

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KR100875099B1 (ko) * 2007-06-05 2008-12-19 삼성모바일디스플레이주식회사 유기 발광 장치 및 이의 제조 방법
JP4961271B2 (ja) * 2007-06-12 2012-06-27 シャープ株式会社 液晶表示パネルの製造方法及び液晶表示パネル
KR101307550B1 (ko) 2007-12-31 2013-09-12 엘지디스플레이 주식회사 유기전계발광표시장치
KR101301180B1 (ko) 2008-11-21 2013-08-28 엘지디스플레이 주식회사 듀얼플레이트 방식의 유기전계 발광소자 및 그 합착 방법
KR101084175B1 (ko) * 2009-11-23 2011-11-17 삼성모바일디스플레이주식회사 유기 발광 디스플레이 장치 및 그 제조 방법
KR101084179B1 (ko) * 2009-12-28 2011-11-17 삼성모바일디스플레이주식회사 유기 발광 디스플레이 소자의 봉지 방법
KR101754916B1 (ko) * 2010-11-08 2017-07-20 삼성디스플레이 주식회사 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법
CN102738089B (zh) * 2012-03-07 2018-02-23 苏州晶方半导体科技股份有限公司 半导体封装结构及其模组
CN103325960B (zh) * 2012-03-23 2016-03-16 昆山工研院新型平板显示技术中心有限公司 有机光电子器件的薄膜封装方法
TW201347167A (zh) * 2012-05-15 2013-11-16 Innocom Tech Shenzhen Co Ltd 有機發光二極體顯示裝置
CN103794733A (zh) * 2012-10-31 2014-05-14 财团法人工业技术研究院 环境敏感电子元件封装体
KR101420332B1 (ko) * 2012-11-14 2014-07-16 삼성디스플레이 주식회사 유기 발광 디스플레이 장치
CN102983290B (zh) * 2012-11-21 2015-12-02 京东方科技集团股份有限公司 一种oled器件封装方法及oled显示装置
TWI552331B (zh) * 2013-01-11 2016-10-01 財團法人工業技術研究院 電子元件之封裝結構
CN104051357B (zh) 2013-03-15 2017-04-12 财团法人工业技术研究院 环境敏感电子装置以及其封装方法
US20170183101A1 (en) * 2014-03-20 2017-06-29 Arizona Board Of Regents On Behalf Of Arizona State University Pagophobic coating compositions, method of manufacture and methods of use
CN104201291A (zh) * 2014-08-26 2014-12-10 京东方科技集团股份有限公司 一种有机电致发光器件及其制备方法
KR102296916B1 (ko) 2014-10-16 2021-09-02 삼성디스플레이 주식회사 유기 발광 표시 장치
WO2016059497A1 (en) * 2014-10-17 2016-04-21 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, module, electronic device, and method for manufacturing light-emitting device
CN104576697A (zh) * 2014-12-24 2015-04-29 深圳市华星光电技术有限公司 双面oled显示装置及其制作方法
WO2017017553A1 (en) 2015-07-30 2017-02-02 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of light-emitting device, light-emitting device, module, and electronic device
CN106887413A (zh) * 2015-12-16 2017-06-23 上海和辉光电有限公司 一种封装结构及其制备方法
US10501640B2 (en) 2017-01-31 2019-12-10 Arizona Board Of Regents On Behalf Of Arizona State University Nanoporous materials, method of manufacture and methods of use
JP6817145B2 (ja) * 2017-05-29 2021-01-20 エルジー ディスプレイ カンパニー リミテッド 有機電界発光装置および有機電界発光装置の製造方法
CN109188789A (zh) * 2018-11-09 2019-01-11 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置
CN110379298B (zh) * 2019-07-19 2021-06-01 深圳市华星光电半导体显示技术有限公司 框胶结构和显示面板的制作方法
CN110429206B (zh) * 2019-08-07 2021-11-23 京东方科技集团股份有限公司 封装盖板、显示装置、显示面板及显示面板的封装方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1472567A (zh) * 2002-07-30 2004-02-04 Nec液晶技术株式会社 液晶显示器及其制造方法
CN1578546A (zh) * 2003-06-27 2005-02-09 株式会社半导体能源研究所 显示器件及其制作方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
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KR20030001156A (ko) * 2001-06-28 2003-01-06 주식회사 대한전광 다중 쉴드 커버 플레이트를 가진 유기 전계발광 소자
JP4520226B2 (ja) * 2003-06-27 2010-08-04 株式会社半導体エネルギー研究所 表示装置及び表示装置の作製方法
JP4831954B2 (ja) * 2003-11-14 2011-12-07 株式会社半導体エネルギー研究所 表示装置の作製方法
KR100992141B1 (ko) 2003-11-19 2010-11-04 삼성전자주식회사 유기 발광 표시장치
KR100557728B1 (ko) 2003-12-27 2006-03-06 엘지.필립스 엘시디 주식회사 유기전계 발광소자와 그 제조방법
JP2005340020A (ja) 2004-05-27 2005-12-08 Hitachi Displays Ltd 有機エレクトロルミネッセンス表示装置およびその製造方法
KR100603350B1 (ko) * 2004-06-17 2006-07-20 삼성에스디아이 주식회사 전계 발광 디스플레이 장치
US20070172971A1 (en) * 2006-01-20 2007-07-26 Eastman Kodak Company Desiccant sealing arrangement for OLED devices

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1472567A (zh) * 2002-07-30 2004-02-04 Nec液晶技术株式会社 液晶显示器及其制造方法
CN1578546A (zh) * 2003-06-27 2005-02-09 株式会社半导体能源研究所 显示器件及其制作方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2002-329576A 2002.11.15

Also Published As

Publication number Publication date
KR100688972B1 (ko) 2007-03-08
US20070279571A1 (en) 2007-12-06
CN101083277A (zh) 2007-12-05
JP4943921B2 (ja) 2012-05-30
JP2007324121A (ja) 2007-12-13
US7671959B2 (en) 2010-03-02

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: SAMSUNG DISPLAY CO., LTD.

Free format text: FORMER OWNER: SAMSUNG ELECTRONICS CO., LTD.

Effective date: 20121225

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20121225

Address after: South Korea Gyeonggi Do Yongin

Patentee after: Samsung Display Co.,Ltd.

Address before: Gyeonggi Do Lingtong Suwon Qu Mei Tan Dong 416

Patentee before: Samsung Electronics Co.,Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20101110

Termination date: 20210601