CN100587110C - 用于在绝缘基底上沉积金属的具有可调节粘度的光敏分散体和其用途 - Google Patents
用于在绝缘基底上沉积金属的具有可调节粘度的光敏分散体和其用途 Download PDFInfo
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- CN100587110C CN100587110C CN200380108171A CN200380108171A CN100587110C CN 100587110 C CN100587110 C CN 100587110C CN 200380108171 A CN200380108171 A CN 200380108171A CN 200380108171 A CN200380108171 A CN 200380108171A CN 100587110 C CN100587110 C CN 100587110C
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- dispersion
- weight percent
- percent concentration
- salt
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000006185 dispersion Substances 0.000 title claims abstract description 68
- 239000000758 substrate Substances 0.000 title claims abstract description 24
- 238000001465 metallisation Methods 0.000 title abstract description 10
- 239000000203 mixture Substances 0.000 claims abstract description 38
- 239000000049 pigment Substances 0.000 claims abstract description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229920000642 polymer Polymers 0.000 claims abstract description 16
- 239000003960 organic solvent Substances 0.000 claims abstract description 14
- 239000007788 liquid Substances 0.000 claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 9
- 150000003839 salts Chemical class 0.000 claims abstract description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 26
- 239000003352 sequestering agent Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 229910052763 palladium Inorganic materials 0.000 claims description 13
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical group O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 12
- 239000000839 emulsion Substances 0.000 claims description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 8
- 239000003513 alkali Substances 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 6
- 239000002585 base Substances 0.000 claims description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 6
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical group Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 238000007670 refining Methods 0.000 claims description 6
- 239000004408 titanium dioxide Substances 0.000 claims description 6
- 239000000080 wetting agent Substances 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 5
- 150000001735 carboxylic acids Chemical class 0.000 claims description 5
- 229910052723 transition metal Inorganic materials 0.000 claims description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 150000001447 alkali salts Chemical class 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- SYSQUGFVNFXIIT-UHFFFAOYSA-N n-[4-(1,3-benzoxazol-2-yl)phenyl]-4-nitrobenzenesulfonamide Chemical class C1=CC([N+](=O)[O-])=CC=C1S(=O)(=O)NC1=CC=C(C=2OC3=CC=CC=C3N=2)C=C1 SYSQUGFVNFXIIT-UHFFFAOYSA-N 0.000 claims description 4
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 4
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 230000002468 redox effect Effects 0.000 claims description 4
- -1 transition metal salt Chemical class 0.000 claims description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 239000010953 base metal Substances 0.000 claims description 3
- 229910052793 cadmium Inorganic materials 0.000 claims description 3
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 229960003280 cupric chloride Drugs 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910052703 rhodium Inorganic materials 0.000 claims description 3
- 239000010948 rhodium Substances 0.000 claims description 3
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052707 ruthenium Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 claims description 2
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 claims description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910021529 ammonia Inorganic materials 0.000 claims description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 2
- 239000008367 deionised water Substances 0.000 claims description 2
- 229910021641 deionized water Inorganic materials 0.000 claims description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 2
- 125000001033 ether group Chemical group 0.000 claims description 2
- 150000002576 ketones Chemical class 0.000 claims description 2
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical group [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 claims description 2
- 229940095064 tartrate Drugs 0.000 claims description 2
- 150000003624 transition metals Chemical class 0.000 claims description 2
- 229910010413 TiO 2 Inorganic materials 0.000 claims 2
- 150000007514 bases Chemical class 0.000 abstract 1
- 238000009472 formulation Methods 0.000 abstract 1
- 230000033116 oxidation-reduction process Effects 0.000 abstract 1
- 239000003973 paint Substances 0.000 description 13
- 238000006555 catalytic reaction Methods 0.000 description 8
- 239000000243 solution Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 230000002349 favourable effect Effects 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 230000003197 catalytic effect Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229920002313 fluoropolymer Polymers 0.000 description 4
- 239000004811 fluoropolymer Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000003945 anionic surfactant Substances 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000008187 granular material Substances 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- BOKGTLAJQHTOKE-UHFFFAOYSA-N 1,5-dihydroxynaphthalene Chemical compound C1=CC=C2C(O)=CC=CC2=C1O BOKGTLAJQHTOKE-UHFFFAOYSA-N 0.000 description 2
- 206010034972 Photosensitivity reaction Diseases 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000005844 autocatalytic reaction Methods 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 238000003618 dip coating Methods 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009996 mechanical pre-treatment Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000036211 photosensitivity Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 235000017550 sodium carbonate Nutrition 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 230000002508 compound effect Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 235000012204 lemonade/lime carbonate Nutrition 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000001457 metallic cations Chemical class 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 150000002940 palladium Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Substances [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 1
- 235000015320 potassium carbonate Nutrition 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
- C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Paints Or Removers (AREA)
- Chemically Coating (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Colloid Chemistry (AREA)
- Materials For Photolithography (AREA)
- Catalysts (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
- Silicon Compounds (AREA)
- Manufacturing Of Micro-Capsules (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Formation Of Insulating Films (AREA)
Abstract
Description
Claims (31)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BE2003/0007A BE1015271A3 (fr) | 2003-01-03 | 2003-01-03 | Dispersion photosensible a viscosite ajustable pour le depot de metal sur un substrat isolant et son utilisation. |
BE2003/0007 | 2003-01-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1735712A CN1735712A (zh) | 2006-02-15 |
CN100587110C true CN100587110C (zh) | 2010-02-03 |
Family
ID=32686676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200380108171A Expired - Fee Related CN100587110C (zh) | 2003-01-03 | 2003-12-24 | 用于在绝缘基底上沉积金属的具有可调节粘度的光敏分散体和其用途 |
Country Status (19)
Country | Link |
---|---|
US (2) | US20060122297A1 (zh) |
EP (1) | EP1587967B1 (zh) |
JP (1) | JP4621505B2 (zh) |
KR (1) | KR100777033B1 (zh) |
CN (1) | CN100587110C (zh) |
AT (1) | ATE325907T1 (zh) |
AU (1) | AU2003289778B2 (zh) |
BE (1) | BE1015271A3 (zh) |
BR (1) | BR0317897B1 (zh) |
CA (1) | CA2512202C (zh) |
DE (1) | DE60305213T2 (zh) |
DK (1) | DK1587967T3 (zh) |
ES (1) | ES2261991T3 (zh) |
IL (1) | IL169463A (zh) |
MX (1) | MXPA05007256A (zh) |
PT (1) | PT1587967E (zh) |
RU (1) | RU2301846C2 (zh) |
WO (1) | WO2004061157A1 (zh) |
ZA (1) | ZA200505512B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111575097A (zh) * | 2020-06-15 | 2020-08-25 | 清华大学 | 具有光致变粘度的溶液及调控流体粘度的方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009056348A (ja) * | 2007-08-30 | 2009-03-19 | Sumitomo Chemical Co Ltd | 光触媒分散液 |
RU2462537C2 (ru) * | 2010-11-11 | 2012-09-27 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования Санкт-Петербургский государственный университет | Раствор для лазерно-индуцированной металлизации диэлектриков и способ лазерно-индуцированной металлизации диэлектриков с его использованием |
JP2013000673A (ja) * | 2011-06-17 | 2013-01-07 | National Institute Of Advanced Industrial Science & Technology | 光触媒高機能化技術 |
RU2491306C2 (ru) * | 2011-07-20 | 2013-08-27 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный университет тонких химических технологий имени М.В. Ломоносова" (МИТХТ им. М.В.Ломоносова) | Резиновые смеси на основе диеновых и этиленпропиленовых каучуков, наполненные белой сажей |
US10049881B2 (en) * | 2011-08-10 | 2018-08-14 | Applied Materials, Inc. | Method and apparatus for selective nitridation process |
JPWO2014017575A1 (ja) * | 2012-07-26 | 2016-07-11 | 株式会社サクラクレパス | 光触媒塗布液およびその製造方法並びに光触媒体 |
DE102013114572A1 (de) | 2013-12-19 | 2015-06-25 | Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh | Verfahren zur Herstellung strukturierter metallischer Beschichtungen |
CN104329597B (zh) * | 2014-09-10 | 2016-11-23 | 广东中塑新材料有限公司 | 一种无基板led灯及其制备方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1157302A (zh) * | 1995-11-30 | 1997-08-20 | 伊斯曼柯达公司 | 用于辐射敏感材料的聚集染料 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3719490A (en) * | 1967-07-13 | 1973-03-06 | Eastman Kodak Co | Photosensitive element containing a photoreducible palladium compound and the use thereof in physical development |
US3950290A (en) * | 1973-05-01 | 1976-04-13 | A. E. Staley Manufacturing Company | Aqueous coating and printing compositions |
JPS60155678A (ja) * | 1984-01-24 | 1985-08-15 | Toshiba Corp | 金属イオンの還元方法 |
JPS60195077A (ja) * | 1984-03-16 | 1985-10-03 | 奥野製薬工業株式会社 | セラミツクスの無電解めつき用触媒組成物 |
JPS62109393A (ja) * | 1985-11-07 | 1987-05-20 | カルソニックカンセイ株式会社 | 電気回路基板製造方法 |
JPH02205388A (ja) * | 1989-02-03 | 1990-08-15 | Hitachi Chem Co Ltd | 半導体光触媒を用いた無電解めっきによるプリント回路の製造法 |
US5075039A (en) * | 1990-05-31 | 1991-12-24 | Shipley Company Inc. | Platable liquid film forming coating composition containing conductive metal sulfide coated inert inorganic particles |
US5405879A (en) * | 1991-04-05 | 1995-04-11 | Nippon Carbide Kogyo Kabushiki Kaisha | Aqueous dispersion of acrylic polymer |
US5264466A (en) * | 1992-05-28 | 1993-11-23 | Showa Highpolymer Co., Ltd. | Stainproofing paint composition and method for producing same |
BE1007879A3 (fr) * | 1994-01-05 | 1995-11-07 | Blue Chips Holding | Resine polymerique a viscosite ajustable pour le depot de palladium catalytique sur un substrat, son procede de preparation et son utilisation. |
EP0756609A4 (en) * | 1994-04-19 | 1998-12-02 | Univ Lehigh | PRINTING INK COMPOSITIONS, METHODS OF MAKING AND USES THEREOF |
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US6291025B1 (en) * | 1999-06-04 | 2001-09-18 | Argonide Corporation | Electroless coatings formed from organic liquids |
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2003
- 2003-01-03 BE BE2003/0007A patent/BE1015271A3/fr not_active IP Right Cessation
- 2003-12-24 US US10/541,210 patent/US20060122297A1/en not_active Abandoned
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CN111575097A (zh) * | 2020-06-15 | 2020-08-25 | 清华大学 | 具有光致变粘度的溶液及调控流体粘度的方法 |
Also Published As
Publication number | Publication date |
---|---|
ZA200505512B (en) | 2007-02-28 |
EP1587967B1 (fr) | 2006-05-10 |
BE1015271A3 (fr) | 2004-12-07 |
IL169463A (en) | 2009-12-24 |
CA2512202C (fr) | 2010-11-09 |
AU2003289778B2 (en) | 2009-06-04 |
MXPA05007256A (es) | 2005-09-08 |
DE60305213T2 (de) | 2007-03-01 |
US20090017221A1 (en) | 2009-01-15 |
RU2005124683A (ru) | 2006-02-10 |
ATE325907T1 (de) | 2006-06-15 |
DK1587967T3 (da) | 2006-08-28 |
CN1735712A (zh) | 2006-02-15 |
US20060122297A1 (en) | 2006-06-08 |
JP4621505B2 (ja) | 2011-01-26 |
RU2301846C2 (ru) | 2007-06-27 |
BR0317897A (pt) | 2005-12-06 |
PT1587967E (pt) | 2006-08-31 |
BR0317897B1 (pt) | 2012-07-10 |
CA2512202A1 (fr) | 2004-07-22 |
DE60305213D1 (de) | 2006-06-14 |
US7731786B2 (en) | 2010-06-08 |
AU2003289778A1 (en) | 2004-07-29 |
WO2004061157A1 (fr) | 2004-07-22 |
KR100777033B1 (ko) | 2007-11-16 |
KR20050089087A (ko) | 2005-09-07 |
EP1587967A1 (fr) | 2005-10-26 |
ES2261991T3 (es) | 2006-11-16 |
JP2006515388A (ja) | 2006-05-25 |
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