CN101023509A - 基片处理系统 - Google Patents
基片处理系统 Download PDFInfo
- Publication number
- CN101023509A CN101023509A CNA2005800306020A CN200580030602A CN101023509A CN 101023509 A CN101023509 A CN 101023509A CN A2005800306020 A CNA2005800306020 A CN A2005800306020A CN 200580030602 A CN200580030602 A CN 200580030602A CN 101023509 A CN101023509 A CN 101023509A
- Authority
- CN
- China
- Prior art keywords
- carrier
- substrate
- handling system
- roller
- described substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Non-Mechanical Conveyors (AREA)
- Linear Motors (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US60920704P | 2004-09-10 | 2004-09-10 | |
US60/609,207 | 2004-09-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101023509A true CN101023509A (zh) | 2007-08-22 |
CN100550286C CN100550286C (zh) | 2009-10-14 |
Family
ID=35124526
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005800306020A Expired - Fee Related CN100550286C (zh) | 2004-09-10 | 2005-09-07 | 基片处理系统 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20060054495A1 (zh) |
EP (1) | EP1792331A1 (zh) |
JP (1) | JP2008512810A (zh) |
KR (1) | KR20070101232A (zh) |
CN (1) | CN100550286C (zh) |
TW (1) | TW200623214A (zh) |
WO (1) | WO2006026886A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101483145B (zh) * | 2007-11-12 | 2012-09-26 | 因特瓦克公司 | 升降机线性马达驱动 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0419269D0 (en) * | 2004-08-31 | 2004-09-29 | Elam T Ltd | Electroluminescent materials and devices |
WO2009053435A1 (en) * | 2007-10-24 | 2009-04-30 | Oc Oerlikon Balzers Ag | Method for manufacturing workpieces and apparatus |
JP5318434B2 (ja) * | 2008-02-28 | 2013-10-16 | 昭和電工株式会社 | 磁気記録媒体の製造装置および製造方法 |
JP5248141B2 (ja) * | 2008-02-27 | 2013-07-31 | 昭和電工株式会社 | 磁気記録媒体の製造装置および製造方法 |
US20110014363A1 (en) * | 2008-02-27 | 2011-01-20 | Showa Denko K.K. | Apparatus and method for manufacturing magnetic recording medium |
JP5150387B2 (ja) * | 2008-06-27 | 2013-02-20 | 昭和電工株式会社 | インライン式成膜装置及び磁気記録媒体の製造方法 |
JP5264549B2 (ja) * | 2009-02-20 | 2013-08-14 | 昭和電工株式会社 | インライン式成膜装置及び磁気記録媒体の製造方法 |
US8911554B2 (en) | 2010-01-05 | 2014-12-16 | Applied Materials, Inc. | System for batch processing of magnetic media |
CN104471697B (zh) | 2011-12-27 | 2018-03-16 | 因特瓦克公司 | 用于组合式静态和经过处理的系统体系结构 |
JP2013175277A (ja) * | 2013-05-27 | 2013-09-05 | Showa Denko Kk | 磁気記録媒体の製造装置および製造方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6115557A (ja) * | 1984-06-30 | 1986-01-23 | Toshiba Corp | 浮上式搬送装置 |
US4670126A (en) * | 1986-04-28 | 1987-06-02 | Varian Associates, Inc. | Sputter module for modular wafer processing system |
US4717461A (en) * | 1986-09-15 | 1988-01-05 | Machine Technology, Inc. | System and method for processing workpieces |
US5170714A (en) * | 1988-06-13 | 1992-12-15 | Asahi Glass Company, Ltd. | Vacuum processing apparatus and transportation system thereof |
DE4029905C2 (de) * | 1990-09-21 | 1993-10-28 | Leybold Ag | Vorrichtung für den Transport von Substraten |
US5215420A (en) * | 1991-09-20 | 1993-06-01 | Intevac, Inc. | Substrate handling and processing system |
US5275709A (en) * | 1991-11-07 | 1994-01-04 | Leybold Aktiengesellschaft | Apparatus for coating substrates, preferably flat, more or less plate-like substrates |
DE9407482U1 (de) * | 1994-05-05 | 1994-10-06 | Balzers und Leybold Deutschland Holding AG, 63450 Hanau | Funktionseinrichtung für eine Vakuumanlage für die Behandlung von scheibenförmigen Werkstücken |
US5543022A (en) * | 1995-01-17 | 1996-08-06 | Hmt Technology Corporation | Disc-handling apparatus |
JP3732250B2 (ja) * | 1995-03-30 | 2006-01-05 | キヤノンアネルバ株式会社 | インライン式成膜装置 |
US5705044A (en) * | 1995-08-07 | 1998-01-06 | Akashic Memories Corporation | Modular sputtering machine having batch processing and serial thin film sputtering |
US5879128A (en) * | 1996-07-24 | 1999-03-09 | Applied Materials, Inc. | Lift pin and support pin apparatus for a processing chamber |
US6053687A (en) * | 1997-09-05 | 2000-04-25 | Applied Materials, Inc. | Cost effective modular-linear wafer processing |
US6206176B1 (en) * | 1998-05-20 | 2001-03-27 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle having a magnetic drive |
US6083566A (en) * | 1998-05-26 | 2000-07-04 | Whitesell; Andrew B. | Substrate handling and processing system and method |
US6919001B2 (en) * | 2000-05-01 | 2005-07-19 | Intevac, Inc. | Disk coating system |
JP2002068476A (ja) * | 2000-08-29 | 2002-03-08 | Anelva Corp | 磁気搬送装置 |
US6520315B1 (en) * | 2000-10-26 | 2003-02-18 | Applied Materials, Inc. | Gripper assembly |
-
2005
- 2005-09-07 JP JP2007530570A patent/JP2008512810A/ja not_active Withdrawn
- 2005-09-07 WO PCT/CH2005/000534 patent/WO2006026886A1/en active Application Filing
- 2005-09-07 EP EP05775652A patent/EP1792331A1/en not_active Withdrawn
- 2005-09-07 CN CNB2005800306020A patent/CN100550286C/zh not_active Expired - Fee Related
- 2005-09-07 KR KR1020077008064A patent/KR20070101232A/ko not_active Application Discontinuation
- 2005-09-08 US US11/222,270 patent/US20060054495A1/en not_active Abandoned
- 2005-09-09 TW TW094131069A patent/TW200623214A/zh unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101483145B (zh) * | 2007-11-12 | 2012-09-26 | 因特瓦克公司 | 升降机线性马达驱动 |
US9633880B2 (en) | 2007-11-12 | 2017-04-25 | Intevac, Inc. | Elevator linear motor drive |
Also Published As
Publication number | Publication date |
---|---|
JP2008512810A (ja) | 2008-04-24 |
EP1792331A1 (en) | 2007-06-06 |
CN100550286C (zh) | 2009-10-14 |
KR20070101232A (ko) | 2007-10-16 |
WO2006026886A1 (en) | 2006-03-16 |
TW200623214A (en) | 2006-07-01 |
US20060054495A1 (en) | 2006-03-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: YINGTEWANKE COMPANY Free format text: FORMER OWNER: OC OERLIKON BALZERS AG Effective date: 20100129 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20100129 Address after: American California Patentee after: Intervacc AB Address before: Liechtenstein Barr Che J Patentee before: OC Oerlikon Balzers AG |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091014 Termination date: 20140907 |
|
EXPY | Termination of patent right or utility model |