CN101061434A - 深uv用光致抗蚀剂组合物及其方法 - Google Patents

深uv用光致抗蚀剂组合物及其方法 Download PDF

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Publication number
CN101061434A
CN101061434A CNA2005800399398A CN200580039939A CN101061434A CN 101061434 A CN101061434 A CN 101061434A CN A2005800399398 A CNA2005800399398 A CN A2005800399398A CN 200580039939 A CN200580039939 A CN 200580039939A CN 101061434 A CN101061434 A CN 101061434A
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CN
China
Prior art keywords
alkyl
group
acid labile
branched
linear
Prior art date
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Pending
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CNA2005800399398A
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English (en)
Chinese (zh)
Inventor
F·M·胡里汉
R·R·达米尔
A·R·罗马诺
M·帕德马纳班
D·M·拉曼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EMD Performance Materials Corp
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AZ Electronic Materials USA Corp
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Publication date
Application filed by AZ Electronic Materials USA Corp filed Critical AZ Electronic Materials USA Corp
Publication of CN101061434A publication Critical patent/CN101061434A/zh
Pending legal-status Critical Current

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/04Polymers provided for in subclasses C08C or C08F
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0395Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/106Binder containing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/106Binder containing
    • Y10S430/111Polymer of unsaturated acid or ester

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
CNA2005800399398A 2004-11-22 2005-11-21 深uv用光致抗蚀剂组合物及其方法 Pending CN101061434A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/994,745 2004-11-22
US10/994,745 US7537879B2 (en) 2004-11-22 2004-11-22 Photoresist composition for deep UV and process thereof

Publications (1)

Publication Number Publication Date
CN101061434A true CN101061434A (zh) 2007-10-24

Family

ID=35892397

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2005800399398A Pending CN101061434A (zh) 2004-11-22 2005-11-21 深uv用光致抗蚀剂组合物及其方法

Country Status (7)

Country Link
US (1) US7537879B2 (enExample)
EP (1) EP1828843A1 (enExample)
JP (1) JP2008521039A (enExample)
KR (1) KR20070089182A (enExample)
CN (1) CN101061434A (enExample)
TW (1) TW200632554A (enExample)
WO (1) WO2006054173A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113614073A (zh) * 2019-03-27 2021-11-05 三菱化学株式会社 聚合物、抗蚀剂组合物、形成有图案的基板的制造方法、以及(甲基)丙烯酸酯及其制造方法

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2006075646A1 (ja) * 2005-01-12 2008-06-12 三菱レイヨン株式会社 化合物、重合体および光学部品
US7399581B2 (en) * 2005-02-24 2008-07-15 International Business Machines Corporation Photoresist topcoat for a photolithographic process
EP1720072B1 (en) * 2005-05-01 2019-06-05 Rohm and Haas Electronic Materials, L.L.C. Compositons and processes for immersion lithography
JP4861767B2 (ja) * 2005-07-26 2012-01-25 富士フイルム株式会社 ポジ型レジスト組成物およびそれを用いたパターン形成方法
JP5002137B2 (ja) * 2005-07-28 2012-08-15 富士フイルム株式会社 化学増幅型レジスト組成物及びその製造方法
US20070092829A1 (en) * 2005-10-21 2007-04-26 Christoph Noelscher Photosensitive coating for enhancing a contrast of a photolithographic exposure
TWI347495B (en) * 2006-01-08 2011-08-21 Rohm & Haas Elect Mat Coating compositions for photoresists
JP4912733B2 (ja) * 2006-02-17 2012-04-11 東京応化工業株式会社 液浸露光用レジスト組成物およびレジストパターン形成方法
US7550249B2 (en) * 2006-03-10 2009-06-23 Az Electronic Materials Usa Corp. Base soluble polymers for photoresist compositions
US7799507B2 (en) * 2006-05-18 2010-09-21 Tokyo Ohka Co., Ltd. Positive resist composition for immersion lithography and method for forming resist pattern
JP2008053622A (ja) * 2006-08-28 2008-03-06 Nec Electronics Corp 液浸露光用液浸液
US7416834B2 (en) * 2006-09-27 2008-08-26 Az Electronic Materials Usa Corp. Antireflective coating compositions
US7759046B2 (en) 2006-12-20 2010-07-20 Az Electronic Materials Usa Corp. Antireflective coating compositions
JP4752794B2 (ja) * 2007-03-08 2011-08-17 Jsr株式会社 感放射線性樹脂組成物及び感放射線性樹脂組成物用重合体
US20090104373A1 (en) * 2007-10-23 2009-04-23 Xerox Corporation Methods for applying fluorescent ultraviolet curable varnishes
KR20090049862A (ko) * 2007-11-14 2009-05-19 주식회사 동진쎄미켐 감광성 화합물 및 이를 포함하는 포토레지스트 조성물
JP5398248B2 (ja) * 2008-02-06 2014-01-29 東京応化工業株式会社 液浸露光用レジスト組成物およびそれを用いたレジストパターン形成方法
KR101529940B1 (ko) * 2008-02-12 2015-06-19 한양대학교 산학협력단 플루오로알킬술폰늄염의 광산발생기가 측쇄에 도입된단량체 제조방법
JP5248138B2 (ja) * 2008-02-22 2013-07-31 株式会社クラレ 新規なアクリル酸エステル誘導体、およびその製造方法
JP5548406B2 (ja) 2008-08-22 2014-07-16 東京応化工業株式会社 ポジ型レジスト組成物、レジストパターン形成方法、高分子化合物
JP5337576B2 (ja) * 2008-10-07 2013-11-06 東京応化工業株式会社 ポジ型レジスト組成物およびレジストパターン形成方法
EP2189846B1 (en) * 2008-11-19 2015-04-22 Rohm and Haas Electronic Materials LLC Process for photolithography applying a photoresist composition comprising a block copolymer
EP2189847A3 (en) * 2008-11-19 2010-07-21 Rohm and Haas Electronic Materials LLC Compositions comprising hetero-substituted carbocyclic aryl component and processes for photolithography
JP5337579B2 (ja) * 2008-12-04 2013-11-06 東京応化工業株式会社 ポジ型レジスト組成物、レジストパターン形成方法
JP5232663B2 (ja) * 2009-01-14 2013-07-10 東京応化工業株式会社 レジスト組成物、レジストパターン形成方法、高分子化合物及び化合物
JP5232675B2 (ja) * 2009-01-26 2013-07-10 東京応化工業株式会社 ポジ型レジスト組成物及びそれを用いたレジストパターン形成方法、並びに高分子化合物
JP5308871B2 (ja) * 2009-03-06 2013-10-09 東京応化工業株式会社 レジスト組成物、レジストパターン形成方法
JP5292133B2 (ja) * 2009-03-09 2013-09-18 東京応化工業株式会社 ポジ型レジスト組成物及びレジストパターン形成方法
JP5308874B2 (ja) * 2009-03-09 2013-10-09 東京応化工業株式会社 ポジ型レジスト組成物、レジストパターン形成方法、高分子化合物、化合物
JP5308877B2 (ja) * 2009-03-10 2013-10-09 東京応化工業株式会社 ポジ型レジスト組成物、レジストパターン形成方法
JP5308876B2 (ja) * 2009-03-10 2013-10-09 東京応化工業株式会社 ポジ型レジスト組成物、レジストパターン形成方法
JP5346627B2 (ja) * 2009-03-10 2013-11-20 東京応化工業株式会社 ポジ型レジスト組成物及びレジストパターン形成方法
JP5264575B2 (ja) 2009-03-11 2013-08-14 東京応化工業株式会社 ポジ型レジスト組成物およびレジストパターン形成方法
JP5520515B2 (ja) * 2009-04-15 2014-06-11 東京応化工業株式会社 ポジ型レジスト組成物およびレジストパターン形成方法
JP5386236B2 (ja) * 2009-06-01 2014-01-15 東京応化工業株式会社 ポジ型レジスト組成物及びレジストパターン形成方法
JP5568258B2 (ja) 2009-07-03 2014-08-06 東京応化工業株式会社 ポジ型レジスト組成物およびそれを用いたレジストパターン形成方法、並びに含フッ素高分子化合物
JP5516195B2 (ja) 2009-08-04 2014-06-11 信越化学工業株式会社 パターン形成方法及びレジスト材料
JP5470053B2 (ja) * 2010-01-05 2014-04-16 東京応化工業株式会社 ポジ型レジスト組成物、レジストパターン形成方法
JP5496715B2 (ja) * 2010-03-10 2014-05-21 株式会社クラレ アクリル酸エステル誘導体、高分子化合物およびフォトレジスト組成物
JP5655579B2 (ja) * 2011-01-17 2015-01-21 Jsr株式会社 感放射線性樹脂組成物、パターン形成方法、重合体及び化合物
JP4945688B2 (ja) * 2011-02-07 2012-06-06 富士フイルム株式会社 化学増幅型レジスト組成物及びその製造方法
KR101855507B1 (ko) 2011-07-11 2018-05-08 주식회사 동진쎄미켐 네가티브 톤 현상액으로 현상된 포토레지스트 패턴 코팅용 조성물 및 이를 이용한 미세패턴 형성 방법
JP6002378B2 (ja) 2011-11-24 2016-10-05 東京応化工業株式会社 高分子化合物の製造方法
JP5820719B2 (ja) 2011-12-21 2015-11-24 東京応化工業株式会社 レジストパターン形成方法
US8795947B2 (en) 2012-03-22 2014-08-05 Tokyo Ohka Kogyo Co., Ltd. Resist composition and method of forming resist pattern
US8795948B2 (en) 2012-03-22 2014-08-05 Tokyo Ohka Kogyo Co., Ltd. Resist composition, method of forming resist pattern and polymeric compound
PL3349290T3 (pl) * 2015-09-09 2024-04-02 Sumitomo Seika Chemicals Co., Ltd. Dodatek dla niewodnych roztworów elektrolitów, niewodny roztwór elektrolitu i urządzenie do magazynowania energii elektrycznej
JP7546353B2 (ja) * 2019-12-11 2024-09-06 東京応化工業株式会社 レジスト組成物及びレジストパターン形成方法
JP7718088B2 (ja) * 2021-03-31 2025-08-05 三菱ケミカル株式会社 3-(メタ)アクリロイルスルホランの製造方法
US20240241440A1 (en) * 2022-12-28 2024-07-18 Rohm And Haas Electronic Materials Llc Polymer, photoresist compositions including the same, and pattern formation methods

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4491628A (en) 1982-08-23 1985-01-01 International Business Machines Corporation Positive- and negative-working resist compositions with acid generating photoinitiator and polymer with acid labile groups pendant from polymer backbone
EP0440374B1 (en) 1990-01-30 1997-04-16 Wako Pure Chemical Industries Ltd Chemical amplified resist material
US5843624A (en) 1996-03-08 1998-12-01 Lucent Technologies Inc. Energy-sensitive resist material and a process for device fabrication using an energy-sensitive resist material
JP3995369B2 (ja) * 1998-12-07 2007-10-24 富士フイルム株式会社 ポジ型フォトレジスト組成物
JP3865863B2 (ja) * 1997-05-06 2007-01-10 富士フイルムホールディングス株式会社 遠紫外線露光用ポジ型フォトレジスト組成物
TW526390B (en) 1997-06-26 2003-04-01 Shinetsu Chemical Co Resist compositions
EP1143299B1 (en) 2000-04-04 2003-07-16 Sumitomo Chemical Company, Limited Chemically amplified positive resist composition
US6447980B1 (en) 2000-07-19 2002-09-10 Clariant Finance (Bvi) Limited Photoresist composition for deep UV and process thereof
JP2002202606A (ja) * 2000-12-28 2002-07-19 Fuji Photo Film Co Ltd 遠紫外線露光用ポジ型フォトレジスト組成物
TWI264442B (en) * 2002-03-25 2006-10-21 Shinetsu Chemical Co Novel esters, polymers, resist compositions and patterning process
JP4038675B2 (ja) * 2002-03-26 2008-01-30 信越化学工業株式会社 高分子化合物、レジスト材料及びパターン形成方法
TWI304412B (en) * 2002-03-26 2008-12-21 Shinetsu Chemical Co Polymers, resist compositions andpatterning process
JP4178007B2 (ja) * 2002-07-31 2008-11-12 富士フイルム株式会社 ポジ型レジスト組成物
JP4007582B2 (ja) * 2002-04-26 2007-11-14 富士フイルム株式会社 ポジ型レジスト組成物
KR100955006B1 (ko) * 2002-04-26 2010-04-27 후지필름 가부시키가이샤 포지티브 레지스트 조성물
US6919161B2 (en) * 2002-07-02 2005-07-19 Shin-Etsu Chemical Co., Ltd. Silicon-containing polymer, resist composition and patterning process
JP4200368B2 (ja) * 2002-07-02 2008-12-24 信越化学工業株式会社 珪素含有高分子化合物、レジスト材料及びパターン形成方法
JP4025683B2 (ja) * 2003-05-09 2007-12-26 松下電器産業株式会社 パターン形成方法及び露光装置
JP2005049695A (ja) * 2003-07-30 2005-02-24 Fuji Photo Film Co Ltd ポジ型レジスト組成物
JP2005055697A (ja) * 2003-08-05 2005-03-03 Fuji Photo Film Co Ltd ポジ型レジスト組成物及びそれを用いたパターン形成方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113614073A (zh) * 2019-03-27 2021-11-05 三菱化学株式会社 聚合物、抗蚀剂组合物、形成有图案的基板的制造方法、以及(甲基)丙烯酸酯及其制造方法
US11845822B2 (en) 2019-03-27 2023-12-19 Mitsubishi Chemical Corporation Polymer, resist composition, method for manufacturing substrate having pattern formed therein, and (meth) acrylic ester and production method therefor
CN113614073B (zh) * 2019-03-27 2024-09-24 三菱化学株式会社 聚合物、抗蚀剂组合物、形成有图案的基板的制造方法、以及(甲基)丙烯酸酯及其制造方法
US12384863B2 (en) 2019-03-27 2025-08-12 Mitsubishi Chemical Corporation Polymer, resist composition, method for manufacturing substrate having pattern formed therein, and (meth)acrylic ester and production method therefor

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Publication number Publication date
KR20070089182A (ko) 2007-08-30
EP1828843A1 (en) 2007-09-05
US20060110677A1 (en) 2006-05-25
JP2008521039A (ja) 2008-06-19
TW200632554A (en) 2006-09-16
WO2006054173A1 (en) 2006-05-26
US7537879B2 (en) 2009-05-26

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