CN101003690B - 散热绝缘性树脂组合物及使用其的印刷电路板 - Google Patents

散热绝缘性树脂组合物及使用其的印刷电路板 Download PDF

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Publication number
CN101003690B
CN101003690B CN2007100009877A CN200710000987A CN101003690B CN 101003690 B CN101003690 B CN 101003690B CN 2007100009877 A CN2007100009877 A CN 2007100009877A CN 200710000987 A CN200710000987 A CN 200710000987A CN 101003690 B CN101003690 B CN 101003690B
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Prior art keywords
resin composition
meth
printed circuit
circuit board
heat dissipation
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Chinese (zh)
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CN101003690A (zh
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大胡义和
宇敷滋
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Taiyo Holdings Co Ltd
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Taiyo Ink Mfg Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
CN2007100009877A 2006-01-17 2007-01-17 散热绝缘性树脂组合物及使用其的印刷电路板 Active CN101003690B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006009196A JP5089885B2 (ja) 2006-01-17 2006-01-17 放熱絶縁性樹脂組成物、及びそれを用いたプリント配線板
JP2006-009196 2006-01-17
JP2006009196 2006-01-17

Publications (2)

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CN101003690A CN101003690A (zh) 2007-07-25
CN101003690B true CN101003690B (zh) 2010-04-07

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CN2007100009877A Active CN101003690B (zh) 2006-01-17 2007-01-17 散热绝缘性树脂组合物及使用其的印刷电路板

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Country Link
JP (1) JP5089885B2 (enrdf_load_stackoverflow)
KR (1) KR100849585B1 (enrdf_load_stackoverflow)
CN (1) CN101003690B (enrdf_load_stackoverflow)
TW (1) TW200746935A (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5918699B2 (ja) * 2010-12-20 2016-05-18 株式会社ダイセル 硬化性エポキシ樹脂組成物及びこれを使用した光半導体装置
JP6024265B2 (ja) * 2011-10-14 2016-11-16 Jnc株式会社 放熱塗料組成物とそれを用いた放熱部材
JP6149498B2 (ja) * 2013-05-10 2017-06-21 パナソニックＩｐマネジメント株式会社 紫外線硬化性シート材料、紫外線硬化性ドライフィルム、紫外線硬化性ビルドアップ用絶縁材料
KR101687394B1 (ko) 2013-06-17 2016-12-16 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트
JP6349543B2 (ja) * 2013-12-25 2018-07-04 パナソニックＩｐマネジメント株式会社 冷却構造体および冷却構造体の製造方法
CN107075258B (zh) * 2014-10-01 2020-03-06 纳美仕有限公司 树脂组合物
KR101792755B1 (ko) 2014-10-28 2017-11-01 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트
JP6941810B2 (ja) * 2017-04-19 2021-09-29 パナソニックＩｐマネジメント株式会社 樹脂組成物ならびにそれを用いた電子部品および電子機器
JP7142453B2 (ja) * 2018-03-30 2022-09-27 太陽インキ製造株式会社 放熱絶縁性樹脂組成物、及びそれを用いたプリント配線板
CN112823188B (zh) * 2018-11-20 2023-08-11 太阳控股株式会社 高耐电压散热绝缘性树脂组合物和使用其的电子部件

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01109753A (ja) * 1987-10-23 1989-04-26 Hitachi Ltd 半導体装置
JPH0362844A (ja) * 1989-02-27 1991-03-18 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JPH06167806A (ja) * 1992-11-30 1994-06-14 Sony Corp ソルダーレジストインキ組成物及びこれを用いたプリント配線基板
JPH0841294A (ja) * 1994-07-27 1996-02-13 Shin Etsu Chem Co Ltd 絶縁性樹脂ペースト及び半導体装置
KR100201223B1 (ko) 1996-09-16 1999-06-15 조규삼 원적외선 방사 열경화성 입상 수지 조성물
JP2002179763A (ja) 2000-11-28 2002-06-26 Sumitomo Bakelite Singapore Pte Ltd エポキシ樹脂組成物
JP2004027004A (ja) * 2002-06-25 2004-01-29 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2004217861A (ja) * 2003-01-17 2004-08-05 Hitachi Chem Co Ltd 耐熱性接着剤ならびにこの接着剤を用いた積層物、接着剤付き放熱板および接着剤付金属箔
JP2004256687A (ja) * 2003-02-26 2004-09-16 Polymatech Co Ltd 熱伝導性反応硬化型樹脂成形体及びその製造方法
JP4250996B2 (ja) * 2003-03-28 2009-04-08 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP2005002283A (ja) * 2003-06-13 2005-01-06 Sekisui Chem Co Ltd 熱伝導性組成物及びプラズマディスプレイ表示装置

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP特开2001-348488A 2001.12.18 *
JP特开2003-268076A 2003.09.25 *
JP特开平9-207270A 1997.08.12 *

Also Published As

Publication number Publication date
CN101003690A (zh) 2007-07-25
TW200746935A (en) 2007-12-16
JP5089885B2 (ja) 2012-12-05
TWI357783B (enrdf_load_stackoverflow) 2012-02-01
KR20070076506A (ko) 2007-07-24
KR100849585B1 (ko) 2008-07-31
JP2007191519A (ja) 2007-08-02

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Application publication date: 20070725

Assignee: TAIYO INK (SUZHOU) Co.,Ltd.

Assignor: TAIYO HOLDINGS Co.,Ltd.

Contract record no.: 2011990000116

Denomination of invention: Heat radiation insulation resin composition and printing circuit board using same

Granted publication date: 20100407

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