CN101034727B - 氮化物半导体发光器件 - Google Patents
氮化物半导体发光器件 Download PDFInfo
- Publication number
- CN101034727B CN101034727B CN200710085508.6A CN200710085508A CN101034727B CN 101034727 B CN101034727 B CN 101034727B CN 200710085508 A CN200710085508 A CN 200710085508A CN 101034727 B CN101034727 B CN 101034727B
- Authority
- CN
- China
- Prior art keywords
- nitride semiconductor
- thickness
- film
- light emitting
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/0014—Measuring characteristics or properties thereof
- H01S5/0021—Degradation or life time measurements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
- H01S5/0282—Passivation layers or treatments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
- H01S5/0287—Facet reflectivity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2206—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on III-V materials
- H01S5/221—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on III-V materials containing aluminium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/223—Buried stripe structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/223—Buried stripe structure
- H01S5/2231—Buried stripe structure with inner confining structure only between the active layer and the upper electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34333—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2304/00—Special growth methods for semiconductor lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Geometry (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Biophysics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006062636 | 2006-03-08 | ||
| JP2006062636 | 2006-03-08 | ||
| JP2006-062636 | 2006-03-08 | ||
| JP2007-017547 | 2007-01-29 | ||
| JP2007017547A JP5430826B2 (ja) | 2006-03-08 | 2007-01-29 | 窒化物半導体レーザ素子 |
| JP2007017547 | 2007-01-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101034727A CN101034727A (zh) | 2007-09-12 |
| CN101034727B true CN101034727B (zh) | 2014-01-29 |
Family
ID=38478031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710085508.6A Active CN101034727B (zh) | 2006-03-08 | 2007-03-07 | 氮化物半导体发光器件 |
Country Status (3)
| Country | Link |
|---|---|
| US (4) | US7792169B2 (https=) |
| JP (1) | JP5430826B2 (https=) |
| CN (1) | CN101034727B (https=) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007103814A (ja) * | 2005-10-07 | 2007-04-19 | Sharp Corp | 窒化物半導体発光素子およびその製造方法 |
| JP5191650B2 (ja) * | 2005-12-16 | 2013-05-08 | シャープ株式会社 | 窒化物半導体発光素子および窒化物半導体発光素子の製造方法 |
| KR100853241B1 (ko) * | 2005-12-16 | 2008-08-20 | 샤프 가부시키가이샤 | 질화물 반도체 발광소자 및 질화물 반도체 레이저 소자의제조방법 |
| JP5004597B2 (ja) * | 2006-03-06 | 2012-08-22 | シャープ株式会社 | 窒化物半導体発光素子および窒化物半導体発光素子の製造方法 |
| JP5430826B2 (ja) | 2006-03-08 | 2014-03-05 | シャープ株式会社 | 窒化物半導体レーザ素子 |
| JP4444304B2 (ja) * | 2006-04-24 | 2010-03-31 | シャープ株式会社 | 窒化物半導体発光素子および窒化物半導体発光素子の製造方法 |
| US7668218B2 (en) | 2007-02-20 | 2010-02-23 | Nichia Corporation | Nitride semiconductor laser element |
| US7701995B2 (en) | 2007-07-06 | 2010-04-20 | Nichia Corporation | Nitride semiconductor laser element |
| JP5014967B2 (ja) * | 2007-12-06 | 2012-08-29 | シャープ株式会社 | 発光素子及び発光素子の製造方法 |
| JP5183516B2 (ja) * | 2008-02-15 | 2013-04-17 | 三洋電機株式会社 | 半導体レーザ素子 |
| JP5093686B2 (ja) | 2008-08-27 | 2012-12-12 | 富士電機株式会社 | 磁気記録媒体用保護膜の形成方法 |
| JP2010146683A (ja) * | 2008-12-22 | 2010-07-01 | Fuji Electric Device Technology Co Ltd | 保護膜の形成方法、及び当該方法により得られた保護膜、並びに当該保護膜を含む磁気記録媒体 |
| KR20100122998A (ko) * | 2009-05-14 | 2010-11-24 | 엘지이노텍 주식회사 | 발광소자 및 그 제조방법 |
| US9800017B1 (en) | 2009-05-29 | 2017-10-24 | Soraa Laser Diode, Inc. | Laser device and method for a vehicle |
| US9250044B1 (en) * | 2009-05-29 | 2016-02-02 | Soraa Laser Diode, Inc. | Gallium and nitrogen containing laser diode dazzling devices and methods of use |
| JP4621791B2 (ja) * | 2009-06-11 | 2011-01-26 | シャープ株式会社 | 窒化物半導体レーザ素子 |
| JP2011060932A (ja) * | 2009-09-09 | 2011-03-24 | Panasonic Corp | 窒化物半導体発光装置 |
| KR101224282B1 (ko) * | 2011-03-04 | 2013-01-21 | 주식회사 엘지화학 | 전도성 구조체 및 이의 제조방법 |
| CN102828149A (zh) * | 2011-06-13 | 2012-12-19 | 鸿富锦精密工业(深圳)有限公司 | 镀膜件及其制造方法 |
| US11437774B2 (en) | 2015-08-19 | 2022-09-06 | Kyocera Sld Laser, Inc. | High-luminous flux laser-based white light source |
| DE102015116335B4 (de) * | 2015-09-28 | 2024-10-24 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterlaser |
| US10714900B2 (en) | 2018-06-04 | 2020-07-14 | Ii-Vi Delaware, Inc. | Ex-situ conditioning of laser facets and passivated devices formed using the same |
| US11239637B2 (en) | 2018-12-21 | 2022-02-01 | Kyocera Sld Laser, Inc. | Fiber delivered laser induced white light system |
| US11421843B2 (en) | 2018-12-21 | 2022-08-23 | Kyocera Sld Laser, Inc. | Fiber-delivered laser-induced dynamic light system |
| US12152742B2 (en) | 2019-01-18 | 2024-11-26 | Kyocera Sld Laser, Inc. | Laser-based light guide-coupled wide-spectrum light system |
| US12000552B2 (en) | 2019-01-18 | 2024-06-04 | Kyocera Sld Laser, Inc. | Laser-based fiber-coupled white light system for a vehicle |
| US11884202B2 (en) | 2019-01-18 | 2024-01-30 | Kyocera Sld Laser, Inc. | Laser-based fiber-coupled white light system |
| CN112151651A (zh) * | 2020-08-21 | 2020-12-29 | 华灿光电(苏州)有限公司 | 紫外发光二极管外延片及其制备方法 |
| CN116247512B (zh) * | 2023-03-31 | 2025-08-29 | 中国科学院半导体研究所 | 光子晶体激光器 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002100830A (ja) * | 2000-07-18 | 2002-04-05 | Nichia Chem Ind Ltd | 窒化ガリウム系発光素子 |
Family Cites Families (55)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US14323A (en) * | 1856-02-26 | Improved mode of constructing walls and floors of cellars | ||
| JP2884603B2 (ja) | 1989-07-17 | 1999-04-19 | 住友電気工業株式会社 | 半導体レーザ素子 |
| JPH03142892A (ja) | 1989-10-27 | 1991-06-18 | Sharp Corp | 半導体レーザ素子 |
| US5196958A (en) * | 1989-10-31 | 1993-03-23 | U.S. Philips Corporation | Optical amplifier having gain at two separated wavelengths |
| JP2743106B2 (ja) * | 1990-01-12 | 1998-04-22 | アルプス電気株式会社 | 半導体レーザ |
| US5231062A (en) * | 1990-08-09 | 1993-07-27 | Minnesota Mining And Manufacturing Company | Transparent aluminum oxynitride-based ceramic article |
| JPH06291422A (ja) * | 1993-04-02 | 1994-10-18 | Canon Inc | 光半導体素子 |
| JP3184031B2 (ja) * | 1993-08-25 | 2001-07-09 | 富士通株式会社 | 光半導体素子装置及び光半導体装置の製造方法 |
| JPH07312459A (ja) | 1994-05-16 | 1995-11-28 | Canon Inc | 光半導体素子 |
| JP3209895B2 (ja) | 1995-09-08 | 2001-09-17 | 新日本製鐵株式会社 | 大径回転体の気密装置 |
| JPH09194204A (ja) | 1995-11-16 | 1997-07-29 | Matsushita Electric Ind Co Ltd | 窒化アルミニウムの製造方法および半導体発光素子 |
| JPH09162496A (ja) | 1995-12-12 | 1997-06-20 | Nippon Telegr & Teleph Corp <Ntt> | 半導体レーザ及びその製造方法 |
| JP3774503B2 (ja) * | 1996-04-17 | 2006-05-17 | 日本オプネクスト株式会社 | 半導体レーザ素子およびその製造方法 |
| US5741724A (en) * | 1996-12-27 | 1998-04-21 | Motorola | Method of growing gallium nitride on a spinel substrate |
| US6486068B2 (en) * | 1998-01-08 | 2002-11-26 | Toyoda Gosei Co., Ltd. | Method for manufacturing group III nitride compound semiconductor laser diodes |
| JP2971435B2 (ja) * | 1998-03-30 | 1999-11-08 | 東芝電子エンジニアリング株式会社 | 半導体レーザおよびその製造方法 |
| US6249534B1 (en) * | 1998-04-06 | 2001-06-19 | Matsushita Electronics Corporation | Nitride semiconductor laser device |
| JP3430036B2 (ja) | 1998-10-29 | 2003-07-28 | 松下電器産業株式会社 | 薄膜の形成方法及び半導体発光素子の製造方法 |
| US6693935B2 (en) * | 2000-06-20 | 2004-02-17 | Sony Corporation | Semiconductor laser |
| KR100550158B1 (ko) * | 2000-09-21 | 2006-02-08 | 샤프 가부시키가이샤 | 질화물 반도체 발광소자 및 그것을 포함한 광학장치 |
| US7053413B2 (en) | 2000-10-23 | 2006-05-30 | General Electric Company | Homoepitaxial gallium-nitride-based light emitting device and method for producing |
| JP2002237648A (ja) | 2001-02-13 | 2002-08-23 | Fuji Photo Film Co Ltd | 半導体レーザ素子 |
| JP4977931B2 (ja) | 2001-03-06 | 2012-07-18 | ソニー株式会社 | GaN系半導体レーザの製造方法 |
| JP3849758B2 (ja) * | 2001-04-12 | 2006-11-22 | ソニー株式会社 | 半導体レーザ素子 |
| ATE487255T1 (de) | 2001-05-31 | 2010-11-15 | Nichia Corp | Halbleiterlaserelement |
| JP2003017745A (ja) | 2001-06-29 | 2003-01-17 | Shiro Sakai | 窒化ガリウム系発光素子 |
| US7501023B2 (en) * | 2001-07-06 | 2009-03-10 | Technologies And Devices, International, Inc. | Method and apparatus for fabricating crack-free Group III nitride semiconductor materials |
| US7067849B2 (en) * | 2001-07-17 | 2006-06-27 | Lg Electronics Inc. | Diode having high brightness and method thereof |
| US6812152B2 (en) | 2001-08-09 | 2004-11-02 | Comlase Ab | Method to obtain contamination free laser mirrors and passivation of these |
| JP2003078199A (ja) * | 2001-09-03 | 2003-03-14 | Fuji Photo Film Co Ltd | 半導体レーザ装置 |
| JP2003101126A (ja) * | 2001-09-27 | 2003-04-04 | Mitsubishi Electric Corp | 半導体レーザ装置の製造方法及び半導体レーザ装置 |
| PL374180A1 (en) * | 2001-10-26 | 2005-10-03 | Ammono Sp.Z O.O. | Nitride semiconductor laser element, and production method therefor |
| JP4236840B2 (ja) * | 2001-12-25 | 2009-03-11 | 富士フイルム株式会社 | 半導体レーザ素子 |
| JP2003332688A (ja) * | 2002-03-08 | 2003-11-21 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体レーザ |
| JP3856300B2 (ja) * | 2002-03-11 | 2006-12-13 | ソニー株式会社 | 半導体レーザ素子 |
| US6744076B2 (en) * | 2002-03-14 | 2004-06-01 | The Circle For The Promotion Of Science And Engineering | Single crystalline aluminum nitride film, method of forming the same, base substrate for group III element nitride film, light emitting device and surface acoustic wave device |
| CN1287684C (zh) | 2002-12-03 | 2006-12-06 | 黄德福 | 芝麻酱干 |
| JP4097552B2 (ja) * | 2003-03-27 | 2008-06-11 | 三菱電機株式会社 | 半導体レーザ装置 |
| JP2004327581A (ja) * | 2003-04-23 | 2004-11-18 | Mitsubishi Electric Corp | 半導体レーザ装置 |
| JP2005079406A (ja) * | 2003-09-01 | 2005-03-24 | Matsushita Electric Ind Co Ltd | 半導体レーザの製造方法 |
| US7118813B2 (en) * | 2003-11-14 | 2006-10-10 | Cree, Inc. | Vicinal gallium nitride substrate for high quality homoepitaxy |
| JP2005175111A (ja) * | 2003-12-10 | 2005-06-30 | Hitachi Ltd | 半導体レーザ及びその製造方法 |
| US7356060B2 (en) * | 2004-03-15 | 2008-04-08 | Matsushita Electric Industrial Co., Ltd. | Semiconductor laser device and method for fabricating the same |
| JP2005340625A (ja) | 2004-05-28 | 2005-12-08 | Nichia Chem Ind Ltd | 窒化物半導体レーザ素子 |
| JP2006128475A (ja) * | 2004-10-29 | 2006-05-18 | Mitsubishi Electric Corp | 半導体レーザ |
| JP4451371B2 (ja) * | 2004-12-20 | 2010-04-14 | シャープ株式会社 | 窒化物半導体レーザ素子 |
| JP5285835B2 (ja) | 2005-07-13 | 2013-09-11 | 株式会社東芝 | 半導体素子およびその製造方法 |
| JP2007095758A (ja) * | 2005-09-27 | 2007-04-12 | Matsushita Electric Ind Co Ltd | 半導体レーザ |
| TW200717843A (en) * | 2005-10-19 | 2007-05-01 | Epistar Corp | Light-emitting element with high-light-extracting-efficiency |
| KR100853241B1 (ko) * | 2005-12-16 | 2008-08-20 | 샤프 가부시키가이샤 | 질화물 반도체 발광소자 및 질화물 반도체 레이저 소자의제조방법 |
| JP4776514B2 (ja) * | 2005-12-16 | 2011-09-21 | シャープ株式会社 | 窒化物半導体レーザ素子 |
| JP2007201373A (ja) | 2006-01-30 | 2007-08-09 | Sharp Corp | 半導体レーザ素子 |
| JP5004597B2 (ja) * | 2006-03-06 | 2012-08-22 | シャープ株式会社 | 窒化物半導体発光素子および窒化物半導体発光素子の製造方法 |
| JP5430826B2 (ja) * | 2006-03-08 | 2014-03-05 | シャープ株式会社 | 窒化物半導体レーザ素子 |
| JP4444304B2 (ja) * | 2006-04-24 | 2010-03-31 | シャープ株式会社 | 窒化物半導体発光素子および窒化物半導体発光素子の製造方法 |
-
2007
- 2007-01-29 JP JP2007017547A patent/JP5430826B2/ja active Active
- 2007-03-05 US US11/713,760 patent/US7792169B2/en active Active
- 2007-03-07 CN CN200710085508.6A patent/CN101034727B/zh active Active
-
2010
- 2010-08-11 US US12/805,644 patent/US9190806B2/en active Active
-
2015
- 2015-10-13 US US14/881,523 patent/US9660413B2/en active Active
-
2017
- 2017-05-01 US US15/583,176 patent/US20170237230A1/en not_active Abandoned
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002100830A (ja) * | 2000-07-18 | 2002-04-05 | Nichia Chem Ind Ltd | 窒化ガリウム系発光素子 |
Also Published As
| Publication number | Publication date |
|---|---|
| US9660413B2 (en) | 2017-05-23 |
| US20160036197A1 (en) | 2016-02-04 |
| US7792169B2 (en) | 2010-09-07 |
| US9190806B2 (en) | 2015-11-17 |
| US20170237230A1 (en) | 2017-08-17 |
| US20070210324A1 (en) | 2007-09-13 |
| CN101034727A (zh) | 2007-09-12 |
| JP2007273953A (ja) | 2007-10-18 |
| US20100308360A1 (en) | 2010-12-09 |
| JP5430826B2 (ja) | 2014-03-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101034727B (zh) | 氮化物半导体发光器件 | |
| JP5191650B2 (ja) | 窒化物半導体発光素子および窒化物半導体発光素子の製造方法 | |
| CN101794965B (zh) | 氮化物半导体发光元件以及氮化物半导体发光元件的制造方法 | |
| JP2007103814A (ja) | 窒化物半導体発光素子およびその製造方法 | |
| CN102170090A (zh) | 氮化物半导体发光元件 | |
| US20110057220A1 (en) | Nitride semiconductor light-emitting device | |
| JP4776514B2 (ja) | 窒化物半導体レーザ素子 | |
| US8541796B2 (en) | Nitride semiconductor light emitting device and method of fabricating nitride semiconductor laser device | |
| JP4860210B2 (ja) | 窒化物半導体レーザ素子およびその製造方法 | |
| JP5431441B2 (ja) | 窒化物半導体発光素子 | |
| JP4799339B2 (ja) | 窒化物半導体発光素子 | |
| CN100592583C (zh) | 氮化物半导体发光元件以及氮化物半导体发光元件的制造方法 | |
| JP2007150004A (ja) | 窒化物半導体レーザ素子の製造方法 | |
| JP5766659B2 (ja) | 窒化物半導体発光素子 | |
| JP2012227239A (ja) | 半導体レーザ素子 | |
| JP2007173581A (ja) | 窒化物半導体レーザ素子の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Open date: 20070912 |
|
| CI01 | Publication of corrected invention patent application |
Correction item: Rejection of patent application Correct: Dismiss False: Reject Number: 32 Volume: 26 |
|
| ERR | Gazette correction |
Free format text: CORRECT: PATENT APPLICATION REJECTION AFTER THE ANNOUNCEMENT; FROM: REJECTION TO: CANCEL REJECTION |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220318 Address after: Asahi 1, Damen Machi, Fukuyama, Hiroshima, Japan Patentee after: Sharp Fukuyama laser Co.,Ltd. Address before: Osaka, Japan Patentee before: Sharp Corp. |