JP4943921B2 - 表示装置 - Google Patents

表示装置 Download PDF

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Publication number
JP4943921B2
JP4943921B2 JP2007102483A JP2007102483A JP4943921B2 JP 4943921 B2 JP4943921 B2 JP 4943921B2 JP 2007102483 A JP2007102483 A JP 2007102483A JP 2007102483 A JP2007102483 A JP 2007102483A JP 4943921 B2 JP4943921 B2 JP 4943921B2
Authority
JP
Japan
Prior art keywords
sealant
insulating substrate
substrate
thin film
display device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007102483A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007324121A (ja
JP2007324121A5 (enExample
Inventor
▲元▼ 會 具
勳 金
貞 美 崔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of JP2007324121A publication Critical patent/JP2007324121A/ja
Publication of JP2007324121A5 publication Critical patent/JP2007324121A5/ja
Application granted granted Critical
Publication of JP4943921B2 publication Critical patent/JP4943921B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
JP2007102483A 2006-06-01 2007-04-10 表示装置 Expired - Fee Related JP4943921B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020060049549A KR100688972B1 (ko) 2006-06-01 2006-06-01 표시장치와 이의 제조방법
KR10-2006-0049549 2006-06-01

Publications (3)

Publication Number Publication Date
JP2007324121A JP2007324121A (ja) 2007-12-13
JP2007324121A5 JP2007324121A5 (enExample) 2010-04-08
JP4943921B2 true JP4943921B2 (ja) 2012-05-30

Family

ID=38102266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007102483A Expired - Fee Related JP4943921B2 (ja) 2006-06-01 2007-04-10 表示装置

Country Status (4)

Country Link
US (1) US7671959B2 (enExample)
JP (1) JP4943921B2 (enExample)
KR (1) KR100688972B1 (enExample)
CN (1) CN101083277B (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100875099B1 (ko) * 2007-06-05 2008-12-19 삼성모바일디스플레이주식회사 유기 발광 장치 및 이의 제조 방법
JP4961271B2 (ja) * 2007-06-12 2012-06-27 シャープ株式会社 液晶表示パネルの製造方法及び液晶表示パネル
KR101307550B1 (ko) 2007-12-31 2013-09-12 엘지디스플레이 주식회사 유기전계발광표시장치
KR101301180B1 (ko) 2008-11-21 2013-08-28 엘지디스플레이 주식회사 듀얼플레이트 방식의 유기전계 발광소자 및 그 합착 방법
KR101084175B1 (ko) * 2009-11-23 2011-11-17 삼성모바일디스플레이주식회사 유기 발광 디스플레이 장치 및 그 제조 방법
KR101084179B1 (ko) * 2009-12-28 2011-11-17 삼성모바일디스플레이주식회사 유기 발광 디스플레이 소자의 봉지 방법
KR101754916B1 (ko) * 2010-11-08 2017-07-20 삼성디스플레이 주식회사 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법
CN102738089B (zh) * 2012-03-07 2018-02-23 苏州晶方半导体科技股份有限公司 半导体封装结构及其模组
CN103325960B (zh) * 2012-03-23 2016-03-16 昆山工研院新型平板显示技术中心有限公司 有机光电子器件的薄膜封装方法
TW201347167A (zh) * 2012-05-15 2013-11-16 Innocom Tech Shenzhen Co Ltd 有機發光二極體顯示裝置
CN103794733A (zh) * 2012-10-31 2014-05-14 财团法人工业技术研究院 环境敏感电子元件封装体
KR101420332B1 (ko) * 2012-11-14 2014-07-16 삼성디스플레이 주식회사 유기 발광 디스플레이 장치
CN102983290B (zh) * 2012-11-21 2015-12-02 京东方科技集团股份有限公司 一种oled器件封装方法及oled显示装置
TWI552331B (zh) * 2013-01-11 2016-10-01 財團法人工業技術研究院 電子元件之封裝結構
CN104051357B (zh) 2013-03-15 2017-04-12 财团法人工业技术研究院 环境敏感电子装置以及其封装方法
US20170183101A1 (en) * 2014-03-20 2017-06-29 Arizona Board Of Regents On Behalf Of Arizona State University Pagophobic coating compositions, method of manufacture and methods of use
CN104201291A (zh) * 2014-08-26 2014-12-10 京东方科技集团股份有限公司 一种有机电致发光器件及其制备方法
KR102296916B1 (ko) 2014-10-16 2021-09-02 삼성디스플레이 주식회사 유기 발광 표시 장치
KR102603895B1 (ko) * 2014-10-17 2023-11-21 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치, 모듈, 전자 기기, 및 발광 장치의 제작 방법
CN104576697A (zh) * 2014-12-24 2015-04-29 深圳市华星光电技术有限公司 双面oled显示装置及其制作方法
CN108738377B (zh) * 2015-07-30 2020-11-10 株式会社半导体能源研究所 发光装置的制造方法、发光装置、模块及电子设备
CN106887413A (zh) * 2015-12-16 2017-06-23 上海和辉光电有限公司 一种封装结构及其制备方法
US10501640B2 (en) 2017-01-31 2019-12-10 Arizona Board Of Regents On Behalf Of Arizona State University Nanoporous materials, method of manufacture and methods of use
JP6817145B2 (ja) * 2017-05-29 2021-01-20 エルジー ディスプレイ カンパニー リミテッド 有機電界発光装置および有機電界発光装置の製造方法
CN109188789A (zh) * 2018-11-09 2019-01-11 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置
CN110379298B (zh) * 2019-07-19 2021-06-01 深圳市华星光电半导体显示技术有限公司 框胶结构和显示面板的制作方法
CN110429206B (zh) * 2019-08-07 2021-11-23 京东方科技集团股份有限公司 封装盖板、显示装置、显示面板及显示面板的封装方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030001156A (ko) * 2001-06-28 2003-01-06 주식회사 대한전광 다중 쉴드 커버 플레이트를 가진 유기 전계발광 소자
CN1215361C (zh) * 2002-07-30 2005-08-17 Nec液晶技术株式会社 液晶显示器及其制造方法
JP4520226B2 (ja) * 2003-06-27 2010-08-04 株式会社半導体エネルギー研究所 表示装置及び表示装置の作製方法
SG142140A1 (en) * 2003-06-27 2008-05-28 Semiconductor Energy Lab Display device and method of manufacturing thereof
JP4831954B2 (ja) * 2003-11-14 2011-12-07 株式会社半導体エネルギー研究所 表示装置の作製方法
KR100992141B1 (ko) 2003-11-19 2010-11-04 삼성전자주식회사 유기 발광 표시장치
KR100557728B1 (ko) 2003-12-27 2006-03-06 엘지.필립스 엘시디 주식회사 유기전계 발광소자와 그 제조방법
JP2005340020A (ja) * 2004-05-27 2005-12-08 Hitachi Displays Ltd 有機エレクトロルミネッセンス表示装置およびその製造方法
KR100603350B1 (ko) * 2004-06-17 2006-07-20 삼성에스디아이 주식회사 전계 발광 디스플레이 장치
US20070172971A1 (en) * 2006-01-20 2007-07-26 Eastman Kodak Company Desiccant sealing arrangement for OLED devices

Also Published As

Publication number Publication date
US20070279571A1 (en) 2007-12-06
JP2007324121A (ja) 2007-12-13
KR100688972B1 (ko) 2007-03-08
CN101083277B (zh) 2010-11-10
CN101083277A (zh) 2007-12-05
US7671959B2 (en) 2010-03-02

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