CN100575536C - 用于蒸发锂的混合物 - Google Patents

用于蒸发锂的混合物 Download PDF

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Publication number
CN100575536C
CN100575536C CN200580021281A CN200580021281A CN100575536C CN 100575536 C CN100575536 C CN 100575536C CN 200580021281 A CN200580021281 A CN 200580021281A CN 200580021281 A CN200580021281 A CN 200580021281A CN 100575536 C CN100575536 C CN 100575536C
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CN
China
Prior art keywords
lithium
mixture
dispenser
evaporation
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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CN200580021281A
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English (en)
Chinese (zh)
Other versions
CN1981066A (zh
Inventor
L·卡塔尼奥
S·皮罗拉
C·梅达
A·伯纳希
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SAES Getters SpA
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SAES Getters SpA
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Publication of CN1981066A publication Critical patent/CN1981066A/zh
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/18—Metallic material, boron or silicon on other inorganic substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/30—Doping active layers, e.g. electron transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063—Nonparticulate metal component
    • Y10T428/12104—Particles discontinuous
    • Y10T428/12111—Separated by nonmetal matrix or binder [e.g., welding electrode, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
CN200580021281A 2004-09-10 2005-09-06 用于蒸发锂的混合物 Expired - Lifetime CN100575536C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT001736A ITMI20041736A1 (it) 2004-09-10 2004-09-10 Miscele per l'evaporazione del litio e dispensatori di litio
ITMI2004A001736 2004-09-10

Publications (2)

Publication Number Publication Date
CN1981066A CN1981066A (zh) 2007-06-13
CN100575536C true CN100575536C (zh) 2009-12-30

Family

ID=35448266

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200580021281A Expired - Lifetime CN100575536C (zh) 2004-09-10 2005-09-06 用于蒸发锂的混合物

Country Status (8)

Country Link
US (2) US7625505B2 (enExample)
EP (1) EP1786946B1 (enExample)
JP (1) JP4804469B2 (enExample)
KR (1) KR101195634B1 (enExample)
CN (1) CN100575536C (enExample)
IT (1) ITMI20041736A1 (enExample)
TW (1) TWI388501B (enExample)
WO (1) WO2006027814A2 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20042279A1 (it) 2004-11-24 2005-02-24 Getters Spa Sistema dispensatore di metalli alcalini in grado di dispensare quantita' elevate di metalli
ITMI20070301A1 (it) 2007-02-16 2008-08-17 Getters Spa Supporti comprendenti materiali getter e sorgenti di metalli alcalini o alcalino-terrosi per sistemi di termoregolazione basati su effetto tunnel
AU2008310584A1 (en) * 2007-10-12 2009-04-16 University Of Delaware Thermal evaporation sources for wide-area deposition
US9339869B2 (en) 2011-10-26 2016-05-17 Konstantin Chuntonov Apparatus and method for droplet casting of reactive alloys and applications
ITMI20112051A1 (it) * 2011-11-11 2013-05-12 Getters Spa Composizione organico-inorganica per il rilascio in fase vapore di metalli alcalini ed alcalino-terrosi
ITMI20131171A1 (it) * 2013-07-11 2015-01-11 Getters Spa Erogatore migliorato di vapori metallici
KR102094142B1 (ko) * 2013-08-30 2020-03-27 엘지디스플레이 주식회사 유기전계 발광소자 제조방법
US9876188B2 (en) 2013-12-27 2018-01-23 Pioneer Corporation Light emitting element and method of manufacturing light emitting element
WO2015133275A1 (ja) 2014-03-06 2015-09-11 シャープ株式会社 混合材料、その製造方法、及びそれを用いた有機素子
KR102231490B1 (ko) * 2014-09-02 2021-03-25 삼성디스플레이 주식회사 유기 전계 발광 소자
US10886095B2 (en) * 2016-01-08 2021-01-05 Photonis Netherlands B.V. Image intensifier for night vision device
JP7037493B2 (ja) 2016-03-08 2022-03-16 テラパワー， エルエルシー ゲッター素子およびゲッター素子の製造方法
CN207038182U (zh) 2017-03-29 2018-02-23 泰拉能源有限责任公司 铯收集器
CN107523793B (zh) * 2017-08-23 2019-06-07 京东方科技集团股份有限公司 一种金属锂蒸发装置、蒸镀设备及金属锂蒸发方法
US11626213B2 (en) * 2019-08-23 2023-04-11 Terrapower, Llc Sodium vaporizer and methods
US11185915B2 (en) 2019-08-30 2021-11-30 Applied Materials, Inc. Deposition of reactive metals with protection layer for high volume manufacturing
CN115125491A (zh) * 2022-06-15 2022-09-30 北方夜视技术股份有限公司 一种多碱光电阴极制备用碱源的蒸发特性测量的方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3578834A (en) * 1966-12-13 1971-05-18 Getters Spa Generation of alkali metals
CN1516249A (zh) * 2003-01-09 2004-07-28 友达光电股份有限公司 一种薄膜晶体管的制作方法

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US2424512A (en) * 1944-08-08 1947-07-22 Nat Res Corp Production of alkali metals and their oxides
US2948635A (en) * 1959-01-12 1960-08-09 Gen Electric Phosphor evaporation method and apparatus
US3096211A (en) * 1959-03-31 1963-07-02 Emi Ltd Alkali metal generators
NL6913693A (enExample) 1968-09-13 1970-03-17
US3658713A (en) * 1968-11-12 1972-04-25 Tokyo Shibaura Electric Co Alkali metal generating agents
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US3742185A (en) * 1971-05-07 1973-06-26 Lincoln Electric Co Lithium containing welding electrode
NL7802116A (nl) * 1977-03-14 1978-09-18 Getters Spa Alkalimetaaldampgenerator.
IT1115156B (it) * 1979-04-06 1986-02-03 Getters Spa Leghe zr-fe per l'assorbimento di idrogeno a basse temperature
US4233936A (en) 1979-05-08 1980-11-18 Rca Corporation Alkali metal dispenser
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US5543021A (en) * 1994-09-01 1996-08-06 Le Carbone Lorraine Negative electrode based on pre-lithiated carbonaceous material for a rechargeable electrochemical lithium generator
JPH0978058A (ja) 1995-09-08 1997-03-25 Pioneer Electron Corp 有機エレクトロルミネッセンス素子
US5636302A (en) 1995-10-18 1997-06-03 General Electric Company Injection chamber for high power optical fiber transmission
US6255774B1 (en) 1996-09-04 2001-07-03 Cambridge Display Technology, Ltd. Multilayer cathode for organic light-emitting device
DE69723538T2 (de) 1996-11-29 2004-06-09 Idemitsu Kosan Co. Ltd. Organisches elektrolumineszentes Bauteil
JPH10270171A (ja) 1997-01-27 1998-10-09 Junji Kido 有機エレクトロルミネッセント素子
JP3266573B2 (ja) 1998-04-08 2002-03-18 出光興産株式会社 有機エレクトロルミネッセンス素子
US6312565B1 (en) * 2000-03-23 2001-11-06 Agere Systems Guardian Corp. Thin film deposition of mixed metal oxides
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ITMI20010995A1 (it) 2001-05-15 2002-11-15 Getters Spa Dispensatori di cesio e processo per il loro uso
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EP1521286A4 (en) * 2003-01-17 2006-12-13 Hamamatsu Photonics Kk ALKALI METAL GENERATING AGENT, ALKALI METAL GENERATOR, PHOTOELECTRIC SURFACE, SECONDARY ELECTRON EMITTING SURFACE, ELECTRONIC TUBE, PHOTOELECTRIC SURFACE MANUFACTURING METHOD, SECONDARY ELECTRON EMISSION SURFACE MANUFACTURING METHOD, AND METHOD OF MANUFACTURING THE SAME
US20060152154A1 (en) 2003-01-17 2006-07-13 Hiroyuki Sugiyama Alkali metal generating agent, alkali metal generator, photoelectric surface, secondary electron emission surface, electron tube, method for manufacturing photoelectric surface, method for manufacturing secondary electron emission surface, and method for manufacturing electron tube
WO2004066339A1 (ja) 2003-01-17 2004-08-05 Hamamatsu Photonics K.K. アルカリ金属発生剤、アルカリ金属発生器、光電面、二次電子放出面、電子管、光電面の製造方法、二次電子放出面の製造方法及び電子管の製造方法
JP3938147B2 (ja) * 2003-04-08 2007-06-27 住友金属鉱山株式会社 タンタル酸リチウム基板およびその製造方法
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ITMI20042279A1 (it) 2004-11-24 2005-02-24 Getters Spa Sistema dispensatore di metalli alcalini in grado di dispensare quantita' elevate di metalli

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3578834A (en) * 1966-12-13 1971-05-18 Getters Spa Generation of alkali metals
CN1516249A (zh) * 2003-01-09 2004-07-28 友达光电股份有限公司 一种薄膜晶体管的制作方法

Also Published As

Publication number Publication date
US7625505B2 (en) 2009-12-01
EP1786946B1 (en) 2014-02-26
HK1105538A1 (zh) 2008-02-15
TW200621638A (en) 2006-07-01
JP4804469B2 (ja) 2011-11-02
KR101195634B1 (ko) 2012-10-30
US20100021623A1 (en) 2010-01-28
EP1786946A2 (en) 2007-05-23
ITMI20041736A1 (it) 2004-12-10
JP2008512570A (ja) 2008-04-24
US20080042102A1 (en) 2008-02-21
CN1981066A (zh) 2007-06-13
KR20070050920A (ko) 2007-05-16
US7794630B2 (en) 2010-09-14
WO2006027814A2 (en) 2006-03-16
WO2006027814A3 (en) 2006-05-18
TWI388501B (zh) 2013-03-11

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