CN101061434A - 深uv用光致抗蚀剂组合物及其方法 - Google Patents
深uv用光致抗蚀剂组合物及其方法 Download PDFInfo
- Publication number
- CN101061434A CN101061434A CNA2005800399398A CN200580039939A CN101061434A CN 101061434 A CN101061434 A CN 101061434A CN A2005800399398 A CNA2005800399398 A CN A2005800399398A CN 200580039939 A CN200580039939 A CN 200580039939A CN 101061434 A CN101061434 A CN 101061434A
- Authority
- CN
- China
- Prior art keywords
- alkyl
- group
- acid labile
- branched
- linear
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/04—Polymers provided for in subclasses C08C or C08F
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/111—Polymer of unsaturated acid or ester
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/994,745 | 2004-11-22 | ||
| US10/994,745 US7537879B2 (en) | 2004-11-22 | 2004-11-22 | Photoresist composition for deep UV and process thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101061434A true CN101061434A (zh) | 2007-10-24 |
Family
ID=35892397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2005800399398A Pending CN101061434A (zh) | 2004-11-22 | 2005-11-21 | 深uv用光致抗蚀剂组合物及其方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7537879B2 (enExample) |
| EP (1) | EP1828843A1 (enExample) |
| JP (1) | JP2008521039A (enExample) |
| KR (1) | KR20070089182A (enExample) |
| CN (1) | CN101061434A (enExample) |
| TW (1) | TW200632554A (enExample) |
| WO (1) | WO2006054173A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113614073A (zh) * | 2019-03-27 | 2021-11-05 | 三菱化学株式会社 | 聚合物、抗蚀剂组合物、形成有图案的基板的制造方法、以及(甲基)丙烯酸酯及其制造方法 |
Families Citing this family (50)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2006075646A1 (ja) * | 2005-01-12 | 2008-06-12 | 三菱レイヨン株式会社 | 化合物、重合体および光学部品 |
| US7399581B2 (en) * | 2005-02-24 | 2008-07-15 | International Business Machines Corporation | Photoresist topcoat for a photolithographic process |
| EP1720072B1 (en) * | 2005-05-01 | 2019-06-05 | Rohm and Haas Electronic Materials, L.L.C. | Compositons and processes for immersion lithography |
| JP4861767B2 (ja) * | 2005-07-26 | 2012-01-25 | 富士フイルム株式会社 | ポジ型レジスト組成物およびそれを用いたパターン形成方法 |
| JP5002137B2 (ja) * | 2005-07-28 | 2012-08-15 | 富士フイルム株式会社 | 化学増幅型レジスト組成物及びその製造方法 |
| US20070092829A1 (en) * | 2005-10-21 | 2007-04-26 | Christoph Noelscher | Photosensitive coating for enhancing a contrast of a photolithographic exposure |
| TWI347495B (en) * | 2006-01-08 | 2011-08-21 | Rohm & Haas Elect Mat | Coating compositions for photoresists |
| JP4912733B2 (ja) * | 2006-02-17 | 2012-04-11 | 東京応化工業株式会社 | 液浸露光用レジスト組成物およびレジストパターン形成方法 |
| US7550249B2 (en) * | 2006-03-10 | 2009-06-23 | Az Electronic Materials Usa Corp. | Base soluble polymers for photoresist compositions |
| US7799507B2 (en) * | 2006-05-18 | 2010-09-21 | Tokyo Ohka Co., Ltd. | Positive resist composition for immersion lithography and method for forming resist pattern |
| JP2008053622A (ja) * | 2006-08-28 | 2008-03-06 | Nec Electronics Corp | 液浸露光用液浸液 |
| US7416834B2 (en) * | 2006-09-27 | 2008-08-26 | Az Electronic Materials Usa Corp. | Antireflective coating compositions |
| US7759046B2 (en) | 2006-12-20 | 2010-07-20 | Az Electronic Materials Usa Corp. | Antireflective coating compositions |
| JP4752794B2 (ja) * | 2007-03-08 | 2011-08-17 | Jsr株式会社 | 感放射線性樹脂組成物及び感放射線性樹脂組成物用重合体 |
| US20090104373A1 (en) * | 2007-10-23 | 2009-04-23 | Xerox Corporation | Methods for applying fluorescent ultraviolet curable varnishes |
| KR20090049862A (ko) * | 2007-11-14 | 2009-05-19 | 주식회사 동진쎄미켐 | 감광성 화합물 및 이를 포함하는 포토레지스트 조성물 |
| JP5398248B2 (ja) * | 2008-02-06 | 2014-01-29 | 東京応化工業株式会社 | 液浸露光用レジスト組成物およびそれを用いたレジストパターン形成方法 |
| KR101529940B1 (ko) * | 2008-02-12 | 2015-06-19 | 한양대학교 산학협력단 | 플루오로알킬술폰늄염의 광산발생기가 측쇄에 도입된단량체 제조방법 |
| JP5248138B2 (ja) * | 2008-02-22 | 2013-07-31 | 株式会社クラレ | 新規なアクリル酸エステル誘導体、およびその製造方法 |
| JP5548406B2 (ja) | 2008-08-22 | 2014-07-16 | 東京応化工業株式会社 | ポジ型レジスト組成物、レジストパターン形成方法、高分子化合物 |
| JP5337576B2 (ja) * | 2008-10-07 | 2013-11-06 | 東京応化工業株式会社 | ポジ型レジスト組成物およびレジストパターン形成方法 |
| EP2189846B1 (en) * | 2008-11-19 | 2015-04-22 | Rohm and Haas Electronic Materials LLC | Process for photolithography applying a photoresist composition comprising a block copolymer |
| EP2189847A3 (en) * | 2008-11-19 | 2010-07-21 | Rohm and Haas Electronic Materials LLC | Compositions comprising hetero-substituted carbocyclic aryl component and processes for photolithography |
| JP5337579B2 (ja) * | 2008-12-04 | 2013-11-06 | 東京応化工業株式会社 | ポジ型レジスト組成物、レジストパターン形成方法 |
| JP5232663B2 (ja) * | 2009-01-14 | 2013-07-10 | 東京応化工業株式会社 | レジスト組成物、レジストパターン形成方法、高分子化合物及び化合物 |
| JP5232675B2 (ja) * | 2009-01-26 | 2013-07-10 | 東京応化工業株式会社 | ポジ型レジスト組成物及びそれを用いたレジストパターン形成方法、並びに高分子化合物 |
| JP5308871B2 (ja) * | 2009-03-06 | 2013-10-09 | 東京応化工業株式会社 | レジスト組成物、レジストパターン形成方法 |
| JP5292133B2 (ja) * | 2009-03-09 | 2013-09-18 | 東京応化工業株式会社 | ポジ型レジスト組成物及びレジストパターン形成方法 |
| JP5308874B2 (ja) * | 2009-03-09 | 2013-10-09 | 東京応化工業株式会社 | ポジ型レジスト組成物、レジストパターン形成方法、高分子化合物、化合物 |
| JP5308877B2 (ja) * | 2009-03-10 | 2013-10-09 | 東京応化工業株式会社 | ポジ型レジスト組成物、レジストパターン形成方法 |
| JP5308876B2 (ja) * | 2009-03-10 | 2013-10-09 | 東京応化工業株式会社 | ポジ型レジスト組成物、レジストパターン形成方法 |
| JP5346627B2 (ja) * | 2009-03-10 | 2013-11-20 | 東京応化工業株式会社 | ポジ型レジスト組成物及びレジストパターン形成方法 |
| JP5264575B2 (ja) | 2009-03-11 | 2013-08-14 | 東京応化工業株式会社 | ポジ型レジスト組成物およびレジストパターン形成方法 |
| JP5520515B2 (ja) * | 2009-04-15 | 2014-06-11 | 東京応化工業株式会社 | ポジ型レジスト組成物およびレジストパターン形成方法 |
| JP5386236B2 (ja) * | 2009-06-01 | 2014-01-15 | 東京応化工業株式会社 | ポジ型レジスト組成物及びレジストパターン形成方法 |
| JP5568258B2 (ja) | 2009-07-03 | 2014-08-06 | 東京応化工業株式会社 | ポジ型レジスト組成物およびそれを用いたレジストパターン形成方法、並びに含フッ素高分子化合物 |
| JP5516195B2 (ja) | 2009-08-04 | 2014-06-11 | 信越化学工業株式会社 | パターン形成方法及びレジスト材料 |
| JP5470053B2 (ja) * | 2010-01-05 | 2014-04-16 | 東京応化工業株式会社 | ポジ型レジスト組成物、レジストパターン形成方法 |
| JP5496715B2 (ja) * | 2010-03-10 | 2014-05-21 | 株式会社クラレ | アクリル酸エステル誘導体、高分子化合物およびフォトレジスト組成物 |
| JP5655579B2 (ja) * | 2011-01-17 | 2015-01-21 | Jsr株式会社 | 感放射線性樹脂組成物、パターン形成方法、重合体及び化合物 |
| JP4945688B2 (ja) * | 2011-02-07 | 2012-06-06 | 富士フイルム株式会社 | 化学増幅型レジスト組成物及びその製造方法 |
| KR101855507B1 (ko) | 2011-07-11 | 2018-05-08 | 주식회사 동진쎄미켐 | 네가티브 톤 현상액으로 현상된 포토레지스트 패턴 코팅용 조성물 및 이를 이용한 미세패턴 형성 방법 |
| JP6002378B2 (ja) | 2011-11-24 | 2016-10-05 | 東京応化工業株式会社 | 高分子化合物の製造方法 |
| JP5820719B2 (ja) | 2011-12-21 | 2015-11-24 | 東京応化工業株式会社 | レジストパターン形成方法 |
| US8795947B2 (en) | 2012-03-22 | 2014-08-05 | Tokyo Ohka Kogyo Co., Ltd. | Resist composition and method of forming resist pattern |
| US8795948B2 (en) | 2012-03-22 | 2014-08-05 | Tokyo Ohka Kogyo Co., Ltd. | Resist composition, method of forming resist pattern and polymeric compound |
| PL3349290T3 (pl) * | 2015-09-09 | 2024-04-02 | Sumitomo Seika Chemicals Co., Ltd. | Dodatek dla niewodnych roztworów elektrolitów, niewodny roztwór elektrolitu i urządzenie do magazynowania energii elektrycznej |
| JP7546353B2 (ja) * | 2019-12-11 | 2024-09-06 | 東京応化工業株式会社 | レジスト組成物及びレジストパターン形成方法 |
| JP7718088B2 (ja) * | 2021-03-31 | 2025-08-05 | 三菱ケミカル株式会社 | 3-(メタ)アクリロイルスルホランの製造方法 |
| US20240241440A1 (en) * | 2022-12-28 | 2024-07-18 | Rohm And Haas Electronic Materials Llc | Polymer, photoresist compositions including the same, and pattern formation methods |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4491628A (en) | 1982-08-23 | 1985-01-01 | International Business Machines Corporation | Positive- and negative-working resist compositions with acid generating photoinitiator and polymer with acid labile groups pendant from polymer backbone |
| EP0440374B1 (en) | 1990-01-30 | 1997-04-16 | Wako Pure Chemical Industries Ltd | Chemical amplified resist material |
| US5843624A (en) | 1996-03-08 | 1998-12-01 | Lucent Technologies Inc. | Energy-sensitive resist material and a process for device fabrication using an energy-sensitive resist material |
| JP3995369B2 (ja) * | 1998-12-07 | 2007-10-24 | 富士フイルム株式会社 | ポジ型フォトレジスト組成物 |
| JP3865863B2 (ja) * | 1997-05-06 | 2007-01-10 | 富士フイルムホールディングス株式会社 | 遠紫外線露光用ポジ型フォトレジスト組成物 |
| TW526390B (en) | 1997-06-26 | 2003-04-01 | Shinetsu Chemical Co | Resist compositions |
| EP1143299B1 (en) | 2000-04-04 | 2003-07-16 | Sumitomo Chemical Company, Limited | Chemically amplified positive resist composition |
| US6447980B1 (en) | 2000-07-19 | 2002-09-10 | Clariant Finance (Bvi) Limited | Photoresist composition for deep UV and process thereof |
| JP2002202606A (ja) * | 2000-12-28 | 2002-07-19 | Fuji Photo Film Co Ltd | 遠紫外線露光用ポジ型フォトレジスト組成物 |
| TWI264442B (en) * | 2002-03-25 | 2006-10-21 | Shinetsu Chemical Co | Novel esters, polymers, resist compositions and patterning process |
| JP4038675B2 (ja) * | 2002-03-26 | 2008-01-30 | 信越化学工業株式会社 | 高分子化合物、レジスト材料及びパターン形成方法 |
| TWI304412B (en) * | 2002-03-26 | 2008-12-21 | Shinetsu Chemical Co | Polymers, resist compositions andpatterning process |
| JP4178007B2 (ja) * | 2002-07-31 | 2008-11-12 | 富士フイルム株式会社 | ポジ型レジスト組成物 |
| JP4007582B2 (ja) * | 2002-04-26 | 2007-11-14 | 富士フイルム株式会社 | ポジ型レジスト組成物 |
| KR100955006B1 (ko) * | 2002-04-26 | 2010-04-27 | 후지필름 가부시키가이샤 | 포지티브 레지스트 조성물 |
| US6919161B2 (en) * | 2002-07-02 | 2005-07-19 | Shin-Etsu Chemical Co., Ltd. | Silicon-containing polymer, resist composition and patterning process |
| JP4200368B2 (ja) * | 2002-07-02 | 2008-12-24 | 信越化学工業株式会社 | 珪素含有高分子化合物、レジスト材料及びパターン形成方法 |
| JP4025683B2 (ja) * | 2003-05-09 | 2007-12-26 | 松下電器産業株式会社 | パターン形成方法及び露光装置 |
| JP2005049695A (ja) * | 2003-07-30 | 2005-02-24 | Fuji Photo Film Co Ltd | ポジ型レジスト組成物 |
| JP2005055697A (ja) * | 2003-08-05 | 2005-03-03 | Fuji Photo Film Co Ltd | ポジ型レジスト組成物及びそれを用いたパターン形成方法 |
-
2004
- 2004-11-22 US US10/994,745 patent/US7537879B2/en not_active Expired - Fee Related
-
2005
- 2005-11-21 KR KR1020077013992A patent/KR20070089182A/ko not_active Ceased
- 2005-11-21 JP JP2007542163A patent/JP2008521039A/ja active Pending
- 2005-11-21 WO PCT/IB2005/003517 patent/WO2006054173A1/en not_active Ceased
- 2005-11-21 EP EP05808458A patent/EP1828843A1/en not_active Withdrawn
- 2005-11-21 CN CNA2005800399398A patent/CN101061434A/zh active Pending
- 2005-11-22 TW TW094141024A patent/TW200632554A/zh unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113614073A (zh) * | 2019-03-27 | 2021-11-05 | 三菱化学株式会社 | 聚合物、抗蚀剂组合物、形成有图案的基板的制造方法、以及(甲基)丙烯酸酯及其制造方法 |
| US11845822B2 (en) | 2019-03-27 | 2023-12-19 | Mitsubishi Chemical Corporation | Polymer, resist composition, method for manufacturing substrate having pattern formed therein, and (meth) acrylic ester and production method therefor |
| CN113614073B (zh) * | 2019-03-27 | 2024-09-24 | 三菱化学株式会社 | 聚合物、抗蚀剂组合物、形成有图案的基板的制造方法、以及(甲基)丙烯酸酯及其制造方法 |
| US12384863B2 (en) | 2019-03-27 | 2025-08-12 | Mitsubishi Chemical Corporation | Polymer, resist composition, method for manufacturing substrate having pattern formed therein, and (meth)acrylic ester and production method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20070089182A (ko) | 2007-08-30 |
| EP1828843A1 (en) | 2007-09-05 |
| US20060110677A1 (en) | 2006-05-25 |
| JP2008521039A (ja) | 2008-06-19 |
| TW200632554A (en) | 2006-09-16 |
| WO2006054173A1 (en) | 2006-05-26 |
| US7537879B2 (en) | 2009-05-26 |
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