CN101023509A - 基片处理系统 - Google Patents

基片处理系统 Download PDF

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CN101023509A
CN101023509A CNA2005800306020A CN200580030602A CN101023509A CN 101023509 A CN101023509 A CN 101023509A CN A2005800306020 A CNA2005800306020 A CN A2005800306020A CN 200580030602 A CN200580030602 A CN 200580030602A CN 101023509 A CN101023509 A CN 101023509A
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substrate
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H·罗尔曼
O·拉图恩德
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Abstract

在一种用于在真空中处理基片的基片处理系统中,由处理模块构成的两个直线组件一个堆叠在另一个上面,并通过至少一个提升模块来连接,该提升模块能够用于从第一组向第二组进行输送。沿穿过第一组和第二组处理模块的运行路径布置有直线同步马达。具有导轨(该导轨与安装在处理系统中的辊相互作用)的基片载体通过所述直线同步马达的吸引力而保持在竖向位置。

Description

基片处理系统
技术领域
本发明涉及一种用于处理和制造基片(如盘形信息载体,特别是硬磁盘)的系统或方法。特别是,本发明涉及一种借助于磁性保持和驱动装置而在真空中输送基片的输送装置。
背景技术
为了在真空中处理基片(例如涂覆多个层),一种公知原理是将基片输送通过成直线排列的一组真空处理腔室。术语“真空腔室”的意思是至少一部分真空处理系统处在与大气压力相比是降低的压力下。术语“处理腔室”或“处理模块”的意思是一部分处理系统,其用于改变基片的物理或化学状态,例如加热、冷却、清洁、蚀刻、用气体或其它物质来处理、涂覆等。
US 5658114表示了一种用于例如盘形基片的真空处理系统,其中,第二层处理站以堆叠关系布置在第一层处理站上方。工件被送到一层的这一排处理站中并位于载体上,且工件在一排末尾处被提升至另一层,然后移动通过另一排处理站,从而使得该载体能够以U形路径通过该装置。或者也可选择,通过使两排处理站并排布置而可以实现“竖向U形”或“水平U形”。这些处理站中可以包括涂覆站、加热和/或冷却站、装载和卸载锁。
这种随后进行的直线处理的基本问题是从一个腔室至另一腔室的适应于真空的输送。该基片通常由载体保持。在简单方式中,载体布置在一系列机械驱动辊上。在大气中的马达单元通过真空馈送通道或通过磁耦合而与真空中的辊连接。在载体导轨和辊之间只有摩擦力来产生作用在载体上的加速力和减速力。这导致对载体最大加速是非常有限的并导致较长的输送时间。另外,这些驱动辊的摩擦力在真空腔室中产生颗粒。因此,导轨作用在辊上的负载(通常只由重力给出)有时通过磁力来增强。这使得摩擦问题、加速度限制和颗粒产生变得更严重。US 6919001表示了这种盘形涂覆系统。
用于该输送的另一方法是通过使磁体在腔室外部在大气中沿输送路径进行机械移动而拉动在真空腔室中的载体。这省略了真空馈送通道,并能够增大作用在载体上的加速力,但是需要一种由磁体覆盖的旋转磁化双螺旋杆或带的复杂机构。而且,对该载体的精确定位变得复杂。对该机器的控制必须克服磁力的反冲和磁滞。
发明内容
本发明的解决方案是要使用直线同步马达,其基于定子的线圈、磁体和轭铁的混合布局以及该从动载体的磁阻原理(没有永磁体)。在权利要求1中介绍了包括本发明的系统,而在权利要求12中介绍了用于制造硬磁盘的方法。在各从属权利要求中可以发现其它有利实施例。
附图说明
图1表示了用于在真空中直线驱动的基片载体。
图2表示了具有堆叠的两排处理站的真空涂覆装置,在两个端部处通过提升模块连接。左侧提升模块和第一处理腔室表示为打开状态。
图3表示了用于将基片载体从一排提升/降低至另一排的提升模块。
具体实施方式
在第一优选实施例中,该输送系统依靠固定在载体(2)上的导轨(3、5)以及安装在真空腔室(7)中的辊(4、6)(例如沿侧向布置在侧壁处)。该载体定位在竖向方向上,且在它上面只有导轨而没有辊,它具有非常细长的横截面。这允许在各处理腔室之间有狭窄输送狭槽来用于小于20mm冲程的快速作用闸阀。该直线马达的吸引力将该载体的导轨(3、5)压在该辊(4、6)上。在该腔室中的下排辊(3)具有“哥特弧(gothic arc)”(凹形)横截面。圆形形状的相邻导轨(4)装配在该哥特弧中,并提供了对该载体的竖向定位。上排辊(5)具有稍微凸起的形状,且该相邻导轨(6)为矩形。这提供了对该载体的精确竖向定向。
在另一实施例中,该载体可装备有辊,该辊与固定安装在该真空腔室中的导轨相互作用。辊和导轨的设计可以类似,且能够如上所述那样使用该保持和移动机构。这样,在只有几个载体的扩展基片处理系统中,可以减少这些辊中的真空轴承的数目。
该直线马达的定子部分(具有轭铁(8)、磁体(9)和线圈(10))安装在大气中并处于不锈钢槽(11)内,该不锈钢槽布置成与该载体(2)有几毫米距离,并提供真空隔断。根据上述实施例,该槽优选是布置在该处理腔室的侧壁处或形成为该处理腔室侧壁的一部分。该槽的壁材料(例如不锈钢)具有低的电导率,其在该同步马达的更高工作频率和速度下具有较低的涡电流。该载体(2)以与这些定子柱(8)的周期性相适合的间隔装备有铁磁材料件(12)。由该定子产生的漂移(wandering)场吸引该载体的铁磁材料部件,并提供加速力和减速力。在各处理模块之间的闸阀附近有一段行进长度没有定子柱。为了在任意位置都有驱动力,该载体装备有两个铁磁材料部件,这两个铁磁材料部件的距离大于沿该行进路径没有定子柱的长度。
上述优选实施例有以下优点:
较高加速力:所示加速度高达3g,在各处理位置之间的输送时间小于0.25秒。通过电子控制和电磁力能够快速和精确地定位,在驱动单元中没有机械移动部分,且不必布置进入该真空腔室的馈送通道。在大气中的磁场穿透非磁性腔室壁,从而在真空内产生力。
该驱动装置能够不在该载体上安装永磁体。这使得很容易搬运和清洁载体,且在它们之间没有吸引力。
当断电时载体不会跌落或基片不会跌落。引入直线驱动装置的定子中的永磁体在没有线圈电流的情况下使载体保持就位。而且,能够很容易实现对所有载体的同步输送和/或对子组处理模块中的独立载体的输送。因此,载体能够在各处理模块中独立定位。
在还一实施例中,所述方案原则上可以布置在该处理腔室的底部,其中,导轨/辊布置在水平平面中。不过,为了避免导轨/辊上的基片载体倾斜,导轨必须以一定距离布置。隔离该处理腔室的闸阀必须使得有足够空间用于该更宽的载体。
该载体在该真空装置中进行往返运行,且该基片从清洁室至真空的装载/卸载将在单个模块或相邻模块中在该装置的端部位置处进行。为了使基片载体从一个直线排的处理模块移动至另一直线排,还需要另一真空输送机构。现有方案通常使用机械驱动滑架。这导致较高质量和较大数目的运动部件,并引起速度限制和产生颗粒的危险。
在本发明的方案中,两排(15、16)处理模块(14)(一排堆叠在另一排上面)在端部处通过提升模块(17、18)来连接。在这些提升模块中,只有通过上述直线驱动装置传送的载体(2)被从一排的辊路径中取出,然后被布置在另一排的辊路径上。
在该提升模块(17、18)中进行的竖向输送由旋转直接驱动马达(19)来驱动。该马达使得与提升夹持器盒(21)连接的杠杆(20)旋转。在旋转过程中,总是提供了该夹持器盒沿竖向方向的运动。该夹持器盒(21)包括对该载体中的铁磁材料件(12)产生吸引力的磁体/轭铁阵列(22)以及对该直线驱动装置的定子柱(8)产生排斥力的类似磁体/轭铁阵列(23)。该吸引和排斥阵列(22、23)包括由磁体(24)和轭铁(25)构成的组件。
当该直线驱动装置使该载体就位时,开始将载体从一个输送路线向另一输送路线传送。通过马达(19)的旋转,该提升夹持器盒(21)接近该载体。该磁体阵列(22)作用在该载体中的铁磁材料件(12)上的吸引力被该磁体阵列(23)的排斥力过度补偿。流过邻近于该磁体阵列(23)的线圈(10)的电流能够调节该力。固定在该提升夹持器盒上的氟橡胶环(或其它弹性体环)这时平滑地安置在该载体中的适当深度中。这使得该载体良好定位在该提升夹持器上,且没有金属接触。通过在紧邻铁磁材料件(12)的线圈(10)上施加合适电流,将该载体从该直线驱动装置的定子上释放。通过阵列(22)的磁力而固定至该提升夹持器上的载体垂直于导轨(3、5)的所在平面而离开该辊路径。
或者也可选择,能将一分流板从该直线马达的背面(与提升夹持器相反)接近。该分流板可以包括铁磁轭铁材料(例如Fe)。因此,磁场线偏离该直线马达而进入该板中,从而削弱吸引该载体的场。在还一实施例中,该分流板包括轭铁材料和永磁体。这样,甚至在并不由铁磁材料件(12)覆盖的区域中,也可以对该直线马达的磁场进行过度补偿,并在该直线马达和载体之间获得净排斥力,这两者均能非常好地控制从该直线驱动装置的定子上释放该载体。
参考图3,马达(19)旋转180度将该载体提升至另一输送路线。向辊(4、6)的轻柔接近通过对所要接近的定子中的线圈(10)进行合适的电流控制来提供。作用在铁磁材料件(12)上的吸引力减小,作用磁体阵列(23)上的排斥力调节为使得作用在杠杆(20)上的力的总和为稍微排斥。然后,该马达(19)能够将该载体导轨(3、5)轻柔地安置在辊(4、6)上。为了从该载体(2)上释放该夹持器(21),朝向该定子而作用在该载体上的吸引力通过在邻近于铁磁材料件(12)的线圈(10)中的反向电流而增大。在作用在磁体阵列(23)上的排斥力的支持下,马达(19)能够将夹持器移离该载体。该载体准备好由该直线马达输送至下一处理站中,且该提升夹持器准备好接收在另一路线中等候的下一载体。磁体阵列(22、23)的磁力能够由线圈轭铁(25)上的附加线圈来维持和调节。
上述提升模块的优点是:
产生颗粒的危险较低——在载体和夹持器之间没有金属接触,将载体和夹持器平滑安置就位,只有磁力来保持该载体;
机构简单——为了输送只需要转180度,且没有用于夹持的活动机构;
由于具有低加速质量而能快速操作;
与直接直线驱动构思相容;
当断电时不会使载体跌落——保持力通过永磁体来提供。

Claims (12)

1.一种基底处理系统,用于在真空中处理基片,该系统包括:
第一直线组的处理模块(14);
第二直线组的处理模块,第二组处理模块堆叠在第一组处理模块(14)的上方;
至少一个提升模块(18),能够进行从第一组至第二组的输送;
穿过第一和第二组处理模块的运行路径;
沿所述运行路径布置的直线同步马达;
具有导轨(3、5)的至少一个基片载体,所述载体处于竖向方位上并可沿所述运行路径移动;
用于所述基片载体的输送系统,其具有安装在该处理模块中的下排辊(4)和上排辊(6);
所述辊(4、6)与所述基片载体(2)的导轨(3、5)相互作用,且所述直线同步马达的吸引力将该载体保持在竖向位置。
2.根据权利要求1所述的基片处理系统,其中,闸阀布置在各处理模块之间。
3.根据前述任意一项权利要求所述的基片处理系统,其中,所述辊(4、6)安装在真空腔室(7)中并处在侧壁处。
4.根据前述任意一项权利要求所述的基片处理系统,其中,所述下排辊(3)中的辊具有“哥特弧”横截面,且相邻的导轨(4)具有圆形形状。
5.根据前述任意一项权利要求所述的基片处理系统,其中,所述上排辊(5)中的辊具有稍微凸起的形状,且相邻的导轨(6)为矩形。
6.根据前述任意一项权利要求所述的基片处理系统,其中,该直线同步马达的定子部分具有轭铁(8)、磁体(9)和线圈(10)的混合布局。
7.根据前述任意一项权利要求所述的基片处理系统,其中,所述基片载体装备有至少两个间隔开的铁磁材料件(12)。
8.根据前述任意一项权利要求所述的基片处理系统,其中,所述直线同步马达的定子部分安装在大气中并处于不锈钢槽(11)中。
9.根据前述任意一项权利要求所述的基片处理系统,其中,所述提升模块包括旋转直接驱动马达(19)、杠杆(2)和提升夹持器盒(21)。
10.根据权利要求9所述的基片处理系统,其中:所述提升夹持器盒包括具有磁体(24)和轭铁(25)组件的吸引阵列和排斥阵列(22、23)。
11.一种用于真空处理系统中的输送系统,包括:
至少一个真空腔室,沿穿过所述腔室的运行路径布置有直线同步马达;
安装在所述真空腔室的侧壁处的下排辊(4)和上排辊(6);
具有导轨(3、5)的至少一个基片载体(2),所述载体处于竖向方位上并可沿所述运行路径移动;
所述辊与所述基片载体的导轨相互作用,且所述直线同步马达的吸引力将该载体保持在竖向位置。
12.一种用于在如权利要求1所述的基片处理系统中制造硬磁盘的方法,包括以下步骤:
将要处理的基片引导入所述基片处理系统中;
利用基片载体来保持所述基片;
沿穿过至少一个处理模块的运行路径移动所述载体和基片;
在至少一个处理模块中处理所述基片;
在处理后从所述载体上卸载所述基片;以及
将所述基片从所述基片处理系统中取出。
CNB2005800306020A 2004-09-10 2005-09-07 基片处理系统 Expired - Fee Related CN100550286C (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101483145B (zh) * 2007-11-12 2012-09-26 因特瓦克公司 升降机线性马达驱动

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0419269D0 (en) * 2004-08-31 2004-09-29 Elam T Ltd Electroluminescent materials and devices
WO2009053435A1 (en) * 2007-10-24 2009-04-30 Oc Oerlikon Balzers Ag Method for manufacturing workpieces and apparatus
JP5318434B2 (ja) * 2008-02-28 2013-10-16 昭和電工株式会社 磁気記録媒体の製造装置および製造方法
JP5248141B2 (ja) * 2008-02-27 2013-07-31 昭和電工株式会社 磁気記録媒体の製造装置および製造方法
US20110014363A1 (en) * 2008-02-27 2011-01-20 Showa Denko K.K. Apparatus and method for manufacturing magnetic recording medium
JP5150387B2 (ja) * 2008-06-27 2013-02-20 昭和電工株式会社 インライン式成膜装置及び磁気記録媒体の製造方法
JP5264549B2 (ja) * 2009-02-20 2013-08-14 昭和電工株式会社 インライン式成膜装置及び磁気記録媒体の製造方法
US8911554B2 (en) 2010-01-05 2014-12-16 Applied Materials, Inc. System for batch processing of magnetic media
CN104471697B (zh) 2011-12-27 2018-03-16 因特瓦克公司 用于组合式静态和经过处理的系统体系结构
JP2013175277A (ja) * 2013-05-27 2013-09-05 Showa Denko Kk 磁気記録媒体の製造装置および製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6115557A (ja) * 1984-06-30 1986-01-23 Toshiba Corp 浮上式搬送装置
US4670126A (en) * 1986-04-28 1987-06-02 Varian Associates, Inc. Sputter module for modular wafer processing system
US4717461A (en) * 1986-09-15 1988-01-05 Machine Technology, Inc. System and method for processing workpieces
US5170714A (en) * 1988-06-13 1992-12-15 Asahi Glass Company, Ltd. Vacuum processing apparatus and transportation system thereof
DE4029905C2 (de) * 1990-09-21 1993-10-28 Leybold Ag Vorrichtung für den Transport von Substraten
US5215420A (en) * 1991-09-20 1993-06-01 Intevac, Inc. Substrate handling and processing system
US5275709A (en) * 1991-11-07 1994-01-04 Leybold Aktiengesellschaft Apparatus for coating substrates, preferably flat, more or less plate-like substrates
DE9407482U1 (de) * 1994-05-05 1994-10-06 Balzers und Leybold Deutschland Holding AG, 63450 Hanau Funktionseinrichtung für eine Vakuumanlage für die Behandlung von scheibenförmigen Werkstücken
US5543022A (en) * 1995-01-17 1996-08-06 Hmt Technology Corporation Disc-handling apparatus
JP3732250B2 (ja) * 1995-03-30 2006-01-05 キヤノンアネルバ株式会社 インライン式成膜装置
US5705044A (en) * 1995-08-07 1998-01-06 Akashic Memories Corporation Modular sputtering machine having batch processing and serial thin film sputtering
US5879128A (en) * 1996-07-24 1999-03-09 Applied Materials, Inc. Lift pin and support pin apparatus for a processing chamber
US6053687A (en) * 1997-09-05 2000-04-25 Applied Materials, Inc. Cost effective modular-linear wafer processing
US6206176B1 (en) * 1998-05-20 2001-03-27 Applied Komatsu Technology, Inc. Substrate transfer shuttle having a magnetic drive
US6083566A (en) * 1998-05-26 2000-07-04 Whitesell; Andrew B. Substrate handling and processing system and method
US6919001B2 (en) * 2000-05-01 2005-07-19 Intevac, Inc. Disk coating system
JP2002068476A (ja) * 2000-08-29 2002-03-08 Anelva Corp 磁気搬送装置
US6520315B1 (en) * 2000-10-26 2003-02-18 Applied Materials, Inc. Gripper assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101483145B (zh) * 2007-11-12 2012-09-26 因特瓦克公司 升降机线性马达驱动
US9633880B2 (en) 2007-11-12 2017-04-25 Intevac, Inc. Elevator linear motor drive

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